Polymeric layer used for special processing

Industry

CPC
H05K2201/0166

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0166Polymeric layer used for special processing

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic component embedded substrate
- Patent number 12,114,428
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate, wiring board, and copper foil provided with r...
- Patent number 11,895,770
- Issue date Feb 6, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Etching method for manufacturing substrate structure having thick e...
- Patent number 11,895,778
- Issue date Feb 6, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Shih-Hsi Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wearable bands with embedded circuitry
- Patent number 11,442,503
- Issue date Sep 13, 2022
- Apple Inc.
- Yung-Yu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Aliphatic polycarbonate resin for forming partition, partition mate...
- Patent number 11,142,611
- Issue date Oct 12, 2021
- Sumitomo Seika Chemicals Co., Ltd.
- Kiyoshi Nishioka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid solder resist composition and covered-printed wiring board
- Patent number 10,527,937
- Issue date Jan 7, 2020
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for manufacturing structure having recessed pattern, resin c...
- Patent number 10,392,699
- Issue date Aug 27, 2019
- JSR Corporation
- Hitoshi Hamaguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fingerprint identification module and mobile electronic device with...
- Patent number 10,354,112
- Issue date Jul 16, 2019
- Primax Electronics Ltd.
- Mao-Hsiu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder resist composition, and covered-printed wiring board
- Patent number 10,151,976
- Issue date Dec 11, 2018
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 10,136,521
- Issue date Nov 20, 2018
- Dexerials Corporation
- Makiya Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Build-up high-aspect ratio opening
- Patent number 10,111,338
- Issue date Oct 23, 2018
- Intel Corporation
- Frank Truong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid solder resist composition and covered-printed wiring board
- Patent number 9,835,944
- Issue date Dec 5, 2017
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for manufacturing substrate having concave pattern, composit...
- Patent number 9,746,775
- Issue date Aug 29, 2017
- JSR Corporation
- Hitoshi Hamaguchi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Substrate and assembly thereof with dielectric removal for increase...
- Patent number 9,666,450
- Issue date May 30, 2017
- Tessera, Inc.
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and assembly thereof with dielectric removal for increase...
- Patent number 9,318,460
- Issue date Apr 19, 2016
- Tessera, Inc.
- Kazuo Sakuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photocurable/thermosetting resin composition
- Patent number 9,310,680
- Issue date Apr 12, 2016
- TAIYO INK MFG. CO., LTD.
- Nobuhito Ito
- B32 - LAYERED PRODUCTS
Information Patent Grant
Passive electrical devices and methods of fabricating passive elect...
- Patent number 8,866,018
- Issue date Oct 21, 2014
- Oak-Mitsui Technologies LLC
- Pranabes K. Pramanik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,756,804
- Issue date Jun 24, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wet etched insulator and electronic circuit component
- Patent number 8,308,967
- Issue date Nov 13, 2012
- Dai Nippon Printing Co., Ltd.
- Katsuya Sakayori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with improved via design
- Patent number 8,258,411
- Issue date Sep 4, 2012
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for display device and method of manufacturing the same
- Patent number 8,241,735
- Issue date Aug 14, 2012
- Nitto Denko Corporation
- Takeshi Murashige
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing method of circuit structure
- Patent number 8,161,638
- Issue date Apr 24, 2012
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a circuit board with improved via design
- Patent number 8,141,245
- Issue date Mar 27, 2012
- PPG Industries Ohio, Inc.
- Kevin C. Olson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiber product coated with particles to adjust the friction of the c...
- Patent number 8,105,690
- Issue date Jan 31, 2012
- PPG Industries Ohio, Inc.
- Ernest L. Lawton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sheet, circuit device and method of manufacturing the same
- Patent number 8,084,301
- Issue date Dec 27, 2011
- Sanyo Electric Co., Ltd.
- Katsuyoshi Mino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of printed circuit board and printed circuit boa...
- Patent number 8,075,788
- Issue date Dec 13, 2011
- Hitachiviamechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a flexible printed circuit board
- Patent number 7,992,290
- Issue date Aug 9, 2011
- Hon Hai Precision Industry Co., Ltd.
- Ying-Lin Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-volatile memory with reduced mobile ion diffusion
- Patent number 7,944,029
- Issue date May 17, 2011
- SanDisk Corporation
- Xiaoyu Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming a printed circuit board with improved via design
- Patent number 7,690,103
- Issue date Apr 6, 2010
- PPG Industries Ohio, Inc.
- Alan E. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240182614
- Publication date Jun 6, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masashi KODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20230303750
- Publication date Sep 28, 2023
- Showa Denko Materials Co., Ltd.
- Kohei OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE HAVING THICK E...
- Publication number 20230199969
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- SHIH-HSI TAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED SUBSTRATE
- Publication number 20230108748
- Publication date Apr 6, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Yun Je JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20220071004
- Publication date Mar 3, 2022
- Cambrios Film Solutions Corporation
- Yung-Cheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL PROVIDED WITH R...
- Publication number 20220015230
- Publication date Jan 13, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wearable Bands With Embedded Circuitry
- Publication number 20200192423
- Publication date Jun 18, 2020
- Apple Inc.
- Yung-Yu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CREATING A CAVITY USING PLASMA GAS
- Publication number 20190373736
- Publication date Dec 5, 2019
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIPHATIC POLYCARBONATE RESIN FOR FORMING PARTITION, PARTITION MATE...
- Publication number 20190119440
- Publication date Apr 25, 2019
- Sumitomo Seika Chemicals Co., Ltd.
- Kiyoshi NISHIOKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BUILD-UP HIGH-ASPECT RATIO OPENING
- Publication number 20180270953
- Publication date Sep 20, 2018
- Intel Corporation
- Frank Truong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
- Publication number 20180059544
- Publication date Mar 1, 2018
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD
- Publication number 20170336708
- Publication date Nov 23, 2017
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170325335
- Publication date Nov 9, 2017
- DEXERIALS CORPORATION
- Makiya ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND CO...
- Publication number 20170017152
- Publication date Jan 19, 2017
- Goo Chemical Co., Ltd.
- Yoshio SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUNCTIONALIZED BORON NITRIDE MATERIALS AND METHODS FOR THEIR PREPAR...
- Publication number 20160280980
- Publication date Sep 29, 2016
- EMPIRE TECHNOLOGY DEVELOPMENT LLC
- Angele SJONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSIT...
- Publication number 20160062242
- Publication date Mar 3, 2016
- JSR CORPORATION
- Hitoshi HAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCTION OF CIRCUIT BOARD
- Publication number 20150237736
- Publication date Aug 20, 2015
- Zeon Corporation
- Takashi Iga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASE...
- Publication number 20150028480
- Publication date Jan 29, 2015
- Tessera, Inc.
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION
- Publication number 20140295148
- Publication date Oct 2, 2014
- TAMURA CORPORATION
- Koji Maekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140251657
- Publication date Sep 11, 2014
- Samsung Electro-mechanics Co., Ltd.
- Hyung Jin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOCURABLE/THERMOSETTING RESIN COMPOSITION
- Publication number 20140147776
- Publication date May 29, 2014
- TAIYO INK MFG. CO., LTD
- Nobuhito Ito
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASE...
- Publication number 20120313242
- Publication date Dec 13, 2012
- Tessera, Inc.
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120073870
- Publication date Mar 29, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120012378
- Publication date Jan 19, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING MULTI-LAYER WI...
- Publication number 20110232942
- Publication date Sep 29, 2011
- TDK Corporation
- Hiroyuki UEMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT
- Publication number 20110108519
- Publication date May 12, 2011
- DAI NIPPON PRINTING CO., LTD.
- Katsuya Sakayori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT STRUCTURE
- Publication number 20110100543
- Publication date May 5, 2011
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-VOLATILE MEMORY WITH REDUCED MOBILE ION DIFFUSION
- Publication number 20110062563
- Publication date Mar 17, 2011
- Xiaoyu Yang
- G11 - INFORMATION STORAGE
Information Patent Application
PASSIVE ELECTRICAL ARTICLE
- Publication number 20100208440
- Publication date Aug 19, 2010
- 3M Innovative Properties Company
- Joel S. Peiffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Polymeric layer used for special processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component embedded substrate

