Preheating

Industry

CPC
H05K2203/111

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/111Preheating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test element support
- Patent number 11,911,768
- Issue date Feb 27, 2024
- Roche Diagnostics Operations, Inc.
- Reiner Stein
- G01 - MEASURING TESTING
Information Patent Grant
Reflow oven with a controllably connected blocked exhaust zone
- Patent number 11,697,168
- Issue date Jul 11, 2023
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflowable grid array to support grid heating
- Patent number 11,545,408
- Issue date Jan 3, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for repairing conductor tracks
- Patent number 11,419,219
- Issue date Aug 16, 2022
- XTPL S.A.
- Piotr Kowalczewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Facilitating filling a plated through-hole of a circuit board with...
- Patent number 11,051,407
- Issue date Jun 29, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating of printed circuit board core during laminate cure
- Patent number 11,044,819
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Eric J. Campbell
- B32 - LAYERED PRODUCTS
Information Patent Grant
LED-based UV radiation source machine
- Patent number 10,980,128
- Issue date Apr 13, 2021
- Brian A. Stumm
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 10,959,339
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repairing defective through-holes
- Patent number 10,952,330
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Prabjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and arrangement for attaching a chip to a printed conductive...
- Patent number RE48018
- Issue date May 26, 2020
- Stora Enso Oyj
- Juha Maijala
Information Patent Grant
LED-based UV radiation source machine to process coatings
- Patent number 10,548,226
- Issue date Jan 28, 2020
- Brian A. Stumm
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Ball grid array rework
- Patent number 10,546,828
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing same
- Patent number 10,492,306
- Issue date Nov 26, 2019
- Kuraray Co., Ltd.
- Takeshi Takahashi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method to neutralize incorrectly oriented printed diodes
- Patent number 10,412,833
- Issue date Sep 10, 2019
- NthDegree Technologies Worldwide Inc.
- Richard Austin Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating of printed circuit board core during laminate cure
- Patent number 10,285,283
- Issue date May 7, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for interconnecting circuitry
- Patent number 10,212,827
- Issue date Feb 19, 2019
- Intel Corporation
- John J. Browne
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical components and methods and systems of manufacturing elec...
- Patent number 10,154,595
- Issue date Dec 11, 2018
- TE Connectivity Corporation
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED-based UV radiation source machine to process coatings
- Patent number 10,111,337
- Issue date Oct 23, 2018
- Brian A. Stumm
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method and arrangement for transferring electrically conductive mat...
- Patent number 10,085,350
- Issue date Sep 25, 2018
- Stora Enso Oyj
- Juha Maijala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of intra-structure conductive traces and interconnects...
- Patent number 10,039,195
- Issue date Jul 31, 2018
- Facebook, Inc.
- Baback Elmieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Two-step, direct-write laser metallization
- Patent number 10,015,887
- Issue date Jul 3, 2018
- Orbotech Ltd.
- Michael Zenou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 10,010,000
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array rework
- Patent number 9,978,706
- Issue date May 22, 2018
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic device
- Patent number 9,761,556
- Issue date Sep 12, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshitada Higashizawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module produced by sequential fixation of the components
- Patent number 9,706,694
- Issue date Jul 11, 2017
- Valeo Systemes de Controle Moteur
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with thermal control
- Patent number 9,693,446
- Issue date Jun 27, 2017
- Endress + Hauser Conducta GmbH + Co. KG
- Thomas Ragg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible display apparatus and method of controlling flexibility of...
- Patent number 9,693,391
- Issue date Jun 27, 2017
- Samsung Display Co., Ltd.
- Cheol Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component assembly apparatus
- Patent number 9,545,044
- Issue date Jan 10, 2017
- Fujitsu Limited
- Katsumi Takada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD
- Publication number 20240314935
- Publication date Sep 19, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Low-Solvent Fiber-Free Dielectric Layer
- Publication number 20220078923
- Publication date Mar 10, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING CONDUCTOR TRACKS
- Publication number 20210227700
- Publication date Jul 22, 2021
- Piotr KOWALCZEWSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIRING DEFECTIVE THROUGH-HOLES
- Publication number 20200245469
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...
- Publication number 20200128676
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE
- Publication number 20190200463
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Grid Array Rework
- Publication number 20180190609
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20180139851
- Publication date May 17, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE
- Publication number 20170354043
- Publication date Dec 7, 2017
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20160270240
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-STEP, DIRECT-WRITE LASER METALLIZATION
- Publication number 20150382476
- Publication date Dec 31, 2015
- ORBOTECH LTD.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...
- Publication number 20150319865
- Publication date Nov 5, 2015
- Tyco Electronics Corporation
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE DISPLAY APPARATUS AND METHOD OF CONTROLLING FLEXIBILITY OF...
- Publication number 20140361004
- Publication date Dec 11, 2014
- SAMSUNG DISPLAY CO., LTD.
- Cheol Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING ELECTRICAL ISOLATION OF PATTERNED TRANSPARENT...
- Publication number 20140352144
- Publication date Dec 4, 2014
- CARESTREAM HEALTH, INC.
- Robert J. Monson
- B82 - NANO-TECHNOLOGY
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20140345123
- Publication date Nov 27, 2014
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREHEAT MODULE, PREHEAT ZONE AND PREHEAT SECTION USING THE SAME
- Publication number 20140109431
- Publication date Apr 24, 2014
- Wen-fu LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...
- Publication number 20140097002
- Publication date Apr 10, 2014
- Tyco Electronics AMP GmbH
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING OF STACKS OF MULTILAYER PLASTIC LAMINATES FOR PRINTED...
- Publication number 20140020245
- Publication date Jan 23, 2014
- CEDAL EQUIPMENT SRL
- Bruno Ceraso
- B32 - LAYERED PRODUCTS
Information Patent Application
HEATING AND HEAT DISSIPATING MULTI-LAYER CIRCUIT BOARD STRUCTURE FO...
- Publication number 20140016261
- Publication date Jan 16, 2014
- MOXA INC.
- Tzu Cheng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FI...
- Publication number 20130301231
- Publication date Nov 14, 2013
- VALEO SYSTEMES DE CONTROLE MOTEUR
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...
- Publication number 20130291378
- Publication date Nov 7, 2013
- Shinko Electric Industries Co., Ltd.
- Yoshitada HIGASHIZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH EMBEDDED HEATER
- Publication number 20130180973
- Publication date Jul 18, 2013
- Gil White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF...
- Publication number 20130148320
- Publication date Jun 13, 2013
- Bruno Lefevre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR FORMING CIRCUIT PATTERN ON PCB AND METHOD FOR FORMING...
- Publication number 20130115369
- Publication date May 9, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR HEATING FLOWING FLUIDS AND PRODUCTION METHOD
- Publication number 20120330234
- Publication date Dec 27, 2012
- BARKEY GMBH & CO. KG
- Michael Balluff
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ASSEMBLY APPARATUS
- Publication number 20120275128
- Publication date Nov 1, 2012
- Fujitsu Limited
- Katsumi TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE
- Publication number 20120138339
- Publication date Jun 7, 2012
- picoDrill SA
- Leander Dittmann
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Method Of Manufacturing Semiconductor Package Board
- Publication number 20120122278
- Publication date May 17, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwan Ho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier with low-solvent fiber-free dielectric layer

Method for soldering an electronic component to a circuit board by...

Test element support

Reflow oven with a controllably connected blocked exhaust zone

Reflowable grid array to support grid heating

Method for repairing conductor tracks

Facilitating filling a plated through-hole of a circuit board with...

Heating of printed circuit board core during laminate cure

LED-based UV radiation source machine

Manufacturing a product using a soldering process

Repairing defective through-holes

Method and arrangement for attaching a chip to a printed conductive...

LED-based UV radiation source machine to process coatings

Ball grid array rework

Circuit board and method for manufacturing same

Method to neutralize incorrectly oriented printed diodes

Heating of printed circuit board core during laminate cure

Apparatus for interconnecting circuitry

Electrical components and methods and systems of manufacturing elec...

LED-based UV radiation source machine to process coatings

Method and arrangement for transferring electrically conductive mat...

Fabrication of intra-structure conductive traces and interconnects...

Two-step, direct-write laser metallization

Manufacturing a product using a soldering process

Ball grid array rework

Method of manufacturing electronic device

Electronic module produced by sequential fixation of the components

Circuit board with thermal control

Flexible display apparatus and method of controlling flexibility of...

Electronic component assembly apparatus

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD

Method for Soldering an Electronic Component to a Circuit Board by...

Component Carrier With Low-Solvent Fiber-Free Dielectric Layer

METHOD FOR REPAIRING CONDUCTOR TRACKS

REPAIRING DEFECTIVE THROUGH-HOLES

FACILITATING FILLING A PLATED THROUGH-HOLE OF A CIRCUIT BOARD WITH...

HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE

Ball Grid Array Rework

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

TWO-STEP, DIRECT-WRITE LASER METALLIZATION

ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...

FLEXIBLE DISPLAY APPARATUS AND METHOD OF CONTROLLING FLEXIBILITY OF...

METHODS FOR IMPROVING ELECTRICAL ISOLATION OF PATTERNED TRANSPARENT...

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

PREHEAT MODULE, PREHEAT ZONE AND PREHEAT SECTION USING THE SAME

ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...

MANUFACTURING OF STACKS OF MULTILAYER PLASTIC LAMINATES FOR PRINTED...

HEATING AND HEAT DISSIPATING MULTI-LAYER CIRCUIT BOARD STRUCTURE FO...

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY MEANS OF SEQUENTIAL FI...

METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT...

PRINTED CIRCUIT BOARD WITH EMBEDDED HEATER

METHOD FOR PRODUCING AN ELECTRONIC MODULE BY SEQUENTIAL FIXATION OF...

APPARATUS FOR FORMING CIRCUIT PATTERN ON PCB AND METHOD FOR FORMING...

DEVICE FOR HEATING FLOWING FLUIDS AND PRODUCTION METHOD

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT ASSEMBLY APPARATUS

METHOD OF PRODUCING AN ELECTRICALLY CONDUCTING VIA IN A SUBSTRATE

Method Of Manufacturing Semiconductor Package Board