Pretreatment of the circuit board

Industry

CPC
H05K3/1208

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/1208Pretreatment of the circuit board

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal pattern forming method
- Patent number 12,185,472
- Issue date Dec 31, 2024
- FUJIFILM Corporation
- Eijiro Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly method of electronic device
- Patent number 12,096,568
- Issue date Sep 17, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- I-Kai Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for printing silver nanowire harness network structure by us...
- Patent number 12,053,995
- Issue date Aug 6, 2024
- XI'AN JIAOTONG UNIVERSITY
- Jianlei Cui
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Controlled wetting and spreading of metals on substrates using poro...
- Patent number 12,022,610
- Issue date Jun 25, 2024
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal circuits and methods of making the same
- Patent number 11,805,597
- Issue date Oct 31, 2023
- Carnegie Mellon University
- O Burak Ozdoganlar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive manufacturing of electronics having bulk properties
- Patent number 11,786,974
- Issue date Oct 17, 2023
- Hamilton Sundstrand Corporation
- Sameh Dardona
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 11,744,011
- Issue date Aug 29, 2023
- Dai Nippon Printing Co., Ltd.
- Kenichi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 11,665,829
- Issue date May 30, 2023
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of printing ultranarrow line
- Patent number 11,396,610
- Issue date Jul 26, 2022
- National Research Council of Canada
- Ta-Ya Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing graphene circuit pattern
- Patent number 11,372,300
- Issue date Jun 28, 2022
- BOE Technology Group Co., Ltd.
- Bo Hu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Laminate, method for producing the same, and method for forming con...
- Patent number 11,337,316
- Issue date May 17, 2022
- National Institute of Advanced Industrial Science and Technology
- Tatsuo Hasegawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Controlled wetting and spreading of metals on substrates using poro...
- Patent number 11,284,510
- Issue date Mar 22, 2022
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, method and apparatus for producing an electronic...
- Patent number 11,240,916
- Issue date Feb 1, 2022
- CRYOVAC, LLC
- James W. Blease
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing of nanowire films
- Patent number 11,240,917
- Issue date Feb 1, 2022
- TECHNOLOGY INNOVATION MOMENTUM FUND (ISRAEL) LIMITED PARTNERSHIP
- Gil Markovich
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for depositing a metal or metal alloy on a surface of a sub...
- Patent number 10,975,474
- Issue date Apr 13, 2021
- Atotech Deutschland GmbH
- Christian Wendeln
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing structured surfaces
- Patent number 10,941,035
- Issue date Mar 9, 2021
- Leibniz-Institut für Neue Materialien gemeinnützige GmbH
- Johannes H. M. Maurer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanoparticle application with adhesives for printable electronics
- Patent number 10,919,281
- Issue date Feb 16, 2021
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate and circuit board
- Patent number 10,849,231
- Issue date Nov 24, 2020
- Toppan Forms Co., Ltd.
- Akihito Mori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Capacitive devices and methods of fabricating same
- Patent number 10,845,924
- Issue date Nov 24, 2020
- Sun Chemical Corporation
- Mathew Mathew
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Articles and substrates providing improved performance of printable...
- Patent number 10,827,610
- Issue date Nov 3, 2020
- E I du Pont de Nemours and Company
- Michael Stephen Wolfe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Fabrication method of circuit board
- Patent number 10,820,423
- Issue date Oct 27, 2020
- Gold Circuit Electronics Ltd.
- Chih-Hai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
React-on-demand (ROD) fabrication method for high performance print...
- Patent number 10,772,218
- Issue date Sep 8, 2020
- The University of Western Ontario
- Tengyuan Zhang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Transparent electrode and method for manufacturing same
- Patent number 10,750,613
- Issue date Aug 18, 2020
- Research & Business Foundation Sungkyunkwan University
- Hyoyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit and method of manufacturing the same
- Patent number 10,617,001
- Issue date Apr 7, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Haon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,017
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing flexible printed circuit board and flexibl...
- Patent number 10,512,175
- Issue date Dec 17, 2019
- Amogreentech Co., Ltd.
- O-Chung Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 10,477,694
- Issue date Nov 12, 2019
- Dexerials Corporation
- Makiya Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing an electrical device using flexographic plate with protect...
- Patent number 10,334,739
- Issue date Jun 25, 2019
- Eastman Kodak Company
- James S. Honan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,314,174
- Issue date Jun 4, 2019
- Winbond Electronics Corp.
- Yu-Hsuan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and manufacturing method for the multilayer...
- Patent number 10,166,720
- Issue date Jan 1, 2019
- Toyota Jidosha Kabushiki Kaisha
- Takashi Ogawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT MOUNTING BOARD
- Publication number 20240292532
- Publication date Aug 29, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and System for Generating Spray Patterns, Electronic Device,...
- Publication number 20240244759
- Publication date Jul 18, 2024
- VAYO (SHANGHAI) TECHNOLOGY CO., LTD.
- Yongjian QU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING TRANSIENT ELECTRONICS
- Publication number 20240080991
- Publication date Mar 7, 2024
- Accenture Global Solutions Limited
- Tingyu Cheng
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
LIQUID METAL CIRCUITS AND METHODS OF MAKING THE SAME
- Publication number 20240032189
- Publication date Jan 25, 2024
- Carnegie Mellon University
- O Burak Ozdoganlar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD
- Publication number 20240015889
- Publication date Jan 11, 2024
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY METHOD OF ELECTRONIC DEVICE
- Publication number 20230292444
- Publication date Sep 14, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- I-Kai Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD...
- Publication number 20230120298
- Publication date Apr 20, 2023
- Heraeus Deutschland GmbH & Co. KG
- Alan Paul STADNIK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PATTERN FORMING METHOD
- Publication number 20230028779
- Publication date Jan 26, 2023
- FUJIFILM CORPORATION
- Eijiro IWASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED WETTING AND SPREADING OF METALS ON SUBSTRATES USING PORO...
- Publication number 20220167501
- Publication date May 26, 2022
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220015227
- Publication date Jan 13, 2022
- DAI NIPPON PRINTING CO., LTD.
- Kenichi OGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device, Method and Apparatus for Producing an Electronic...
- Publication number 20200107450
- Publication date Apr 2, 2020
- James W. Blease
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR PRINTED CABLE INSTALLATION IN HARNESS SYSTEMS FOR AIRCRAFTS
- Publication number 20190386474
- Publication date Dec 19, 2019
- AIRBUS OPERATIONS (SAS)
- Alain RODEGHIERO
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
CONTROLLED WETTING AND SPREADING OF METALS ON SUBSTRATES USING PORO...
- Publication number 20190320528
- Publication date Oct 17, 2019
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20190159345
- Publication date May 23, 2019
- DEXERIALS CORPORATION
- Makiya ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR FORMING CON...
- Publication number 20190098767
- Publication date Mar 28, 2019
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Tatsuo HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20190008035
- Publication date Jan 3, 2019
- Sumitomo Electric Industries, Ltd.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...
- Publication number 20180371191
- Publication date Dec 27, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FABRICATION METHOD OF CIRCUIT BOARD
- Publication number 20180376601
- Publication date Dec 27, 2018
- Gold Circuit Electronics Ltd.
- Chih-Hai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-RESOLUTION PRINTING TECHNIQUE
- Publication number 20180332712
- Publication date Nov 15, 2018
- CARPE DIEM TECHNOLOGIES, INC.
- John S. Berg
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CAPACITIVE DEVICES AND METHODS OF FABRICATING SAME
- Publication number 20180314359
- Publication date Nov 1, 2018
- SUN CHEMICAL CORPORATION
- Mathew MATHEW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICALLY CONDUCTIVE MATERIALS COMPRISING GRAPHENE
- Publication number 20180242452
- Publication date Aug 23, 2018
- The University of Manchester
- Stephen YEATES
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
FILM COATING AND FILM COATING COMPOSITIONS FOR SURFACE MODIFICATION...
- Publication number 20180208792
- Publication date Jul 26, 2018
- Jun YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...
- Publication number 20180206368
- Publication date Jul 19, 2018
- DIC CORPORATION
- Akira Murakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170347459
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM, COVERLAY FOR PRINTED WIRING BOARD, SUBSTRATE FOR PRINTE...
- Publication number 20170327630
- Publication date Nov 16, 2017
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi KIYA
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170325335
- Publication date Nov 9, 2017
- DEXERIALS CORPORATION
- Makiya ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PARTICLE DISPERSING SOLUTION AND METHOD FOR PRODUCING CONDUC...
- Publication number 20160346838
- Publication date Dec 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hidefumi Fujita
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF FORMING FINE ELECTRODE FOR FLAT PANEL DISPLAY
- Publication number 20160323999
- Publication date Nov 3, 2016
- SAMSUNG DISPLAY CO., LTD.
- Hyun Sup LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...
- Publication number 20160198594
- Publication date Jul 7, 2016
- DIC CORPORATION
- Akira Murakawa
- H01 - BASIC ELECTRIC ELEMENTS

Pretreatment of the circuit board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal pattern forming method

Assembly method of electronic device

Method for printing silver nanowire harness network structure by us...

Controlled wetting and spreading of metals on substrates using poro...

Liquid metal circuits and methods of making the same

Additive manufacturing of electronics having bulk properties

Wiring board and method for manufacturing wiring board

Method for manufacturing wiring board

Method of printing ultranarrow line

Method of preparing graphene circuit pattern

Laminate, method for producing the same, and method for forming con...

Controlled wetting and spreading of metals on substrates using poro...

Electronic device, method and apparatus for producing an electronic...

Printing of nanowire films

Process for depositing a metal or metal alloy on a surface of a sub...

Method for producing structured surfaces

Nanoparticle application with adhesives for printable electronics

Laminate and circuit board

Capacitive devices and methods of fabricating same

Articles and substrates providing improved performance of printable...

Fabrication method of circuit board

React-on-demand (ROD) fabrication method for high performance print...

Transparent electrode and method for manufacturing same

Electronic circuit and method of manufacturing the same

Printed circuit board and electronic component

Method for manufacturing flexible printed circuit board and flexibl...

Wiring board manufacturing method and wiring board

Printing an electrical device using flexographic plate with protect...

Method for manufacturing circuit board

Multilayer wiring board and manufacturing method for the multilayer...

Patents Applicationslast 30 patents

COMPONENT MOUNTING BOARD

Method and System for Generating Spray Patterns, Electronic Device,...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

METHOD OF MANUFACTURING TRANSIENT ELECTRONICS

LIQUID METAL CIRCUITS AND METHODS OF MAKING THE SAME

METHOD FOR PRODUCING WIRING BOARD, AND WIRING BOARD

ASSEMBLY METHOD OF ELECTRONIC DEVICE

ASSEMBLY TO BE USED IN AN INKJET PRINTER, INKJET PRINTER AND METHOD...

METAL PATTERN FORMING METHOD

CONTROLLED WETTING AND SPREADING OF METALS ON SUBSTRATES USING PORO...

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

Electronic Device, Method and Apparatus for Producing an Electronic...

METHOD FOR PRINTED CABLE INSTALLATION IN HARNESS SYSTEMS FOR AIRCRAFTS

CONTROLLED WETTING AND SPREADING OF METALS ON SUBSTRATES USING PORO...

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

LAMINATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR FORMING CON...

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...

FABRICATION METHOD OF CIRCUIT BOARD

HIGH-RESOLUTION PRINTING TECHNIQUE

CAPACITIVE DEVICES AND METHODS OF FABRICATING SAME

ELECTRICALLY CONDUCTIVE MATERIALS COMPRISING GRAPHENE

FILM COATING AND FILM COATING COMPOSITIONS FOR SURFACE MODIFICATION...

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

RESIN FILM, COVERLAY FOR PRINTED WIRING BOARD, SUBSTRATE FOR PRINTE...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COPPER PARTICLE DISPERSING SOLUTION AND METHOD FOR PRODUCING CONDUC...

METHOD OF FORMING FINE ELECTRODE FOR FLAT PANEL DISPLAY

CONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD,...