Structure for embedding and packaging multiple devices by layer and...

Copper-clad laminate, wiring board, and copper foil provided with r...

Etching method for manufacturing substrate structure having thick e...

Wearable bands with embedded circuitry

Aliphatic polycarbonate resin for forming partition, partition mate...

Liquid solder resist composition and covered-printed wiring board

Method for manufacturing structure having recessed pattern, resin c...

Fingerprint identification module and mobile electronic device with...

Solder resist composition, and covered-printed wiring board

Wiring board and method for manufacturing the same

Build-up high-aspect ratio opening

Liquid solder resist composition and covered-printed wiring board

Method for manufacturing substrate having concave pattern, composit...

Substrate and assembly thereof with dielectric removal for increase...

Substrate and assembly thereof with dielectric removal for increase...

Photocurable/thermosetting resin composition

Passive electrical devices and methods of fabricating passive elect...

Method of manufacturing printed circuit board

Wet etched insulator and electronic circuit component

Printed circuit board with improved via design

Substrate for display device and method of manufacturing the same

Manufacturing method of circuit structure

Method of forming a circuit board with improved via design

Fiber product coated with particles to adjust the friction of the c...

Resin sheet, circuit device and method of manufacturing the same

Fabrication method of printed circuit board and printed circuit boa...

Method of making a flexible printed circuit board

Non-volatile memory with reduced mobile ion diffusion

Method of forming a printed circuit board with improved via design

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

ETCHING METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE HAVING THICK E...

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

ELECTRONIC COMPONENT EMBEDDED SUBSTRATE

TRANSPARENT CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL PROVIDED WITH R...

Wearable Bands With Embedded Circuitry

CREATING A CAVITY USING PLASMA GAS

ALIPHATIC POLYCARBONATE RESIN FOR FORMING PARTITION, PARTITION MATE...

BUILD-UP HIGH-ASPECT RATIO OPENING

LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD

SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND CO...

FUNCTIONALIZED BORON NITRIDE MATERIALS AND METHODS FOR THEIR PREPAR...

METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSIT...

METHOD OF PRODUCTION OF CIRCUIT BOARD

SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASE...

PHOTOSENSITIVE RESIN COMPOSITION

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PHOTOCURABLE/THERMOSETTING RESIN COMPOSITION

SUBSTRATE AND ASSEMBLY THEREOF WITH DIELECTRIC REMOVAL FOR INCREASE...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING MULTI-LAYER WI...

WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT

MANUFACTURING METHOD OF CIRCUIT STRUCTURE

NON-VOLATILE MEMORY WITH REDUCED MOBILE ION DIFFUSION

PASSIVE ELECTRICAL ARTICLE