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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
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H01L27/14698
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Patents Grants
last 30 patents
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Patent Grant
Method for forming chip package with second opening surrounding fir...
Patent number
11,973,095
Issue date
Apr 30, 2024
Xintec Inc.
Kuei-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Imaging device and method of manufacturing imaging device
Patent number
11,916,095
Issue date
Feb 27, 2024
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Naoyuki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor and manufacturing method thereof
Patent number
11,901,393
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Jhy-Jyi Sze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of making a radiation detector
Patent number
11,901,244
Issue date
Feb 13, 2024
SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
Peiyan Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Short-wave infrared detector and its integration with CMOS compatib...
Patent number
11,888,014
Issue date
Jan 30, 2024
ZEDEL SÀRL
Claude Meylan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bond pad structure for bonding improvement
Patent number
11,869,916
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chin-Wei Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back-side deep trench isolation structure for image sensor
Patent number
11,869,761
Issue date
Jan 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hung Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor device
Patent number
11,855,118
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced trench isolation structure
Patent number
11,784,204
Issue date
Oct 10, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Min-Ying Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for passivating full front-side deep trench isolation structure
Patent number
11,769,779
Issue date
Sep 26, 2023
OmniVision Technologies, Inc.
Shiyu Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for collectively curving a set of electronic chips
Patent number
11,769,785
Issue date
Sep 26, 2023
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Bertrand Chambion
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing image sensing chip package structure includ...
Patent number
11,764,240
Issue date
Sep 19, 2023
Tong Hsing Electronic Industries, Ltd.
Chia-Shuai Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Germanium-silicon light sensing apparatus
Patent number
11,756,969
Issue date
Sep 12, 2023
Artilux, Inc.
Yun-Chung Na
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor image sensor device having back side illuminated imag...
Patent number
11,735,619
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chiu-Jung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Full well capacity for image sensor
Patent number
11,721,774
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Yun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passivation scheme for image sensor substrate
Patent number
11,699,713
Issue date
Jul 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Yun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor based on charge carrier avalanche
Patent number
11,619,754
Issue date
Apr 4, 2023
SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
Peiyan Cao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Detector array yield recovery
Patent number
11,600,654
Issue date
Mar 7, 2023
ALLEGRO MICROSYSTEMS, LLC
Logan G. Stewart
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabrication of NIR CMOS image sensor
Patent number
11,574,950
Issue date
Feb 7, 2023
Applied Materials, Inc.
Venkataramana R. Chavva
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming image sensor device
Patent number
11,532,662
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Yu Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and manufacturing method thereof
Patent number
11,522,000
Issue date
Dec 6, 2022
Powertech Technology Inc.
Hung-Hsin Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded image sensor chip scale packages and related methods
Patent number
11,508,766
Issue date
Nov 22, 2022
Semiconductor Components Industries, LLC
Weng-Jin Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Back side illuminated image sensor with deep trench isolation struc...
Patent number
11,495,632
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuo-Cheng Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solid-state imaging device and solid-state imaging element
Patent number
11,488,994
Issue date
Nov 1, 2022
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Takanobu Kawazoe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing an imager
Patent number
11,489,000
Issue date
Nov 1, 2022
Trixell
Yannick Janvier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package with substrate having first opening surrounded by seco...
Patent number
11,450,697
Issue date
Sep 20, 2022
Xintec Inc.
Kuei-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level process for curving a set of electronic chips
Patent number
11,424,286
Issue date
Aug 23, 2022
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Bertrand Chambion
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensing device and manufacturing method thereof
Patent number
11,417,700
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Chih-Chang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensing chip package structure including adhesive loop
Patent number
11,411,029
Issue date
Aug 9, 2022
Tong Hsing Electronic Industries, Ltd.
Chia-Shuai Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensors having an active surface
Patent number
11,387,269
Issue date
Jul 12, 2022
Illumina, Inc.
Arvin Emadi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SENSORS HAVING AN ACTIVE SURFACE
Publication number
20240145505
Publication date
May 2, 2024
Illumina, Inc.
Arvin Emadi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FABRICATING IMAGE SENSOR
Publication number
20240145520
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing company Ltd.
JHY-JYI SZE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR DEVICE
Publication number
20240088195
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Yu WEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR
Publication number
20240072082
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING PHOTO DETECTOR
Publication number
20240063249
Publication date
Feb 22, 2024
Sumitomo Electric Industries, Ltd.
Takeshi OKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240047487
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing company Ltd.
FENG-CHIEN HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOELECTRIC CONVERSION PANEL, X-RAY IMAGING PANEL, AND MANUFACTUR...
Publication number
20240027634
Publication date
Jan 25, 2024
Sharp Display Technology Corporation
Hiroyuki MORIWAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED TRENCH ISOLATION STRUCTURE
Publication number
20240021642
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Min-Ying Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE
Publication number
20230420469
Publication date
Dec 28, 2023
Samsung Electronics Co., Ltd.
SUNJAE KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
Publication number
20230402487
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Bi-Shen LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GERMANIUM-SILICON LIGHT SENSING APPARATUS
Publication number
20230395618
Publication date
Dec 7, 2023
Artilux, Inc.
Yun-Chung Na
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
Publication number
20230378225
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Wei Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
Publication number
20230369367
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FINGERPRINT SENSOR WITH WAFER-BONDED MICROLENS ARRAY
Publication number
20230351798
Publication date
Nov 2, 2023
OMNIVISION TECHNOLOGIES, INC.
Tsung-Wei WAN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FULL WELL CAPACITY FOR IMAGE SENSOR
Publication number
20230343883
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Yun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EPITAXIAL SILICON WAFER, METHOD FOR PRODUCING SAME, AND METHOD FOR...
Publication number
20230317761
Publication date
Oct 5, 2023
SUMCO CORPORATION
Ryo HIROSE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Geiger-Mode Avalanche Photodiode Arrays Fabricated on Silicon-on-In...
Publication number
20230299225
Publication date
Sep 21, 2023
Massachusetts Institute of Technology
Kevin Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVATION SCHEME FOR IMAGE SENSOR SUBSTRATE
Publication number
20230299108
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Yun Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming Backside Illumination CMOS Image Sensor
Publication number
20230290805
Publication date
Sep 14, 2023
Hua Hong Semiconductor (Wuxi) Limited
Xiao FAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with Integrated Optical Die and Method Forming Same
Publication number
20230244043
Publication date
Aug 3, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
G02 - OPTICS
Information
Patent Application
PASSIVATION-ENHANCED IMAGE SENSOR AND SURFACE-PASSIVATION METHOD
Publication number
20230207589
Publication date
Jun 29, 2023
OMNIVISION TECHNOLOGIES, INC.
Shiyu SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR BASED ON CHARGE CARRIER AVALANCHE
Publication number
20230204804
Publication date
Jun 29, 2023
SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
Peiyan CAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Atomic Layer-Based Surface Treatments for Infrared Detectors
Publication number
20230129191
Publication date
Apr 27, 2023
California Institute of Technology
Cory J. Hill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR DEVICE
Publication number
20230118159
Publication date
Apr 20, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Yu WEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC DEVICE INTEGRATED WITH MULTILAYER THIN-FILM CIRCUITRY
Publication number
20230119072
Publication date
Apr 20, 2023
LUMIODE, INC.
Brian Tull
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENT
Publication number
20230117629
Publication date
Apr 20, 2023
Sony Semiconductor Solutions Corporation
Kota MARUYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
Publication number
20230106038
Publication date
Apr 6, 2023
Samsung Electronics Co., Ltd.
Sena SHIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGE SENSOR BALL GRID ARRAY PACKAGE
Publication number
20230064356
Publication date
Mar 2, 2023
Semiconductor Components Industries, LLC
Yusheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE CONTACT PAD AND METHOD OF CONTACT PAD FABRICATION
Publication number
20230053960
Publication date
Feb 23, 2023
OMNIVISION TECHNOLOGIES, INC.
Hui Zang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT THEREOF AND MANUFACTURI...
Publication number
20230019091
Publication date
Jan 19, 2023
NINGBO SUNNY OPOTECH CO., LTD.
Mingzhu WANG
H01 - BASIC ELECTRIC ELEMENTS