Printed circuits structurally associated with non-printed electric components

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CPC
H05K1/18

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/18Printed circuits structurally associated with non-printed electric components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for power module for inverter for electric vehicle
- Patent number 12,368,391
- Issue date Jul 22, 2025
- BorgWarner US Technologies LLC
- David Paul Buehler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board assembly and electronic device
- Patent number 12,369,288
- Issue date Jul 22, 2025
- HONOR DEVICE CO., LTD.
- Jianqiang Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,369,337
- Issue date Jul 22, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection robots and methods for inspection of curved surfaces wit...
- Patent number 12,365,199
- Issue date Jul 22, 2025
- Gecko Robotics, Inc.
- Edward A. Bryner
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device including waterproof structure
- Patent number 12,368,465
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Sunggun Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable electrical card connector for connecting to cards of d...
- Patent number 12,368,255
- Issue date Jul 22, 2025
- Dell Products L.P.
- Edward Davis Geist
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vehicle trim component
- Patent number 12,365,301
- Issue date Jul 22, 2025
- Shanghai Yanfeng Jinqiao Automotive Trim Systems Co. Ltd.
- Jennifer A. Stroebe
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit module and large-scale circuit system
- Patent number 12,369,252
- Issue date Jul 22, 2025
- Murata Manufacturing Co., Ltd.
- Osamu Miki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of manufacturing electronic component
- Patent number 12,369,254
- Issue date Jul 22, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit module
- Patent number 12,369,258
- Issue date Jul 22, 2025
- TDK Corporation
- Shuichi Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module and display device
- Patent number 12,369,255
- Issue date Jul 22, 2025
- Beijing Boe Display Technology Co., Ltd.
- Yuanye Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit forming method
- Patent number 12,369,259
- Issue date Jul 22, 2025
- FUJI CORPORATION
- Kenji Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit and connector element alignment, circuit board assemblies
- Patent number 12,369,253
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board assembly
- Patent number 12,369,260
- Issue date Jul 22, 2025
- Vitesco Technologies GmbH
- Stefan Peck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil structure
- Patent number 12,362,084
- Issue date Jul 15, 2025
- Cyntec Co., Ltd.
- Min-Feng Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric motor and printed circuit board
- Patent number 12,362,622
- Issue date Jul 15, 2025
- GKN Powder Metallurgy Engineering GmbH
- Stefan Tiller
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting assembly and circuit board assembly
- Patent number 12,363,829
- Issue date Jul 15, 2025
- ADLINK TECHNOLOGY INC.
- Chih-Liang Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside recess in motherboard with thermally conductive mold
- Patent number 12,363,831
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foldable display device and method for manufacturing same
- Patent number 12,362,455
- Issue date Jul 15, 2025
- BOE Technology Group Co., Ltd.
- Penghao Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for vertical power delivery to electronic systems
- Patent number 12,362,655
- Issue date Jul 15, 2025
- The Trustees of Princeton University
- Minjie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Splicing display panel and electronic device
- Patent number 12,360,413
- Issue date Jul 15, 2025
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yao Chen
- G02 - OPTICS
Information Patent Grant
Display device
- Patent number 12,361,859
- Issue date Jul 15, 2025
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Hua Fu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Stretchable mounting substrate
- Patent number 12,363,823
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Tadahiko Matsumoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,363,827
- Issue date Jul 15, 2025
- Ibiden Co., Ltd.
- Yoshiki Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 12,364,100
- Issue date Jul 15, 2025
- LG Display Co., Ltd.
- Jin-Young Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device mounted on a system board
- Patent number 12,360,357
- Issue date Jul 15, 2025
- Texas Instruments Incorporated
- Paul Lawrence Rancuret
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device
- Patent number 12,363,828
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Peiyu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,363,830
- Issue date Jul 15, 2025
- CARUX TECHNOLOGY PTE. LTD.
- Hsin-Fa Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE
- Publication number 20250240892
- Publication date Jul 24, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Qiao WANG
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD
- Publication number 20250239408
- Publication date Jul 24, 2025
- Taiyo Yuden Co., Ltd.
- Ayumi SHIROTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING FIXING PART AND ELECTRONIC DEVICE C...
- Publication number 20250240529
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Bongchan KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY DEVICE
- Publication number 20250240894
- Publication date Jul 24, 2025
- LG Display Co., Ltd.
- Jicheol SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMIC...
- Publication number 20250239577
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Juhyeon Oh
- G02 - OPTICS
Information Patent Application
INFORMATION PROCESSING DEVICE
- Publication number 20250240053
- Publication date Jul 24, 2025
- NIDEC INSTRUMENTS CORPORATION
- Shinya MIYAZAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wireless Connector System
- Publication number 20250239769
- Publication date Jul 24, 2025
- NUCURRENT, INC.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20250237900
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INDUCTANCE STRUCTURE
- Publication number 20250239396
- Publication date Jul 24, 2025
- TAI-TECH ADVANCED ELECTRONICS CO., LTD.
- Ming-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TILED DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20250241065
- Publication date Jul 24, 2025
- Chengdu Vistar Optoelectronics Co., Ltd.
- Zhenli SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN
- Publication number 20250239911
- Publication date Jul 24, 2025
- Milwaukee Electric Tool Corporation
- Matthew J. Mergener
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CIRCUIT BOARD AND DISPLAY APPARATUS
- Publication number 20250240872
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuang LEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250240881
- Publication date Jul 24, 2025
- Canon Kabushiki Kaisha
- TAKESHI HONDA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250240893
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Che-Neng LIU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR ELEMENT UNIT AND METHOD OF MANUFACTURING THEREOF, SEM...
- Publication number 20250241046
- Publication date Jul 24, 2025
- Oki Electric Industry Co., Ltd.
- Yuuki SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CNC SWITCH DEVICE AND CONTROL METHOD
- Publication number 20250231574
- Publication date Jul 17, 2025
- Fly Cat Electrical Co.,Ltd.
- Xiao LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-MOLD TOUCH FILM INTEGRATED FLEXIBLE PRINTED CIRCUIT WITH TOUCH C...
- Publication number 20250231654
- Publication date Jul 17, 2025
- Whirlpool Corporation
- Sithaarth T. SUBRAMANIYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233093
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPIRAL INDUCTORS AND ANTENNAS THAT ARE INTEGRATED IN ELECTRONIC ASS...
- Publication number 20250232904
- Publication date Jul 17, 2025
- SUPER MICRO COMPUTER, INC.
- Manhtien V. PHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC C...
- Publication number 20250234455
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- MING-HSUN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP-TO-CHIP INTERCONNECT DESIGN
- Publication number 20250234459
- Publication date Jul 17, 2025
- NVIDIA Corporation
- Zikuan QIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250233040
- Publication date Jul 17, 2025
- MEDIATEK INC.
- Sang-Mao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Portable Power Case
- Publication number 20250234675
- Publication date Jul 17, 2025
- LAT Enterprises, Inc., d/b/a MediPak Energy Systems
- Laura Thiel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SHARED FOOTPRINT FOR FRONTSIDE AND THROUGH-BOARD CONNECTOR ON AN LE...
- Publication number 20250234454
- Publication date Jul 17, 2025
- SIGNIFY HOLDING B.V.
- PIETER JOSEPH CLARA VAN DER WEL
- F21 - LIGHTING
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE
- Publication number 20250233092
- Publication date Jul 17, 2025
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
M.2 WLAN MODULE HOLDER
- Publication number 20250224781
- Publication date Jul 10, 2025
- Dell Products L.P.
- MengXiao Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SUPPLY SYSTEM
- Publication number 20250224788
- Publication date Jul 10, 2025
- CYNTEC CO., LTD.
- Bau-Ru Lu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250226294
- Publication date Jul 10, 2025
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE, CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20250226142
- Publication date Jul 10, 2025
- HUNAN HUASUN M&E TECHNOLOGY CO.LTD
- Xiaoying YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226155
- Publication date Jul 10, 2025
- Taiyo Yuden Co., Ltd.
- Maiko YAMANE
- H01 - BASIC ELECTRIC ELEMENTS

