TREA

Pre-treatment step of the bump connectors prior to bonding

Follow

Industry

  • CPC
  • H01L2021/60045
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60045Pre-treatment step of the bump connectors prior to bonding
Industries