Pre-treatment step of the bump connectors prior to bonding

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CPC
H01L2021/60045

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/60045Pre-treatment step of the bump connectors prior to bonding

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Patents Grantslast 30 patents

Information Patent Grant
System and method for forming solder bumps
- Patent number 11,990,437
- Issue date May 21, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 11,101,261
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming solder bumps
- Patent number 10,879,202
- Issue date Dec 29, 2020
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization and flip-chip fabrication process of fine-line-geomet...
- Patent number 10,840,106
- Issue date Nov 17, 2020
- OEPic Semiconductors, Inc.
- Yi-Ching Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing contamination for reliable bond pads
- Patent number 10,410,854
- Issue date Sep 10, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Honghui Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 10,373,941
- Issue date Aug 6, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structures and methods for forming the same
- Patent number 9,935,091
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS
- Publication number 20190206676
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Honghui MOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structures and Methods for Forming the Same
- Publication number 20180197847
- Publication date Jul 12, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Structures and Methods for Forming the Same
- Publication number 20160351554
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS

Pre-treatment step of the bump connectors prior to bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for forming solder bumps

Package-on-package structures and methods for forming the same

System and method for forming solder bumps

Planarization and flip-chip fabrication process of fine-line-geomet...

Method and device for reducing contamination for reliable bond pads

Package-on-package structures and methods for forming the same

Package-on-package structures and methods for forming the same

Patents Applicationslast 30 patents

METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS

Package-on-Package Structures and Methods for Forming the Same

Package-on-Package Structures and Methods for Forming the Same