Porous

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CPC
H05K2201/0116

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0116Porous

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 11,997,785
- Issue date May 28, 2024
- Unimicron Technology Corp.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic printed conductors
- Patent number 11,849,540
- Issue date Dec 19, 2023
- The Governors of the University of Alberta
- Hyun-Joong Chung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Ceramic and polymer composite, methods of making, and uses thereof
- Patent number 11,490,510
- Issue date Nov 1, 2022
- Corning Incorporated
- Weiguo Miao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 11,375,611
- Issue date Jun 28, 2022
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Elastic printed conductors
- Patent number 11,343,910
- Issue date May 24, 2022
- The Governors of the University of Alberta
- Hyun-Joong Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible and durable printed circuits on stretchable and non-stretc...
- Patent number 11,330,711
- Issue date May 10, 2022
- W. L. Gore & Associates, Inc.
- Mark D. Edmundson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit board with low thermal conductivity and method o...
- Patent number 11,259,398
- Issue date Feb 22, 2022
- Magna Seating Inc
- Eric Kozlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing of nanowire films
- Patent number 11,240,917
- Issue date Feb 1, 2022
- TECHNOLOGY INNOVATION MOMENTUM FUND (ISRAEL) LIMITED PARTNERSHIP
- Gil Markovich
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board and display system
- Patent number 11,140,775
- Issue date Oct 5, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Naoyuki Senda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit assembly
- Patent number 11,122,689
- Issue date Sep 14, 2021
- MBDA UK Limited
- Adam Armitage
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate and a method thereof
- Patent number 11,057,990
- Issue date Jul 6, 2021
- WELLNESYS INC.
- Muralidhar Somisetty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 11,049,819
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for forming circuit board stacked structure
- Patent number 11,013,103
- Issue date May 18, 2021
- Unimicron Technology Corp.
- Ra-Min Tain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,940,671
- Issue date Mar 9, 2021
- Rogers Germany GmbH
- Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and stretchable electronic device based on biocompatible f...
- Patent number 10,932,722
- Issue date Mar 2, 2021
- Tsinghua University
- Xue Feng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,821,704
- Issue date Nov 3, 2020
- Rogers Germany GmbH
- Andreas Meyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fabric coated with functional silicone rubber
- Patent number 10,772,200
- Issue date Sep 8, 2020
- WAVE COMPANY CO., LTD.
- Na-Yun Cho
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Methods of fast fabrication of single and multilayer circuit with h...
- Patent number 10,660,217
- Issue date May 19, 2020
- Jun Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sensor device for detecting pressure
- Patent number 10,648,873
- Issue date May 12, 2020
- LG Innotek Co., Ltd
- Yong Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for improving drilling electronics performance
- Patent number 10,595,418
- Issue date Mar 17, 2020
- China Petroleum and Chemical Corporation
- Sheng Zhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked structure and method for manufacturing the same
- Patent number 10,588,214
- Issue date Mar 10, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic and polymer composite, and uses thereof
- Patent number 10,568,205
- Issue date Feb 18, 2020
- Corning Incorporated
- Weiguo Miao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded package assemblies with integrated capacitor
- Patent number 10,553,544
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Porous polyimide shaped article
- Patent number 10,542,623
- Issue date Jan 21, 2020
- Fuji Xerox Co., Ltd.
- Hajime Sugahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and display system
- Patent number 10,485,100
- Issue date Nov 19, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Naoyuki Senda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible electronic substrate
- Patent number 10,299,374
- Issue date May 21, 2019
- CAMBRIDGE NANOTHERM LIMITED
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board assembly with foam dielectric material
- Patent number 10,249,943
- Issue date Apr 2, 2019
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wearable flexible printed circuit board and method of manufacturing...
- Patent number 10,251,266
- Issue date Apr 2, 2019
- AMOGREENTECH CO., LTD.
- In Yong Seo
- A41 - WEARING APPAREL
Information Patent Grant
Arrangement with circuit carrier for an electronic device
- Patent number 10,211,550
- Issue date Feb 19, 2019
- Continental Automotive GmbH
- Michael Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material, high-frequency circuit baseboard made therefrom...
- Patent number 10,194,528
- Issue date Jan 29, 2019
- Guangdong Shengyi Sci. Tech Co., Ltd.
- Minshe Su
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
POROUS FILM AND COPPER CLAD LAMINATE
- Publication number 20250129212
- Publication date Apr 24, 2025
- Industrial Technology Research Institute
- Li-Ting HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-DIELECTRIC BOARD MATERIAL
- Publication number 20240206059
- Publication date Jun 20, 2024
- NITTO DENKO CORPORATION
- Taku IMAIZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230180382
- Publication date Jun 8, 2023
- Unimicron Technology Corp.
- Chun-Lin LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERMEABLE ELEMENT
- Publication number 20230085480
- Publication date Mar 16, 2023
- Universitat Linz
- Thomas STOCKINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20220386453
- Publication date Dec 1, 2022
- Nitto Denko Corporation
- Akihito MATSUTOMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE HAVING SOLDER MASK LAYER WITH LOW DIELECTRIC CONS...
- Publication number 20220240367
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Ming-Hao WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Flexible and Durable Printed Circuits On Stretchable And Non-Stretc...
- Publication number 20210161009
- Publication date May 27, 2021
- W.L. GORE & ASSOCIATES, INC.
- Mark D. Edmundson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT BOARD WITH LOW THERMAL CONDUCTIVITY AND METHOD O...
- Publication number 20210105889
- Publication date Apr 8, 2021
- Magna Seating Inc.
- Eric Kozlowski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE AND A METHOD THEREOF
- Publication number 20210068245
- Publication date Mar 4, 2021
- WELLNESYS INC.
- Muralidhar SOMISETTY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20200315020
- Publication date Oct 1, 2020
- MBDA UK LIMITED
- Adam ARMITAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR
- Publication number 20200083177
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Mark C. Lamorey
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20190394874
- Publication date Dec 26, 2019
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373713
- Publication date Dec 5, 2019
- Unimicron Technology Corp.
- Tzyy-Jang TSENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE FOR ELECTRONIC ASSEMBLIES
- Publication number 20190318985
- Publication date Oct 17, 2019
- National Taiwan Normal University
- Jung-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS POLYIMIDE SHAPED ARTICLE
- Publication number 20190239350
- Publication date Aug 1, 2019
- FUJI XEROX CO., LTD
- Hajime SUGAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRIC COATED WITH FUNCTIONAL SILICONE RUBBER
- Publication number 20190208629
- Publication date Jul 4, 2019
- WAVE COMPANY CO., LTD.
- Na-Yun Cho
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
METHOD FOR FORMING CIRCUIT BOARD STACKED STRUCTURE
- Publication number 20190098746
- Publication date Mar 28, 2019
- Unimicron Technology Corp.
- Ra-Min TAIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STACKED STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20180332700
- Publication date Nov 15, 2018
- Unimicron Technology Corp.
- Ra-Min TAIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTR...
- Publication number 20180200989
- Publication date Jul 19, 2018
- Rogers Germany GmbH
- Andreas MEYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CERAMIC AND POLYMER COMPOSITE, METHODS OF MAKING, AND USES THEREOF
- Publication number 20180035538
- Publication date Feb 1, 2018
- Corning Incorporated
- Weiguo Miao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, ADHESIVE FILM, AND CIRCUIT BOARD USING THE SAME
- Publication number 20170369747
- Publication date Dec 28, 2017
- ZHEN DING TECHNOLOGY CO., LTD.
- SZU-HSIANG SU
- B32 - LAYERED PRODUCTS
Information Patent Application
Arrangement with circuit carrier for an electronic device
- Publication number 20170187131
- Publication date Jun 29, 2017
- CONTINENTAL AUTOMOTIVE GMBH
- Michael Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES
- Publication number 20160353616
- Publication date Dec 1, 2016
- Apple Inc.
- Richard Hung Minh Dinh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL SUBSTRATE WITH INSULATED VIAS
- Publication number 20160286644
- Publication date Sep 29, 2016
- Cambridge Nanotherm Limited
- Pavel SHASHKOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLIES PROVIDING FAULT DETECTION
- Publication number 20150263512
- Publication date Sep 17, 2015
- GENERAL ELECTRIC COMPANY
- Davide Jonathan Leone
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STRETCHABLE ELECTRONIC STRUCTURES FORMED OF THIN FILMS INTEGRATED W...
- Publication number 20150143925
- Publication date May 28, 2015
- ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Hugues Vandeparre
- G01 - MEASURING TESTING
Information Patent Application
CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150114691
- Publication date Apr 30, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Jin Ho HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...
- Publication number 20140374141
- Publication date Dec 25, 2014
- Sheng-Hung Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED METAL SUBSTRATE
- Publication number 20140293554
- Publication date Oct 2, 2014
- CAMBRIDGE NANOTHERM LIMITED
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
VIBRATION-PROOF MATERIAL, VIBRATION-PROOF STRUCTURE, AND VIBRATION-...
- Publication number 20140284086
- Publication date Sep 25, 2014
- Nitto Denko Corporation
- Takayuki IWASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Elastic printed conductors

Ceramic and polymer composite, methods of making, and uses thereof

Multilayer substrate

Elastic printed conductors

Flexible and durable printed circuits on stretchable and non-stretc...

Electrical circuit board with low thermal conductivity and method o...

Printing of nanowire films

Circuit board and display system

Circuit assembly

Flexible substrate and a method thereof

Shielded package assemblies with integrated capacitor

Method for forming circuit board stacked structure

Substrate for electrical circuits and method for producing a substr...

Flexible and stretchable electronic device based on biocompatible f...

Substrate for electrical circuits and method for producing a substr...

Fabric coated with functional silicone rubber

Methods of fast fabrication of single and multilayer circuit with h...

Sensor device for detecting pressure

Method and apparatus for improving drilling electronics performance

Stacked structure and method for manufacturing the same

Ceramic and polymer composite, and uses thereof

Shielded package assemblies with integrated capacitor

Porous polyimide shaped article

Circuit board and display system

Flexible electronic substrate

Printed circuit board assembly with foam dielectric material

Wearable flexible printed circuit board and method of manufacturing...

Arrangement with circuit carrier for an electronic device

Composite material, high-frequency circuit baseboard made therefrom...

Patents Applicationslast 30 patents

POROUS FILM AND COPPER CLAD LAMINATE

LOW-DIELECTRIC BOARD MATERIAL

CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF

PERMEABLE ELEMENT

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

PACKAGE STRUCTURE HAVING SOLDER MASK LAYER WITH LOW DIELECTRIC CONS...

Flexible and Durable Printed Circuits On Stretchable And Non-Stretc...

ELECTRICAL CIRCUIT BOARD WITH LOW THERMAL CONDUCTIVITY AND METHOD O...

FLEXIBLE SUBSTRATE AND A METHOD THEREOF

CIRCUIT ASSEMBLY

SHIELDED PACKAGE ASSEMBLIES WITH INTEGRATED CAPACITOR

MULTILAYER SUBSTRATE

STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE FOR ELECTRONIC ASSEMBLIES

POROUS POLYIMIDE SHAPED ARTICLE

FABRIC COATED WITH FUNCTIONAL SILICONE RUBBER

METHOD FOR FORMING CIRCUIT BOARD STACKED STRUCTURE

CIRCUIT BOARD STACKED STRUCTURE AND METHOD FOR FORMING THE SAME

SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTR...

CERAMIC AND POLYMER COMPOSITE, METHODS OF MAKING, AND USES THEREOF

RESIN COMPOSITION, ADHESIVE FILM, AND CIRCUIT BOARD USING THE SAME

Arrangement with circuit carrier for an electronic device

ELECTRONIC SUBASSEMBLIES FOR ELECTRONIC DEVICES

METAL SUBSTRATE WITH INSULATED VIAS

PRINTED CIRCUIT BOARD ASSEMBLIES PROVIDING FAULT DETECTION

STRETCHABLE ELECTRONIC STRUCTURES FORMED OF THIN FILMS INTEGRATED W...

CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...

INSULATED METAL SUBSTRATE

VIBRATION-PROOF MATERIAL, VIBRATION-PROOF STRUCTURE, AND VIBRATION-...