Presence of a frame in a printed circuit or printed circuit assembly

Industry

CPC
H05K2201/2018

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/2018Presence of a frame in a printed circuit or printed circuit assembly

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate frame design for three-dimensional stacked electronic ass...
- Patent number 12,278,172
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- Akash Agrawal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device for fixing camera module circuit board, and camera module
- Patent number 12,213,255
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Kwang Sung Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Shielded interconnect system
- Patent number 12,167,582
- Issue date Dec 10, 2024
- GITech, Inc.
- John Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 12,101,881
- Issue date Sep 24, 2024
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including cable modules
- Patent number 12,089,357
- Issue date Sep 10, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 12,041,732
- Issue date Jul 16, 2024
- Polaris Industries Inc.
- Mark A. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and array camera module based on integral packaging t...
- Patent number 12,035,029
- Issue date Jul 9, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power converter
- Patent number 11,997,837
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Taketo Nishiyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Fixing device
- Patent number 11,917,784
- Issue date Feb 27, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Yu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing device incorporating electronic circuit-board unit includi...
- Patent number 11,904,611
- Issue date Feb 20, 2024
- Brother Kogyo Kabushiki Kaisha
- Yusuke Ikemoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Device for fixing camera module circuit board, and camera module
- Patent number 11,856,697
- Issue date Dec 26, 2023
- LG Innotek Co., Ltd
- Kwang Sung Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite wiring board, package, and electronic device
- Patent number 11,849,538
- Issue date Dec 19, 2023
- NGK Electronics Devices, Inc.
- Noboru Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with connector structure
- Patent number 11,839,027
- Issue date Dec 5, 2023
- Wistron NeWeb Corp.
- Yan-Da Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 11,825,604
- Issue date Nov 21, 2023
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, composite substrate, and electric device
- Patent number 11,778,747
- Issue date Oct 3, 2023
- Kyocera Corporation
- Toshifumi Higashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional foldable substrate with vertical side interface
- Patent number 11,758,662
- Issue date Sep 12, 2023
- Intel Corporation
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Near-hermetic package with flexible signal input and output
- Patent number 11,729,933
- Issue date Aug 15, 2023
- TTM Technologies, Inc.
- Michael Len
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including structure for stacking substrates
- Patent number 11,696,404
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Manho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical support within moulded chip package
- Patent number 11,659,663
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Device for fixing camera module circuit board, and camera module
- Patent number 11,602,052
- Issue date Mar 7, 2023
- LG Innotek Co., Ltd
- Kwang Sung Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module and array camera module based on integral packaging t...
- Patent number 11,533,416
- Issue date Dec 20, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Instrument drive units
- Patent number 11,523,509
- Issue date Dec 6, 2022
- Covidien LP
- Chi Min Seow
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of forming a capacitive loop substrate assembly
- Patent number 11,521,943
- Issue date Dec 6, 2022
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly including cable modules
- Patent number 11,477,904
- Issue date Oct 18, 2022
- TE CONNECTIVITY SOLUTIONS GmbH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantable connector including at least one electrical component
- Patent number 11,450,977
- Issue date Sep 20, 2022
- Verily Life Sciences LLC
- Kedar Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow shielding structure for different types of circuit elements...
- Patent number 11,445,645
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Keon Kuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for heat removal using a thermal potting solution...
- Patent number 11,439,001
- Issue date Sep 6, 2022
- Dell Products L.P.
- Iris Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board-to-board connector
- Patent number 11,417,975
- Issue date Aug 16, 2022
- Japan Aviation Electronics Industry, Ltd.
- Junji Oosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional foldable substrate with vertical side interface
- Patent number 11,375,617
- Issue date Jun 28, 2022
- Intel Corporation
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS
- Publication number 20250168987
- Publication date May 22, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250142729
- Publication date May 1, 2025
- SAMSUNG DISPLAY CO., LTD.
- Youngjin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE
- Publication number 20250133659
- Publication date Apr 24, 2025
- LG Innotek Co., Ltd.
- Kwang Sung KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STORAGE DEVICE
- Publication number 20250089170
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Suin KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250016912
- Publication date Jan 9, 2025
- KYOCERA CORPORATION
- Takafumi OYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE ELECTRONIC DEVICE COMPRISING RIGID FLEXIBLE PRINTED CIRCUI...
- Publication number 20240427376
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Hansol KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240237200
- Publication date Jul 11, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
- Publication number 20240155759
- Publication date May 9, 2024
- International Business Machines Corporation
- Shawn Anthony Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE
- Publication number 20240080983
- Publication date Mar 7, 2024
- LG Innotek Co., Ltd.
- Kwang Sung KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20230413441
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MODULE
- Publication number 20230389188
- Publication date Nov 30, 2023
- YAZAKI CORPORATION
- Hidehiko Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MODULE
- Publication number 20230389187
- Publication date Nov 30, 2023
- YAZAKI CORPORATION
- Hidehiko Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE
- Publication number 20230156919
- Publication date May 18, 2023
- LG Innotek Co., Ltd.
- Kwang Sung KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Circuit Board Assembly
- Publication number 20230123068
- Publication date Apr 20, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXING DEVICE
- Publication number 20230081766
- Publication date Mar 16, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Yu HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY FOR A VEHICLE DISPLAY
- Publication number 20230056939
- Publication date Feb 23, 2023
- Polaris Industries Inc.
- Mark A. POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER DEVICE FOR AN M.2 TYPE CONNECTOR
- Publication number 20230041681
- Publication date Feb 9, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Pascal GUYOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES
- Publication number 20230025397
- Publication date Jan 26, 2023
- TE Connectivity Solutions GMBH
- Christopher William Blackburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION MECHANISMS FOR COUPLING PRINTED CIRCUIT BOARD MODULES TO...
- Publication number 20230008535
- Publication date Jan 12, 2023
- Smith & Nephew, Inc.
- Sied W. Janna
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ESD SUPPRESSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20220418095
- Publication date Dec 29, 2022
- SFI Electronics Technology Inc.
- CHING HOHN LIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING ANTENNA AND PRINTED CIRCUIT BOARD
- Publication number 20220376386
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- Hyungjoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE
- Publication number 20220369460
- Publication date Nov 17, 2022
- Tin Poay Chuah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTING DEVICE INCORPORATING ELECTRONIC CIRCUIT-BOARD UNIT INCLUDI...
- Publication number 20220324228
- Publication date Oct 13, 2022
- BROTHER KOGYO KABUSHIKI KAISHA
- Yusuke IKEMOTO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Camera Module with Compression-Molded Circuit Board and Manufacturi...
- Publication number 20220304148
- Publication date Sep 22, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE WIRING BOARD, PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20220151060
- Publication date May 12, 2022
- NGK Electronics Devices, Inc.
- Noboru KUBO
- G02 - OPTICS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20220141988
- Publication date May 5, 2022
- Mitsubishi Electric Corporation
- Taketo NISHIYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MECHANICAL SUPPORT WITHIN MOULDED CHIP PACKAGE
- Publication number 20220110213
- Publication date Apr 7, 2022
- Murata Manufacturing Co., Ltd.
- Kimmo KAIJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNIT WITH WIRING BOARD, MODULE, AND EQUIPMENT
- Publication number 20220030716
- Publication date Jan 27, 2022
- Canon Kabushiki Kaisha
- Satoshi Nozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Interconnect System
- Publication number 20220022348
- Publication date Jan 20, 2022
- GITech, Inc.
- John Williams
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE WITH CONNECTOR STRUCTURE
- Publication number 20220015235
- Publication date Jan 13, 2022
- WISTRON NEWEB CORP.
- Yan-Da CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Presence of a frame in a printed circuit or printed circuit assembly

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate frame design for three-dimensional stacked electronic ass...

Device for fixing camera module circuit board, and camera module

Shielded interconnect system

Circuit board assembly

Electronic assembly including cable modules

Electronic assembly for a vehicle display

Camera module and array camera module based on integral packaging t...

Power semiconductor module and power converter

Fixing device

Printing device incorporating electronic circuit-board unit includi...

Device for fixing camera module circuit board, and camera module

Composite wiring board, package, and electronic device

Electronic device with connector structure

Circuit board assembly

Wiring board, composite substrate, and electric device

Three dimensional foldable substrate with vertical side interface

Near-hermetic package with flexible signal input and output

Electronic device including structure for stacking substrates

Mechanical support within moulded chip package

Electronics assemblies for downhole use

Device for fixing camera module circuit board, and camera module

Camera module and array camera module based on integral packaging t...

Instrument drive units

Method of forming a capacitive loop substrate assembly

Electronic assembly including cable modules

Implantable connector including at least one electrical component

Hollow shielding structure for different types of circuit elements...

System and method for heat removal using a thermal potting solution...

Board-to-board connector

Three dimensional foldable substrate with vertical side interface

Patents Applicationslast 30 patents

MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS

ELECTRONIC DEVICE

DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE

STORAGE DEVICE

WIRING BOARD

WEARABLE ELECTRONIC DEVICE COMPRISING RIGID FLEXIBLE PRINTED CIRCUI...

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...

DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE

CIRCUIT BOARD ASSEMBLY

CONDUCTIVE MODULE

CONDUCTIVE MODULE

DEVICE FOR FIXING CAMERA MODULE CIRCUIT BOARD, AND CAMERA MODULE

Circuit Board Assembly

FIXING DEVICE

ELECTRONIC ASSEMBLY FOR A VEHICLE DISPLAY

STIFFENER DEVICE FOR AN M.2 TYPE CONNECTOR

ELECTRONIC ASSEMBLY INCLUDING CABLE MODULES

CONNECTION MECHANISMS FOR COUPLING PRINTED CIRCUIT BOARD MODULES TO...

ESD SUPPRESSOR AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE INCLUDING ANTENNA AND PRINTED CIRCUIT BOARD

THREE DIMENSIONAL FOLDABLE SUBSTRATE WITH VERTICAL SIDE INTERFACE

PRINTING DEVICE INCORPORATING ELECTRONIC CIRCUIT-BOARD UNIT INCLUDI...

Camera Module with Compression-Molded Circuit Board and Manufacturi...

COMPOSITE WIRING BOARD, PACKAGE, AND ELECTRONIC DEVICE

POWER SEMICONDUCTOR MODULE AND POWER CONVERTER

MECHANICAL SUPPORT WITHIN MOULDED CHIP PACKAGE

UNIT WITH WIRING BOARD, MODULE, AND EQUIPMENT

Shielded Interconnect System

ELECTRONIC DEVICE WITH CONNECTOR STRUCTURE