Powders, particles or spheres; Preforms made therefrom

Industry

CPC
B23K35/0244

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Current Industry

B23K35/0244Powders, particles or spheres; Preforms made therefrom

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder materials including supercooled micro-capsules and alloyed p...
- Patent number 12,208,471
- Issue date Jan 28, 2025
- THE INDIUM CORPORATION OF AMERICA
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder particles
- Patent number 12,172,240
- Issue date Dec 24, 2024
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Junction structure, method for manufacturing junction structure, an...
- Patent number 12,157,189
- Issue date Dec 3, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Masamoto Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for low-manganese welding alloys
- Patent number 12,134,147
- Issue date Nov 5, 2024
- HOBART BROTHERS LLC
- Steven Edward Barhorst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, solder paste, and solder joint
- Patent number 12,109,653
- Issue date Oct 8, 2024
- Senju Metal Industry Co., Ltd.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy composition suitable for use in high-tempera...
- Patent number 12,103,114
- Issue date Oct 1, 2024
- KYUNG DONG MTEC CO., LTD.
- Heung Rak Sohn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing material, brazing member, heat exchanger, and producing met...
- Patent number 12,103,115
- Issue date Oct 1, 2024
- HARIMA CHEMICALS, INCORPORATED
- Wataru Masuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process and device for preforms intended for brazing...
- Patent number 12,048,971
- Issue date Jul 30, 2024
- ISP System
- Paul Sauvageot
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder paste
- Patent number 12,017,306
- Issue date Jun 25, 2024
- Senju Metal Industry Co., Ltd.
- Takeshi Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SnBi and SnIn solder alloys
- Patent number 11,999,018
- Issue date Jun 4, 2024
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Butt-joint deep penetration laser welding method
- Patent number 11,975,408
- Issue date May 7, 2024
- SMS group GMBH
- Jens Artel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for low-manganese welding wire
- Patent number 11,897,063
- Issue date Feb 13, 2024
- HOBART BROTHERS LLC
- Mario Anthony Amata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suppressors and their methods of manufacture
- Patent number 11,852,432
- Issue date Dec 26, 2023
- OCEANIA DEFENCE LTD
- Bert John Wilson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux and solder paste
- Patent number 11,826,860
- Issue date Nov 28, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding member and bonding method
- Patent number 11,819,915
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Seitaro Washizuka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing intermetallic compound
- Patent number 11,821,058
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Seitaro Washizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exothermic braze precursor material
- Patent number 11,780,020
- Issue date Oct 10, 2023
- General Electric Company
- Voramon Supatarawanich Dheeradhada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable transportation mechanism for micro solder balls
- Patent number 11,780,022
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Yusuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a high-temperature resistant lead free solder...
- Patent number 11,772,179
- Issue date Oct 3, 2023
- ENDRESS+HAUSER SE+CO.KG
- Elke Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloy for electronic applications...
- Patent number 11,732,330
- Issue date Aug 22, 2023
- Alpha Assembly Solutions, Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cost-effective lead-free solder alloy for electronic applications
- Patent number 11,724,342
- Issue date Aug 15, 2023
- Alpha Assembly Solutions Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for welding zinc-coated workpieces
- Patent number 11,697,171
- Issue date Jul 11, 2023
- HOBART BROTHERS LLC
- Steven Edward Barhorst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire manufactured by additive manufacturing methods
- Patent number 11,691,198
- Issue date Jul 4, 2023
- Illinois Tool Works Inc.
- Christopher Hsu
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Stable undercooled metallic particles for filling a void
- Patent number 11,685,977
- Issue date Jun 27, 2023
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Braze joints for a component and methods of forming the same
- Patent number 11,633,797
- Issue date Apr 25, 2023
- General Electric Company
- Shan Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing filler material for bonding iron-based sintered member, and...
- Patent number 11,623,306
- Issue date Apr 11, 2023
- Resonac Corporation
- Hiroshi Ohmori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for reducing or completely closing an opening of an inner co...
- Patent number 11,612,953
- Issue date Mar 28, 2023
- Sauer GmbH
- David Albert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder power, and solder joint
- Patent number 11,583,959
- Issue date Feb 21, 2023
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER ALLOY, JOINED PART, JOINING MATERIAL, SOLDER PASTE, JOINED S...
- Publication number 20250018509
- Publication date Jan 16, 2025
- TAMURA CORPORATION
- Takanori SHIMAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZE REPAIR
- Publication number 20250018488
- Publication date Jan 16, 2025
- Daniel James DORRIETY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...
- Publication number 20250001528
- Publication date Jan 2, 2025
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240424615
- Publication date Dec 26, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...
- Publication number 20240429108
- Publication date Dec 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Shujie Fei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTER BONDING SHEET ROLL
- Publication number 20240421010
- Publication date Dec 19, 2024
- Nitto Denko Corporation
- Katsutoshi Kamei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...
- Publication number 20240367270
- Publication date Nov 7, 2024
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPOSITE CONDUCTIVE PARTICLE AND METHOD FOR MANUFACTURING COMPOSIT...
- Publication number 20240266086
- Publication date Aug 8, 2024
- DEXERIALS CORPORATION
- Hidetsugu NAMIKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240238912
- Publication date Jul 18, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR LOW-MANGANESE WELDING WIRE
- Publication number 20240181552
- Publication date Jun 6, 2024
- Hobart Brothers LLC
- Mario Anthony Amata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR LOW-MANGANESE WELDING ALLOYS
- Publication number 20240131630
- Publication date Apr 25, 2024
- Hobart Brothers LLC
- Steven Edward Barhorst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR LOW-MANGANESE WELDING ALLOYS
- Publication number 20240131631
- Publication date Apr 25, 2024
- Hobart Brothers LLC
- Steven Edward Barhorst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVEMENTS TO SUPPRESSORS AND THEIR METHODS OF MANUFACTURE
- Publication number 20240118050
- Publication date Apr 11, 2024
- OCEANIA DEFENCE LTD.
- Bert John WILSON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME,...
- Publication number 20240100634
- Publication date Mar 28, 2024
- Research & Business Foundation Sungkyunkwan University
- Jaeseok JANG
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL
- Publication number 20240075559
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-TIN-NICKEL BRAZING MATERIAL PREPARED BY ALLOYS RECYCLED FROM...
- Publication number 20240068069
- Publication date Feb 29, 2024
- ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD.
- Weimin LONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZE ALLOY MIX FOR APPLICATION IN A METHOD FOR BRAZING A COMPONENT...
- Publication number 20240058901
- Publication date Feb 22, 2024
- MTU Aero Engines AG
- Dirk Wilhelm Reker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240024990
- Publication date Jan 25, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY COMPOSITION, ITS PREPARATION METHOD AND USES IN ROOM-T...
- Publication number 20240009777
- Publication date Jan 11, 2024
- City University of Hong Kong
- King-Ning TU
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT
- Publication number 20230398643
- Publication date Dec 14, 2023
- SENJU METAL INDUSTRY CO., LTD
- Yuki IIJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID
- Publication number 20230383388
- Publication date Nov 30, 2023
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS
- Publication number 20230356333
- Publication date Nov 9, 2023
- Alpha Assembly Solutions Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDED...
- Publication number 20230347407
- Publication date Nov 2, 2023
- Taiyo Nippon Sanso Corporation
- Kentaro MIYOSHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDED...
- Publication number 20230347408
- Publication date Nov 2, 2023
- Taiyo Nippon Sanso Corporation
- Kentaro MIYOSHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS...
- Publication number 20230340642
- Publication date Oct 26, 2023
- Alpha Assembly Solutions Inc.
- Md Hasnine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
- Publication number 20230330788
- Publication date Oct 19, 2023
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Powders, particles or spheres; Preforms made therefrom

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder materials including supercooled micro-capsules and alloyed p...

Solder particles

Junction structure, method for manufacturing junction structure, an...

Systems and methods for low-manganese welding alloys

Solder alloy, solder ball, solder paste, and solder joint

Lead-free solder alloy composition suitable for use in high-tempera...

Brazing material, brazing member, heat exchanger, and producing met...

Manufacturing process and device for preforms intended for brazing...

Layer structure with an intermetallic phase layer and a chip packag...

Solder paste

SnBi and SnIn solder alloys

Butt-joint deep penetration laser welding method

Systems and methods for low-manganese welding wire

Suppressors and their methods of manufacture

Solder material

Flux and solder paste

Bonding member and bonding method

Method for producing intermetallic compound

Exothermic braze precursor material

Reliable transportation mechanism for micro solder balls

Method for producing a high-temperature resistant lead free solder...

High reliability lead-free solder alloy for electronic applications...

Cost-effective lead-free solder alloy for electronic applications

Systems and methods for welding zinc-coated workpieces

Wire manufactured by additive manufacturing methods

Stable undercooled metallic particles for filling a void

Braze joints for a component and methods of forming the same

Brazing filler material for bonding iron-based sintered member, and...

Method for reducing or completely closing an opening of an inner co...

Solder alloy, solder power, and solder joint

Patents Applicationslast 30 patents

SOLDER ALLOY, JOINED PART, JOINING MATERIAL, SOLDER PASTE, JOINED S...

BRAZE REPAIR

SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...

SINTER BONDING SHEET ROLL

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

COMPOSITE CONDUCTIVE PARTICLE AND METHOD FOR MANUFACTURING COMPOSIT...

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

SYSTEMS AND METHODS FOR LOW-MANGANESE WELDING WIRE

SYSTEMS AND METHODS FOR LOW-MANGANESE WELDING ALLOYS

SYSTEMS AND METHODS FOR LOW-MANGANESE WELDING ALLOYS

IMPROVEMENTS TO SUPPRESSORS AND THEIR METHODS OF MANUFACTURE

LEAD-FREE SOLDER ALLOY COMPOSITION, SOLDER BALL INCLUDING THE SAME,...

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

SOLDER MATERIAL

COPPER-TIN-NICKEL BRAZING MATERIAL PREPARED BY ALLOYS RECYCLED FROM...

BRAZE ALLOY MIX FOR APPLICATION IN A METHOD FOR BRAZING A COMPONENT...

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

SOLDER ALLOY COMPOSITION, ITS PREPARATION METHOD AND USES IN ROOM-T...

SOLDER ALLOY, SOLDER BALL AND SOLDER JOINT

STABLE UNDERCOOLED METALLIC PARTICLES FOR FILLING A VOID

COST-EFFECTIVE LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS

BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDED...

BONDING MATERIAL, METHOD FOR PRODUCING BONDING MATERIAL, AND BONDED...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOY FOR ELECTRONIC APPLICATIONS...

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES