Printed circuit coils

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CPC
H01F41/041

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Parent Industries

HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties

Current Industry

H01F41/041Printed circuit coils

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Inductor component and manufacturing method for inductor component
- Patent number 12,205,749
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 12,205,745
- Issue date Jan 21, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Soon Seong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D MIS-FO hybrid for embedded inductor package structure
- Patent number 12,205,750
- Issue date Jan 21, 2025
- Dialog Semiconductor (UK) Limited
- Shih-Wen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic coupling coil component
- Patent number 12,205,759
- Issue date Jan 21, 2025
- Taiyo Yuden Co., Ltd.
- Akihisa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 12,205,746
- Issue date Jan 21, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ju Hwan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 12,205,747
- Issue date Jan 21, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kang Wook Bong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transformer guard trace
- Patent number 12,176,285
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mounted magnetic-component module
- Patent number 12,165,798
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Lee Francis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount passive component
- Patent number 12,154,709
- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
- Yoshimasa Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly
- Patent number 12,148,556
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlapping secondary coils in a wireless power reception apparatus
- Patent number 12,142,934
- Issue date Nov 12, 2024
- GE Intellectual Property Licensing, LLC
- Viswanathan Kanakasabai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and manufacturing method of same
- Patent number 12,142,413
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Masayuki Oishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having a multimode antenna with variable width of conductive...
- Patent number 12,136,514
- Issue date Nov 5, 2024
- NuCurrent, Inc.
- Alberto Peralta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 12,125,626
- Issue date Oct 22, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a component having a cavity
- Patent number 12,126,232
- Issue date Oct 22, 2024
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Uwe Specht
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Multilayer inductor component
- Patent number 12,125,627
- Issue date Oct 22, 2024
- TDK Corporation
- Daiki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a passive electronic component
- Patent number 12,119,159
- Issue date Oct 15, 2024
- Taiyo Yuden Co., Ltd.
- Ryuichi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 12,112,879
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 12,112,880
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Sik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active shield structure
- Patent number 12,114,471
- Issue date Oct 8, 2024
- ARM Limited
- Narayan Prasad Ramachandran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coil component
- Patent number 12,106,885
- Issue date Oct 1, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Mo Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency auto-transformer, radio frequency device and method...
- Patent number 12,106,884
- Issue date Oct 1, 2024
- NXP B.V.
- Xin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil module, actuator provided with coil module, and method for man...
- Patent number 12,106,893
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Akihito Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil device and method for manufacturing the same
- Patent number 12,100,540
- Issue date Sep 24, 2024
- STEMCO CO., LTD.
- Young Jun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil electronic component and method of manufacturing the same
- Patent number 12,094,649
- Issue date Sep 17, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Min Sung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,088,208
- Issue date Sep 10, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ensuring minimum density compliance in integrated circuit inductors
- Patent number 12,087,808
- Issue date Sep 10, 2024
- Silicon Laboratories Inc.
- Eduardo Jose Dos Santos Viegas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inductor
- Patent number 12,087,490
- Issue date Sep 10, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi Okuizumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER
- Publication number 20250037923
- Publication date Jan 30, 2025
- QUALCOMM Incorporated
- Kai LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
- Publication number 20250022814
- Publication date Jan 16, 2025
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active Shield Structure
- Publication number 20250016968
- Publication date Jan 9, 2025
- ARM Limited
- Narayan Prasad Ramachandran
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER
- Publication number 20250006631
- Publication date Jan 2, 2025
- QUALCOMM Incorporated
- Jui-Yi CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIRAL IMPEDANCE STRUCTURE
- Publication number 20250003905
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER-BASED ISOLATOR WITH SPIRAL COILS
- Publication number 20240429265
- Publication date Dec 26, 2024
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240420887
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Min Sung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240412911
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Daisuke OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387102
- Publication date Nov 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Huei-Chi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT AND INDUCTOR COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20240379280
- Publication date Nov 14, 2024
- Murata Manufacturing Co., Ltd.
- Nobuyoshi ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...
- Publication number 20240379281
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Tatsuya MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB-BASED STRANDED, TWISTED EXCITATION WINDINGS IN ROTARY TRANSFORMERS
- Publication number 20240355540
- Publication date Oct 24, 2024
- BorgWarner Inc.
- Mostak Mohammad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CONDUCTOR, METHODS FOR THE MANUFACTURE THEREOF, AND ASSE...
- Publication number 20240355529
- Publication date Oct 24, 2024
- ROGERS CORPORATION
- Karl Sprentall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240355536
- Publication date Oct 24, 2024
- Samsung Electro-Mechanics Co., Ltd.
- No Il Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20240355720
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YING-CHIH HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240347259
- Publication date Oct 17, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer-Multi-Turn Structure For High Efficiency Wireless Commu...
- Publication number 20240348091
- Publication date Oct 17, 2024
- NUCURRENT, INC.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR HAVING HIGH CURRENT COIL WITH LOW DIRECT CURRENT RESISTANCE
- Publication number 20240347254
- Publication date Oct 17, 2024
- Vishay Dale Electronics, LLC
- Benjamin M. HANSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE COIL ASSEMBLY AND METHOD OF PRODUCING THE SAME
- Publication number 20240331938
- Publication date Oct 3, 2024
- ROGERS CORPORATION
- Vitali JUDIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND METHOD FOR MANUFACTURING COIL COMPONENT
- Publication number 20240327307
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Reiji OZAWA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COIL ELEMENT ASSEMBLY, COIL MODULE, AND METHOD FOR MANUFACTURING TH...
- Publication number 20240312705
- Publication date Sep 19, 2024
- MURATA MANUFACTURING CO., LTD.
- Shinichiro BANBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240314932
- Publication date Sep 19, 2024
- Unimicron Technology Corp.
- Chen-An TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20240312692
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURE INDUCTIVE COIL AND PREPARATION METHOD THEREOF
- Publication number 20240304378
- Publication date Sep 12, 2024
- KUN SHAN MAZO TECH CO., LTD.
- Jinbing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH RECESSED INDUCTORS, AND METHODS FOR M...
- Publication number 20240304371
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Dustin L. Holloway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Having a Multimode Antenna With Variable Width of Conductive...
- Publication number 20240282514
- Publication date Aug 22, 2024
- NUCURRENT, INC.
- Alberto Peralta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IRON ALLOY COATINGS FOR WIRELESS RECHARGING DEVICES AND RELATED MET...
- Publication number 20240274343
- Publication date Aug 15, 2024
- Xtalic Corporation
- John Cahalen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MAGNETIC ELEMENT
- Publication number 20240274345
- Publication date Aug 15, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Shouyu HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT
- Publication number 20240266108
- Publication date Aug 8, 2024
- TDK Corporation
- Youichi Kazuta
- H01 - BASIC ELECTRIC ELEMENTS

Printed circuit coils

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inductor component and manufacturing method for inductor component

Coil component

3D MIS-FO hybrid for embedded inductor package structure

Magnetic coupling coil component

Coil component

Coil component

Transformer guard trace

Surface-mounted magnetic-component module

Surface-mount passive component

Integrated magnetic assembly

Overlapping secondary coils in a wireless power reception apparatus

Coil component and manufacturing method of same

Device having a multimode antenna with variable width of conductive...

Package embedded magnetic inductor structures and manufacturing tec...

Package

Inductor built-in substrate

Method for producing a component having a cavity

Multilayer inductor component

Method for manufacturing a passive electronic component

Coil component

Coil component

Active shield structure

Coil component

Radio frequency auto-transformer, radio frequency device and method...

Coil module, actuator provided with coil module, and method for man...

Coil device and method for manufacturing the same

Coil electronic component and method of manufacturing the same

Method and apparatus for delivering power to semiconductors

Ensuring minimum density compliance in integrated circuit inductors

Inductor

Patents Applicationslast 30 patents

PACKAGE COMPRISING A SUBSTRATE WITH INDUCTORS AND A MAGNETIC LAYER

PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...

Active Shield Structure

INTEGRATED INDUCTOR INCLUDING MAGNETIC LAYER

SPIRAL IMPEDANCE STRUCTURE

TRANSFORMER-BASED ISOLATOR WITH SPIRAL COILS

COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

INDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

INDUCTOR COMPONENT AND INDUCTOR COMPONENT-EMBEDDED SUBSTRATE

CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...

PACKAGE

PCB-BASED STRANDED, TWISTED EXCITATION WINDINGS IN ROTARY TRANSFORMERS

MULTILAYER CONDUCTOR, METHODS FOR THE MANUFACTURE THEREOF, AND ASSE...

COIL COMPONENT AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Multi-Layer-Multi-Turn Structure For High Efficiency Wireless Commu...

INDUCTOR HAVING HIGH CURRENT COIL WITH LOW DIRECT CURRENT RESISTANCE

INDUCTIVE COIL ASSEMBLY AND METHOD OF PRODUCING THE SAME

COIL COMPONENT AND METHOD FOR MANUFACTURING COIL COMPONENT

COIL ELEMENT ASSEMBLY, COIL MODULE, AND METHOD FOR MANUFACTURING TH...

EMBEDDED INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

COIL STRUCTURE AND METHOD OF MAKING SAME

MINIATURE INDUCTIVE COIL AND PREPARATION METHOD THEREOF

SEMICONDUCTOR ASSEMBLIES WITH RECESSED INDUCTORS, AND METHODS FOR M...

Device Having a Multimode Antenna With Variable Width of Conductive...

IRON ALLOY COATINGS FOR WIRELESS RECHARGING DEVICES AND RELATED MET...

MANUFACTURING METHOD OF MAGNETIC ELEMENT

METHOD FOR PRODUCING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT