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H05K2201/0909

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0909Preformed cutting or breaking line

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lighting strip
- Patent number 12,169,059
- Issue date Dec 17, 2024
- SIGNIFY HOLDING, B.V.
- Andrew Christanto
- F21 - LIGHTING
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,516,926
- Issue date Nov 29, 2022
- Innolux Corporation
- Pai-Chi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable modules PCB modules
- Patent number 11,277,906
- Issue date Mar 15, 2022
- SIGNIFY HOLDING B.V.
- Remco Christianus Wilhelmus Leermakers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Main board with integrated trusted platform module for a computer d...
- Patent number 11,227,092
- Issue date Jan 18, 2022
- Unify Patente GmbH & Co. KG
- Marcelo Samsoniuk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and method for producing the printed circuit...
- Patent number 11,134,565
- Issue date Sep 28, 2021
- ENDRESS+HAUSER SE+CO.KG
- Harald Schäuble
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control unit
- Patent number 11,013,106
- Issue date May 18, 2021
- Aptiv Technologies Limited
- Moritz Schrey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motherboard to be cut
- Patent number 10,869,396
- Issue date Dec 15, 2020
- BOE Technology Group Co., Ltd.
- Fuzheng Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ceramic-metal layer assembly, method for m...
- Patent number 10,806,028
- Issue date Oct 13, 2020
- Mitsubishi Materials Corporation
- Koya Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Versatile and reliable intelligent package
- Patent number 10,607,950
- Issue date Mar 31, 2020
- Stora Enso Oyj
- Juha Maijala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic strip yarn
- Patent number 10,458,048
- Issue date Oct 29, 2019
- Nottingham Trent University
- Tilak Kithsiri Dias
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing circuit board, and circuit board
- Patent number 10,433,423
- Issue date Oct 1, 2019
- SUMITOMO WIRING SYSTEMS, LTD.
- Tsuyoshi Sakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image pickup apparatus and method for manufacturing image pickup ap...
- Patent number 10,381,393
- Issue date Aug 13, 2019
- Olympus Corporation
- Takuro Suyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Display device and method for fabricating the same
- Patent number 10,353,138
- Issue date Jul 16, 2019
- Samsung Display Co., Ltd.
- Sung Dong Park
- G02 - OPTICS
Information Patent Grant
Package substrates and methods of fabricating the same
- Patent number 10,332,755
- Issue date Jun 25, 2019
- Samsung Electronics Co., Ltd.
- Hyesun Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing electronic components
- Patent number 10,321,567
- Issue date Jun 11, 2019
- Hamamatsu Photonics K.K.
- Katsuya Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit board, and production method therefor
- Patent number 10,286,702
- Issue date May 14, 2019
- KOMURA-TECH CO., LTD.
- Tadashi Kawamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Mother ceramic substrate, ceramic substrate, mother module componen...
- Patent number 10,257,927
- Issue date Apr 9, 2019
- Murata Manufacturing Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate with conductive layer for mounting LED arrays
- Patent number 10,237,980
- Issue date Mar 19, 2019
- Lumileds LLC
- Frederic Stephane Diana
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for synchronizing a plurality of RFID interroga...
- Patent number 10,235,545
- Issue date Mar 19, 2019
- SMARTRAC TECHNOLOGY FLETCHER, INC.
- James Robert Kruest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Variable width printed circuit board using surface mount technology...
- Patent number 10,201,093
- Issue date Feb 5, 2019
- GE Lighting Solutions, LLC
- Zoltan Szabo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit substrate with temporary supports and equalized la...
- Patent number 10,199,323
- Issue date Feb 5, 2019
- Apple Inc.
- Yung-Yu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for stirring electromagnetic fields and interro...
- Patent number 10,133,894
- Issue date Nov 20, 2018
- SMARTAC TECHNOLOGY FLETCHER, INC.
- James Robert Kruest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,045,436
- Issue date Aug 7, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suk Hyeon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of part-mounting package
- Patent number 10,034,383
- Issue date Jul 24, 2018
- NGK Spark Plug Co., Ltd.
- Kazushige Akita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 10,004,145
- Issue date Jun 19, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit assembly sheet
- Patent number 9,980,390
- Issue date May 22, 2018
- Nitto Denko Corporation
- Naohiro Terada
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of producing electronic components and method of producing s...
- Patent number 9,839,135
- Issue date Dec 5, 2017
- Murata Manufacturing Co., Ltd.
- Kazuto Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collective substrate for resistor devices
- Patent number 9,832,877
- Issue date Nov 28, 2017
- Murata Manufacturing Co., Ltd.
- Kazuo Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for forming LED light emitters
- Patent number 9,816,691
- Issue date Nov 14, 2017
- LedEngin, Inc.
- Xiantao Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electronic components
- Patent number 9,801,283
- Issue date Oct 24, 2017
- Murata Manufacturing Co., Ltd.
- Kazuto Ogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARABLE MODULES PCB MODULES
- Publication number 20210385945
- Publication date Dec 9, 2021
- SIGNIFY HOLDING B.V.
- REMCO CHRISTIANUS WILHELMUS LEERMAKERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20200178402
- Publication date Jun 4, 2020
- InnoLux Corporation
- Pai-Chi TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC-METAL LAYER ASSEMBLY, METHOD FOR M...
- Publication number 20200146144
- Publication date May 7, 2020
- MITSUBISHI MATERIALS CORPORATION
- Koya Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE PRINTED CIRCUIT...
- Publication number 20190387618
- Publication date Dec 19, 2019
- Endress+Hauser SE+Co. KG
- Harald Schäuble
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC STRIP YARN
- Publication number 20190003084
- Publication date Jan 3, 2019
- NOTTINGHAM TRENT UNIVERSITY
- Tilak Kithsiri Dias
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Application
ELECTRONIC CIRCUIT BOARD, AND PRODUCTION METHOD THEREFOR
- Publication number 20180001683
- Publication date Jan 4, 2018
- KOMURA-TECH CO., LTD.
- Tadashi Kawamoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
VERSATILE AND RELIABLE INTELLIGENT PACKAGE
- Publication number 20170330845
- Publication date Nov 16, 2017
- STORA ENSO OYJ
- Juha MAIJALA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONEN...
- Publication number 20170079137
- Publication date Mar 16, 2017
- MURATA MANUFACTURING CO., LTD.
- Yukio MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BREAKAWAY RFID TAGS
- Publication number 20170068882
- Publication date Mar 9, 2017
- NEOLOGY, INC.
- Paul Elizondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COLLECTIVE SUBSTRATE FOR RESISTOR DEVICES
- Publication number 20170064834
- Publication date Mar 2, 2017
- Murata Manufacturing Co., Ltd.
- Kazuo HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND PROCESS FOR ATTACHING DEVICES TO A CIRCUIT BOARD
- Publication number 20140317917
- Publication date Oct 30, 2014
- Signalcraft Technologies
- Bernard Gobeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20140305683
- Publication date Oct 16, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE RIBBON LED MODULE
- Publication number 20140247595
- Publication date Sep 4, 2014
- Justin Lind
- F21 - LIGHTING
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATION METHOD THEREOF
- Publication number 20140216787
- Publication date Aug 7, 2014
- Hung-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE
- Publication number 20140174803
- Publication date Jun 26, 2014
- Jyun Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PIECE SUBSTRATE
- Publication number 20140146500
- Publication date May 29, 2014
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CARD WITH A CUTTABLE GOLDFINGER STRUCTURE
- Publication number 20140124240
- Publication date May 8, 2014
- Wistron Corporation
- Kuei-Yung Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC ASSEMBLED BOARD, METHOD OF MANUFACTURING THE SAME, CERAMIC...
- Publication number 20140106129
- Publication date Apr 17, 2014
- Hitachi Metals, Ltd.
- Hiroyuki Teshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMMABLE, HIGH-EFFICIENCY LED LINEAR LIGHTING SYSTEM WITH INTERCHAN...
- Publication number 20140092596
- Publication date Apr 3, 2014
- Linear Lighting Corp.
- Lawrence Adam Deutsch
- F21 - LIGHTING
Information Patent Application
Foldable Machines
- Publication number 20140078699
- Publication date Mar 20, 2014
- Daniela Rus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE ARRAY, AND MANUFACTU...
- Publication number 20140037912
- Publication date Feb 6, 2014
- NGK Spark Plug Co., Ltd.
- Masami Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING BOARD, MULTI-PIECE CERAMIC WIRING BOARD, AND METHOD...
- Publication number 20140034372
- Publication date Feb 6, 2014
- NGK Spark Plug Co., Ltd.
- Masami Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR PROD...
- Publication number 20140034369
- Publication date Feb 6, 2014
- NGK Spark Plug Co., Ltd.
- Masami Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...
- Publication number 20130294034
- Publication date Nov 7, 2013
- Koichi KANRYO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A COMBINED CIRCUIT BOARD
- Publication number 20130292050
- Publication date Nov 7, 2013
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Shi Yu Chiou
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEM AND METHOD FOR DETECTING VENTING OF A SEALED STORAGE CELL
- Publication number 20130280559
- Publication date Oct 24, 2013
- SAFT
- Laurent GUIDAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND M...
- Publication number 20130232783
- Publication date Sep 12, 2013
- MITSUBISHI MATERIALS CORPORATION
- Hiroshi Tonomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS
- Publication number 20130228804
- Publication date Sep 5, 2013
- LedEngin, Inc.
- Xiantao Yan
- F21 - LIGHTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130229778
- Publication date Sep 5, 2013
- LG Innotek Co., Ltd.
- Chung Sang RYOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Preformed cutting or breaking line

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lighting strip

Method for manufacturing flexible circuit board

Separable modules PCB modules

Main board with integrated trusted platform module for a computer d...

Printed circuit board and method for producing the printed circuit...

Electronic control unit

Motherboard to be cut

Method for manufacturing ceramic-metal layer assembly, method for m...

Versatile and reliable intelligent package

Method for manufacturing an electronic strip yarn

Method for manufacturing circuit board, and circuit board

Image pickup apparatus and method for manufacturing image pickup ap...

Display device and method for fabricating the same

Package substrates and methods of fabricating the same

Method for producing electronic components

Electronic circuit board, and production method therefor

Mother ceramic substrate, ceramic substrate, mother module componen...

Flexible substrate with conductive layer for mounting LED arrays

Systems and methods for synchronizing a plurality of RFID interroga...

Variable width printed circuit board using surface mount technology...

Flexible circuit substrate with temporary supports and equalized la...

Systems and methods for stirring electromagnetic fields and interro...

Printed circuit board and method of manufacturing the same

Manufacturing method of part-mounting package

Combined wiring board and method for manufacturing the same

Suspension board with circuit assembly sheet

Method of producing electronic components and method of producing s...

Collective substrate for resistor devices

Method and system for forming LED light emitters

Method of producing electronic components

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

SEPARABLE MODULES PCB MODULES

METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

METHOD FOR MANUFACTURING CERAMIC-METAL LAYER ASSEMBLY, METHOD FOR M...

PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING THE PRINTED CIRCUIT...

ELECTRONIC STRIP YARN

ELECTRONIC CIRCUIT BOARD, AND PRODUCTION METHOD THEREFOR

VERSATILE AND RELIABLE INTELLIGENT PACKAGE

MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONEN...

SYSTEMS AND METHODS FOR BREAKAWAY RFID TAGS

COLLECTIVE SUBSTRATE FOR RESISTOR DEVICES

APPARATUS AND PROCESS FOR ATTACHING DEVICES TO A CIRCUIT BOARD

COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...

FLEXIBLE RIBBON LED MODULE

PRINTED CIRCUIT BOARD AND FABRICATION METHOD THEREOF

WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE

MULTI-PIECE SUBSTRATE

TEST CARD WITH A CUTTABLE GOLDFINGER STRUCTURE

CERAMIC ASSEMBLED BOARD, METHOD OF MANUFACTURING THE SAME, CERAMIC...

DIMMABLE, HIGH-EFFICIENCY LED LINEAR LIGHTING SYSTEM WITH INTERCHAN...

Foldable Machines

WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE ARRAY, AND MANUFACTU...

CERAMIC WIRING BOARD, MULTI-PIECE CERAMIC WIRING BOARD, AND METHOD...

WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR PROD...

METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE AND ELECTRONIC...

METHOD OF MANUFACTURING A COMBINED CIRCUIT BOARD

SYSTEM AND METHOD FOR DETECTING VENTING OF A SEALED STORAGE CELL

CERAMIC SUBSTRATE, METHOD OF MANUFACTURING CERAMIC SUBSTRATE, AND M...

METHOD AND SYSTEM FOR FORMING LED LIGHT EMITTERS

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME