Post-treatment for the devices

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H01L27/14698

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14698Post-treatment for the devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating nanoscale structures usable in molecular sen...
- Patent number 12,146,852
- Issue date Nov 19, 2024
- Sungho Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectric conversion apparatus and manufacturing method therefor
- Patent number 12,148,848
- Issue date Nov 19, 2024
- Canon Kabushiki Kaisha
- Masashi Kusukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for image sensor substrate
- Patent number 12,136,642
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 12,113,090
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light detection substrate, manufacturing method thereof and light d...
- Patent number 12,080,731
- Issue date Sep 3, 2024
- BOE Technology Group Co., Ltd.
- Fanli Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing solid-state image sensor, solid-state image...
- Patent number 12,068,349
- Issue date Aug 20, 2024
- Canon Kabushiki Kaisha
- Toshihiro Shoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensors having an active surface
- Patent number 12,062,674
- Issue date Aug 13, 2024
- Illumina, Inc.
- Arvin Emadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive imaging devices and associated methods
- Patent number 12,057,464
- Issue date Aug 6, 2024
- SiOnyx, LLC
- Homayoon Haddad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor x-ray detector tiles and method of dicing th...
- Patent number 12,046,623
- Issue date Jul 23, 2024
- Redlen Technologies, Inc.
- Francis Joseph Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for effective impurity gettering
- Patent number 12,046,614
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device contact pad and method of contact pad fabrication
- Patent number 12,034,027
- Issue date Jul 9, 2024
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, and photosensitive component thereof and manufacturi...
- Patent number 12,021,097
- Issue date Jun 25, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Back-illuminated sensor with boron layer deposited using plasma ato...
- Patent number 12,015,046
- Issue date Jun 18, 2024
- KLA Corporation
- Sisir Yalamanchili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package with second opening surrounding fir...
- Patent number 11,973,095
- Issue date Apr 30, 2024
- Xintec Inc.
- Kuei-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and method of manufacturing imaging device
- Patent number 11,916,095
- Issue date Feb 27, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naoyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 11,901,393
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jhy-Jyi Sze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making a radiation detector
- Patent number 11,901,244
- Issue date Feb 13, 2024
- SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Peiyan Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short-wave infrared detector and its integration with CMOS compatib...
- Patent number 11,888,014
- Issue date Jan 30, 2024
- ZEDEL SÀRL
- Claude Meylan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,869,916
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 11,869,761
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,855,118
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced trench isolation structure
- Patent number 11,784,204
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for passivating full front-side deep trench isolation structure
- Patent number 11,769,779
- Issue date Sep 26, 2023
- OmniVision Technologies, Inc.
- Shiyu Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for collectively curving a set of electronic chips
- Patent number 11,769,785
- Issue date Sep 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Bertrand Chambion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing image sensing chip package structure includ...
- Patent number 11,764,240
- Issue date Sep 19, 2023
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Germanium-silicon light sensing apparatus
- Patent number 11,756,969
- Issue date Sep 12, 2023
- Artilux, Inc.
- Yun-Chung Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor device having back side illuminated imag...
- Patent number 11,735,619
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiu-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full well capacity for image sensor
- Patent number 11,721,774
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for image sensor substrate
- Patent number 11,699,713
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor based on charge carrier avalanche
- Patent number 11,619,754
- Issue date Apr 4, 2023
- SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
- Peiyan Cao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME
- Publication number 20240377595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240379717
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Kook Tae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20240379713
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20240355864
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
- Publication number 20240339479
- Publication date Oct 10, 2024
- SiOnyx, LLC.
- Homayoon Haddad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL SHIELDING FOR INTEGRATED CIRCUITS
- Publication number 20240339475
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN PHOTODETECTOR DEVICE AND FABRICATION THEREOF
- Publication number 20240321932
- Publication date Sep 26, 2024
- ams-Osram AG
- Rainer Minixhofer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-Illuminated Sensor With Boron Layer Deposited Using Plasma Ato...
- Publication number 20240313032
- Publication date Sep 19, 2024
- KLA Corporation
- Sisir Yalamanchili
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
VERTICAL TRANSFER GATE DOPING DISTRIBUTION FOR CHARGE TRANSFER FROM...
- Publication number 20240304638
- Publication date Sep 12, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING WHITE SPOTS IN IMAGE SENSOR
- Publication number 20240250109
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Juntaek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
- Publication number 20240234470
- Publication date Jul 11, 2024
- SiOnyx, LLC.
- Homayoon Haddad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSORS HAVING AN ACTIVE SURFACE
- Publication number 20240145505
- Publication date May 2, 2024
- Illumina, Inc.
- Arvin Emadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING IMAGE SENSOR
- Publication number 20240145520
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHY-JYI SZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240088195
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR
- Publication number 20240072082
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PHOTO DETECTOR
- Publication number 20240063249
- Publication date Feb 22, 2024
- Sumitomo Electric Industries, Ltd.
- Takeshi OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240047487
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHIEN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION PANEL, X-RAY IMAGING PANEL, AND MANUFACTUR...
- Publication number 20240027634
- Publication date Jan 25, 2024
- Sharp Display Technology Corporation
- Hiroyuki MORIWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED TRENCH ISOLATION STRUCTURE
- Publication number 20240021642
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE
- Publication number 20230420469
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF
- Publication number 20230402487
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bi-Shen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GERMANIUM-SILICON LIGHT SENSING APPARATUS
- Publication number 20230395618
- Publication date Dec 7, 2023
- Artilux, Inc.
- Yun-Chung Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20230378225
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
- Publication number 20230369367
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR WITH WAFER-BONDED MICROLENS ARRAY
- Publication number 20230351798
- Publication date Nov 2, 2023
- OMNIVISION TECHNOLOGIES, INC.
- Tsung-Wei WAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FULL WELL CAPACITY FOR IMAGE SENSOR
- Publication number 20230343883
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SILICON WAFER, METHOD FOR PRODUCING SAME, AND METHOD FOR...
- Publication number 20230317761
- Publication date Oct 5, 2023
- SUMCO CORPORATION
- Ryo HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Geiger-Mode Avalanche Photodiode Arrays Fabricated on Silicon-on-In...
- Publication number 20230299225
- Publication date Sep 21, 2023
- Massachusetts Institute of Technology
- Kevin Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR IMAGE SENSOR SUBSTRATE
- Publication number 20230299108
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Yun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Backside Illumination CMOS Image Sensor
- Publication number 20230290805
- Publication date Sep 14, 2023
- Hua Hong Semiconductor (Wuxi) Limited
- Xiao FAN
- H01 - BASIC ELECTRIC ELEMENTS

Post-treatment for the devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of fabricating nanoscale structures usable in molecular sen...

Photoelectric conversion apparatus and manufacturing method therefor

Passivation scheme for image sensor substrate

Bond pad structure for bonding improvement

Light detection substrate, manufacturing method thereof and light d...

Method of manufacturing solid-state image sensor, solid-state image...

Sensors having an active surface

Photosensitive imaging devices and associated methods

Compound semiconductor x-ray detector tiles and method of dicing th...

Apparatus and methods for effective impurity gettering

Semiconductor device contact pad and method of contact pad fabrication

Camera module, and photosensitive component thereof and manufacturi...

Back-illuminated sensor with boron layer deposited using plasma ato...

Method for forming chip package with second opening surrounding fir...

Imaging device and method of manufacturing imaging device

Image sensor and manufacturing method thereof

Methods of making a radiation detector

Short-wave infrared detector and its integration with CMOS compatib...

Bond pad structure for bonding improvement

Back-side deep trench isolation structure for image sensor

Image sensor device

Enhanced trench isolation structure

Method for passivating full front-side deep trench isolation structure

Process for collectively curving a set of electronic chips

Method of manufacturing image sensing chip package structure includ...

Germanium-silicon light sensing apparatus

Semiconductor image sensor device having back side illuminated imag...

Full well capacity for image sensor

Passivation scheme for image sensor substrate

Image sensor based on charge carrier avalanche

Patents Applicationslast 30 patents

PACKAGE WITH INTEGRATED OPTICAL DIE AND METHOD FORMING SAME

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS

SIGNAL SHIELDING FOR INTEGRATED CIRCUITS

THIN PHOTODETECTOR DEVICE AND FABRICATION THEREOF

Back-Illuminated Sensor With Boron Layer Deposited Using Plasma Ato...

VERTICAL TRANSFER GATE DOPING DISTRIBUTION FOR CHARGE TRANSFER FROM...

METHOD FOR REDUCING WHITE SPOTS IN IMAGE SENSOR

PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS

SENSORS HAVING AN ACTIVE SURFACE

METHODS FOR FABRICATING IMAGE SENSOR

IMAGE SENSOR DEVICE

PASSIVATION FOR A VERTICAL TRANSFER GATE IN A PIXEL SENSOR

METHOD OF MANUFACTURING PHOTO DETECTOR

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PHOTOELECTRIC CONVERSION PANEL, X-RAY IMAGING PANEL, AND MANUFACTUR...

ENHANCED TRENCH ISOLATION STRUCTURE

MANUFACTURING METHOD OF IMAGE SENSOR PACKAGE

DEEP TRENCH ISOLATION STRUCTURE AND METHODS FOR FABRICATION THEREOF

GERMANIUM-SILICON LIGHT SENSING APPARATUS

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

PASSIVATION FOR A DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR

FINGERPRINT SENSOR WITH WAFER-BONDED MICROLENS ARRAY

FULL WELL CAPACITY FOR IMAGE SENSOR

EPITAXIAL SILICON WAFER, METHOD FOR PRODUCING SAME, AND METHOD FOR...

Geiger-Mode Avalanche Photodiode Arrays Fabricated on Silicon-on-In...

PASSIVATION SCHEME FOR IMAGE SENSOR SUBSTRATE

Method for Forming Backside Illumination CMOS Image Sensor