Preparing wafers

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H01L21/02002

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02002Preparing wafers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a composite structure comprising a thin la...
- Patent number 12,159,781
- Issue date Dec 3, 2024
- Soitec
- Hugo Biard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon carbide composite wafer and manufacturing method thereof
- Patent number 12,159,855
- Issue date Dec 3, 2024
- HONG CHUANG APPLIED TECHNOLOGY CO., LTD
- Yan-Kai Zeng
- C30 - CRYSTAL GROWTH
Information Patent Grant
Showerhead faceplates with angled gas distribution passages for sem...
- Patent number 12,139,791
- Issue date Nov 12, 2024
- Lam Research Corporation
- Pratik Mankidy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon carbide wafer and semiconductor device applied the same
- Patent number 12,136,653
- Issue date Nov 5, 2024
- SENIC INC.
- Jung Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor appar...
- Patent number 12,131,966
- Issue date Oct 29, 2024
- Kabushiki Kaisha Toshiba
- Fuyuma Ito
- C30 - CRYSTAL GROWTH
Information Patent Grant
Pseudo-substrate with improved efficiency of usage of single crysta...
- Patent number 12,112,976
- Issue date Oct 8, 2024
- Soitec
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Grant
Structures for radiofrequency applications and related methods
- Patent number 11,923,239
- Issue date Mar 5, 2024
- Soitec
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method making the same
- Patent number 11,894,226
- Issue date Feb 6, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- PingHeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress patterning systems and methods for manufacturing free-form d...
- Patent number 11,879,170
- Issue date Jan 23, 2024
- Massachusetts Institute of Technology
- Youwei Yao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Recycle wafer of silicon carbide and method for manufacturing silic...
- Patent number 11,862,684
- Issue date Jan 2, 2024
- Sumitomo Electric Industries, Ltd.
- Tsubasa Honke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate
- Patent number 11,837,463
- Issue date Dec 5, 2023
- Soitec
- Pascal Guenard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple zone heater
- Patent number 11,823,890
- Issue date Nov 21, 2023
- Watlow Electric Manufacturing Company
- Alfred Grant Elliot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonplanar wafer and method for producing a nonplanar wafer
- Patent number 11,786,995
- Issue date Oct 17, 2023
- Siltectra GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for preferential etching of dislocation of silico...
- Patent number 11,784,038
- Issue date Oct 10, 2023
- ZJU-Hangzhou Global Scientific and Technological Innovation Center
- Jiajun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supports for a semiconductor structure and associated wafers for an...
- Patent number 11,735,685
- Issue date Aug 22, 2023
- Soitec
- David Sotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
N-type silicon single crystal production method, n-type silicon sin...
- Patent number 11,702,760
- Issue date Jul 18, 2023
- Sumco Corporation
- Koichi Maegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride epitaxial structures for power devices
- Patent number 11,699,750
- Issue date Jul 11, 2023
- QROMIS, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a layer of solid material
- Patent number 11,699,616
- Issue date Jul 11, 2023
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer with modified surface and fabrication method th...
- Patent number 11,682,549
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor epitaxy bordering isolation structure
- Patent number 11,658,032
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic device and method for manufacturing a microfluidic device
- Patent number 11,607,683
- Issue date Mar 21, 2023
- IMT MASKEN UND TEILUNGEN AG
- Tobias Bauert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve active p-type layer/layers in III-nitrtde epitaxi...
- Patent number 11,588,096
- Issue date Feb 21, 2023
- The Regents of the University of California
- Yuuki Enatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sound-assisted crack propagation for semiconductor wafering
- Patent number 11,504,882
- Issue date Nov 22, 2022
- Arizona Board of Regents on behalf of Arizona State University
- Mariana Bertoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple zone heater
- Patent number 11,495,450
- Issue date Nov 8, 2022
- Watlow Electric Manufacturing Company
- Alfred Grant Elliot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide ingot, method of preparing the same, and method for...
- Patent number 11,466,383
- Issue date Oct 11, 2022
- SENIC INC.
- Jong Hwi Park
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Device chip manufacturing method
- Patent number 11,469,142
- Issue date Oct 11, 2022
- Disco Corporation
- Frank Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor ICF target processing
- Patent number 11,443,937
- Issue date Sep 13, 2022
- INNOVEN ENERGY LLC
- Tyler A. Lowrey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Liquid ejection head and method of manufacturing the same
- Patent number 11,433,667
- Issue date Sep 6, 2022
- Canon Kabushiki Kaisha
- Tomohiro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting of semiconductor-on-diamond wafers for device processing
- Patent number 11,404,300
- Issue date Aug 2, 2022
- Daniel Francis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor on insulator type structur...
- Patent number 11,373,898
- Issue date Jun 28, 2022
- Soitec
- Daniel Delprat
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR WAFER TREATMENT
- Publication number 20240420946
- Publication date Dec 19, 2024
- Hua Hsu Silicon Materials Co., Ltd.
- Chiao-Yang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING ROLLS AND MEMBRANES OF SUBMICROMETRIC THICKNE...
- Publication number 20240304460
- Publication date Sep 12, 2024
- INSTITUTO SUPERIOR TECNICO
- Katharina LORENZ
- C30 - CRYSTAL GROWTH
Information Patent Application
COMPOUND SEMICONDUCTOR LAYERED STRUCTURES AND PROCESSES FOR MAKING...
- Publication number 20240258105
- Publication date Aug 1, 2024
- Markus LEITGEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING METALLIZATION
- Publication number 20240254645
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MULTIPLE LOCATION COMPRESSING BONDED ARM-POISEDON...
- Publication number 20240203797
- Publication date Jun 20, 2024
- TOKYO ELECTRON LIMITED
- Andrew WELOTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EVALUATION METHOD, WAFER PRODUCTION METHOD AND DEVICE PRODUCT...
- Publication number 20240203769
- Publication date Jun 20, 2024
- Resonac Corporation
- Ling GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PRETREATED COMPOSITE SUBSTRATE, AND PRETREAT...
- Publication number 20240055251
- Publication date Feb 15, 2024
- mi2-factory GmbH
- Constantin CSATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL MATERIAL AND HETEROSTRUCTURES ON AN INTERMEDIATE PO...
- Publication number 20240047202
- Publication date Feb 8, 2024
- Danmarks Tekniske Universitet
- Abhay Shivayogimath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
- Publication number 20240030033
- Publication date Jan 25, 2024
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SUBSTRATE
- Publication number 20240014027
- Publication date Jan 11, 2024
- SOITEC
- Pascal Guenard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUBSTRATE FOR EPITAXIAL GROWTH OF A GALLIUM-...
- Publication number 20230411140
- Publication date Dec 21, 2023
- SOITEC
- Eric Guiot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaAs WAFER AND METHOD OF PRODUCING GaAs INGOT
- Publication number 20230392291
- Publication date Dec 7, 2023
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Naoya SUNACHI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE
- Publication number 20230395418
- Publication date Dec 7, 2023
- EV GROUP E. THALLNER GMBH
- Boris Povazay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC...
- Publication number 20230317443
- Publication date Oct 5, 2023
- nD-HI Technologies Lab,Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TREATMENT METHOD
- Publication number 20230317527
- Publication date Oct 5, 2023
- NISSAN CHEMICAL CORPORATION
- Tomoya OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20230307286
- Publication date Sep 28, 2023
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
N-TYPE SILICON SINGLE CRYSTAL PRODUCTION METHOD, N-TYPE SILICON SIN...
- Publication number 20230295835
- Publication date Sep 21, 2023
- SUMCO CORPORATION
- Koichi MAEGAWA
- C30 - CRYSTAL GROWTH
Information Patent Application
FUSION BOND BASED WAFER-LEVEL-PACKAGE FOR MID-INFRARED GAS SENSOR S...
- Publication number 20230296502
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Christoph Kovatsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20230299025
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Yuji Setta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE EPITAXIAL STRUCTURES FOR POWER DEVICES
- Publication number 20230261101
- Publication date Aug 17, 2023
- QROMIS, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM
- Publication number 20230207331
- Publication date Jun 29, 2023
- TOKYO ELECTRON LIMITED
- Takuo Kawauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...
- Publication number 20230197435
- Publication date Jun 22, 2023
- SOITEC
- Hugo Biard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, SEMI...
- Publication number 20230178368
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Hiroyuki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...
- Publication number 20230160102
- Publication date May 25, 2023
- SOITEC
- Hugo Biard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REMOVABLE STRUCTURE USED FOR THE TRANSFER OR MANIPULATION OF LAYERS...
- Publication number 20230154755
- Publication date May 18, 2023
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François-Xavier Darras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR WAFER BONDING
- Publication number 20230135060
- Publication date May 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM OXIDE SEMICONDUCTOR STRUCTURE, VERTICAL GALLIUM OXIDE-BASED...
- Publication number 20230127051
- Publication date Apr 27, 2023
- SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY...
- Xin OU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Preferential Etching of Dislocation of Silico...
- Publication number 20230123599
- Publication date Apr 20, 2023
- ZJU-Hangzhou Global Scientific and Technological Innovation Center
- Jiajun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING
- Publication number 20230102291
- Publication date Mar 30, 2023
- Arizona Board of Regents on behalf of Arizona State University
- Mariana BERTONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Analysis System
- Publication number 20230055155
- Publication date Feb 23, 2023
- Hitachi High-Tech Corporation
- Tsunenori NOMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Preparing wafers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a composite structure comprising a thin la...

Silicon carbide composite wafer and manufacturing method thereof

Showerhead faceplates with angled gas distribution passages for sem...

Silicon carbide wafer and semiconductor device applied the same

Semiconductor wafer and method of manufacturing semiconductor appar...

Pseudo-substrate with improved efficiency of usage of single crysta...

Structures for radiofrequency applications and related methods

Semiconductor device and method making the same

Stress patterning systems and methods for manufacturing free-form d...

Recycle wafer of silicon carbide and method for manufacturing silic...

Method for manufacturing a substrate

Multiple zone heater

Nonplanar wafer and method for producing a nonplanar wafer

Method and device for preferential etching of dislocation of silico...

Supports for a semiconductor structure and associated wafers for an...

N-type silicon single crystal production method, n-type silicon sin...

Gallium nitride epitaxial structures for power devices

Method for producing a layer of solid material

Semiconductor wafer with modified surface and fabrication method th...

Semiconductor epitaxy bordering isolation structure

Microfluidic device and method for manufacturing a microfluidic device

Method to achieve active p-type layer/layers in III-nitrtde epitaxi...

Sound-assisted crack propagation for semiconductor wafering

Multiple zone heater

Silicon carbide ingot, method of preparing the same, and method for...

Device chip manufacturing method

Semiconductor ICF target processing

Liquid ejection head and method of manufacturing the same

Mounting of semiconductor-on-diamond wafers for device processing

Method for manufacturing a semiconductor on insulator type structur...

Patents Applicationslast 30 patents

METHOD FOR WAFER TREATMENT

PROCESS FOR PRODUCING ROLLS AND MEMBRANES OF SUBMICROMETRIC THICKNE...

COMPOUND SEMICONDUCTOR LAYERED STRUCTURES AND PROCESSES FOR MAKING...

LOW TEMPERATURE HYBRID BONDING METALLIZATION

THREE-DIMENSIONAL MULTIPLE LOCATION COMPRESSING BONDED ARM-POISEDON...

WAFER EVALUATION METHOD, WAFER PRODUCTION METHOD AND DEVICE PRODUCT...

METHOD FOR PRODUCING A PRETREATED COMPOSITE SUBSTRATE, AND PRETREAT...

TWO-DIMENSIONAL MATERIAL AND HETEROSTRUCTURES ON AN INTERMEDIATE PO...

METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...

METHOD FOR MANUFACTURING A SUBSTRATE

METHOD FOR PRODUCING A SUBSTRATE FOR EPITAXIAL GROWTH OF A GALLIUM-...

GaAs WAFER AND METHOD OF PRODUCING GaAs INGOT

METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE

COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC...

WAFER TREATMENT METHOD

Method for Producing a Layer of Solid Material

N-TYPE SILICON SINGLE CRYSTAL PRODUCTION METHOD, N-TYPE SILICON SIN...

FUSION BOND BASED WAFER-LEVEL-PACKAGE FOR MID-INFRARED GAS SENSOR S...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS

GALLIUM NITRIDE EPITAXIAL STRUCTURES FOR POWER DEVICES

BONDING SYSTEM

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...

COMPOSITE SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE, SEMI...

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...

REMOVABLE STRUCTURE USED FOR THE TRANSFER OR MANIPULATION OF LAYERS...

METHOD AND APPARATUS FOR WAFER BONDING

GALLIUM OXIDE SEMICONDUCTOR STRUCTURE, VERTICAL GALLIUM OXIDE-BASED...

Method and Device for Preferential Etching of Dislocation of Silico...

SOUND-ASSISTED CRACK PROPAGATION FOR SEMICONDUCTOR WAFERING

Semiconductor Analysis System