Printed circuits structurally associated with non-printed electric components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for power module for inverter for electric vehicle

Circuit board assembly and electronic device

Thin film capacitor and electronic circuit substrate having the same

Inspection robots and methods for inspection of curved surfaces wit...

Electronic device including waterproof structure

Configurable electrical card connector for connecting to cards of d...

Vehicle trim component

Circuit module and large-scale circuit system

Method of manufacturing electronic component

Electronic circuit module

Display module and display device

Circuit forming method

Circuit and connector element alignment, circuit board assemblies

Printed circuit board assembly

Coil structure

Electric motor and printed circuit board

Methods of packaging semiconductor devices and packaged semiconduct...

Mounting assembly and circuit board assembly

Backside recess in motherboard with thermally conductive mold

Foldable display device and method for manufacturing same

System and method for vertical power delivery to electronic systems

Splicing display panel and electronic device

Display device

Stretchable mounting substrate

Printed wiring board and method for manufacturing printed wiring board

Display device

Electronic substrate and electronic device

Semiconductor device mounted on a system board

Electronic device

Electronic device and manufacturing method thereof

Patents Applicationslast 30 patents

RELAY, POWER DISTRIBUTION APPARATUS, AND CHARGING PILE

MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD

PRINTED CIRCUIT BOARD INCLUDING FIXING PART AND ELECTRONIC DEVICE C...

DISPLAY DEVICE

CHIP STRUCTURE INCLUDING OPTICAL INTEGRATED CIRCUIT CHIP, AND SEMIC...

INFORMATION PROCESSING DEVICE

Wireless Connector System

DISPLAY APPARATUS

INDUCTANCE STRUCTURE

TILED DISPLAY PANEL AND DISPLAY DEVICE

BRUSHLESS DC MOTOR POWER TOOL WITH COMBINED PCB DESIGN

CIRCUIT BOARD AND DISPLAY APPARATUS

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

PACKAGE STRUCTURE

SEMICONDUCTOR ELEMENT UNIT AND METHOD OF MANUFACTURING THEREOF, SEM...

CNC SWITCH DEVICE AND CONTROL METHOD

IN-MOLD TOUCH FILM INTEGRATED FLEXIBLE PRINTED CIRCUIT WITH TOUCH C...

SEMICONDUCTOR PACKAGE

SPIRAL INDUCTORS AND ANTENNAS THAT ARE INTEGRATED IN ELECTRONIC ASS...

METHOD FOR MANUFACTURING CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC C...

CHIP-TO-CHIP INTERCONNECT DESIGN

SEMICONDUCTOR PACKAGE STRUCTURE

Portable Power Case

SHARED FOOTPRINT FOR FRONTSIDE AND THROUGH-BOARD CONNECTOR ON AN LE...

ELECTRONIC DEVICE HAVING A SOLDER STOP FEATURE

M.2 WLAN MODULE HOLDER

POWER SUPPLY SYSTEM

SEMICONDUCTOR MODULE

INDUCTOR STRUCTURE, CIRCUIT BOARD AND ELECTRONIC DEVICE

MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING THE SAME