Printed circuits structurally associated with non-printed electric components

Industry

CPC
H05K1/18

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/18Printed circuits structurally associated with non-printed electric components

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for an interlocking feature on a power module
- Patent number 12,316,257
- Issue date May 27, 2025
- BorgWarner US Technologies LLC
- Edward Choi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Magnetic body, coil component including magnetic body, and method o...
- Patent number 12,315,660
- Issue date May 27, 2025
- Taiyo Yuden Co., Ltd.
- Yoko Orimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor with printed circuit board based contact
- Patent number 12,317,420
- Issue date May 27, 2025
- MEAS France
- Emilien Durupt
- G01 - MEASURING TESTING
Information Patent Grant
Method for adaptive control schemes for surgical network control an...
- Patent number 12,310,586
- Issue date May 27, 2025
- Cilag GmbH International
- Frederick E. Shelton
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor module
- Patent number 12,315,771
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tomohiro Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for temperature measurement and method of processing subs...
- Patent number 12,317,419
- Issue date May 27, 2025
- Semes Co., Ltd.
- Yong Jun Seo
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,317,462
- Issue date May 27, 2025
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems, apparatuses, methods, and non-transitory computer-readable...
- Patent number 12,314,208
- Issue date May 27, 2025
- Huawei Technologies Co., Ltd.
- Davide Tonietto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device with slim control assembly
- Patent number 12,313,943
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Moonyoung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device
- Patent number 12,317,430
- Issue date May 27, 2025
- IRISO ELECTRONICS CO., LTD.
- Yujiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-proof structure and electronic device
- Patent number 12,317,434
- Issue date May 27, 2025
- PAX COMPUTER TECHNOLOGY (SHENZHEN) CO., LTD
- Xiaoyan Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elongate medical tools including printed circuit boards
- Patent number 12,303,653
- Issue date May 20, 2025
- Pacesetter, Inc.
- Amanuel Seretse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 12,309,930
- Issue date May 20, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 12,306,497
- Issue date May 20, 2025
- AUO Corporation
- Ying-Ming Wang
- G02 - OPTICS
Information Patent Grant
Synchronous rectification assembly, manufacturing method thereof an...
- Patent number 12,308,757
- Issue date May 20, 2025
- APLUS POWER TECHNOLOGY (HANGZHOU) CO., LTD.
- Yuetian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having embedded electronic component and method for m...
- Patent number 12,309,918
- Issue date May 20, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ming-Hsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlocked circuit board elements and assemblies
- Patent number 12,309,928
- Issue date May 20, 2025
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Sandwich structure power supply module
- Patent number 12,309,929
- Issue date May 20, 2025
- Monolithic Power Systems, Inc.
- Daocheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor assembly and front cover of optical sensor assembly
- Patent number 12,306,035
- Issue date May 20, 2025
- Chih-Ming Sun
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor device, pressure sensor module, and signal correcti...
- Patent number 12,306,050
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Hideaki Sugibayashi
- G01 - MEASURING TESTING
Information Patent Grant
Display device
- Patent number 12,310,226
- Issue date May 20, 2025
- SHARP KABUSHIKI KAISHA
- Keiji Aota
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board having signal and power isolation circuit
- Patent number 12,309,914
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tarou Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,309,923
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacitance memory device
- Patent number 12,309,935
- Issue date May 20, 2025
- Innodisk Corporation
- Chih-Chieh Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
KEY DEPRESSION AMOUNT SENSOR DEVICE
- Publication number 20250172382
- Publication date May 29, 2025
- SONY GROUP CORPORATION
- G01 - MEASURING TESTING
Information Patent Application
BATTERY CHARGER
- Publication number 20250175021
- Publication date May 29, 2025
- Milwaukee Electric Tool Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDED SUBSTRATE
- Publication number 20250174405
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRESSURE SENSORS AND USER INTERFACES
- Publication number 20250169555
- Publication date May 29, 2025
- LOOMIA Technologies, Inc.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOAD REDUCED MEMORY MODULE
- Publication number 20250176102
- Publication date May 29, 2025
- Rambus Inc.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250176107
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR FOR PRINTED CIRCUIT BOARD
- Publication number 20250172641
- Publication date May 29, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- G01 - MEASURING TESTING
Information Patent Application
PANEL AND MANUFACTURING METHOD
- Publication number 20250174921
- Publication date May 29, 2025
- ALPS ALPINE CO., LTD.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176109
- Publication date May 29, 2025
- VERTIV CORPORATION
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250176111
- Publication date May 29, 2025
- Samsung Electronics Co., LTD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...
- Publication number 20250168979
- Publication date May 22, 2025
- Suzhou MetaBrain Intelligent Technology Co., Ltd.
- Lei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS
- Publication number 20250168987
- Publication date May 22, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20250169325
- Publication date May 22, 2025
- SAMSUNG DISPLAY CO., LTD.
- HYEYOUNG YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...
- Publication number 20250164568
- Publication date May 22, 2025
- Garrett Transportation I Inc.
- Jaroslav Pekar
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250168986
- Publication date May 22, 2025
- TDK Corporation
- Akiko SEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS
- Publication number 20250168968
- Publication date May 22, 2025
- Microsoft Technology Licensing, LLC
- Chee Kiong FONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250168984
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin Duck PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250168970
- Publication date May 22, 2025
- KYOCERA CORPORATION
- Daichi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heatsink techniques for optical and electrical modules
- Publication number 20250168963
- Publication date May 22, 2025
- CIENA CORPORATION
- Mitchell O'Leary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250168983
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takuma AOSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
- Publication number 20250168985
- Publication date May 22, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Toshiharu MOTOFUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250159810
- Publication date May 15, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD, DISPLAY MODULE, AND ELECTRONIC DEVICE
- Publication number 20250159814
- Publication date May 15, 2025
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jianhua ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Manufacturing Electronic Device
- Publication number 20250155466
- Publication date May 15, 2025
- SEIKO EPSON CORPORATION
- Hitoshi UENO
- G01 - MEASURING TESTING
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250160171
- Publication date May 15, 2025
- SAMSUNG DISPLAY CO., LTD.
- Myung Hwan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
- Publication number 20250159813
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Printed circuits structurally associated with non-printed electric components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for an interlocking feature on a power module

Magnetic body, coil component including magnetic body, and method o...

Sensor with printed circuit board based contact

Method for adaptive control schemes for surgical network control an...

Semiconductor module

Apparatus for temperature measurement and method of processing subs...

Electronic package and method of manufacturing the same

Systems, apparatuses, methods, and non-transitory computer-readable...

Display device with slim control assembly

Wiring board, semiconductor device, and method of manufacturing wir...

Electrical device

Tamper-proof structure and electronic device

Elongate medical tools including printed circuit boards

Display apparatus

Electronic device

High density coil design and process

Display device

Synchronous rectification assembly, manufacturing method thereof an...

Circuit board having embedded electronic component and method for m...

Board-level pad pattern for multi-row QFN packages

Interlocked circuit board elements and assemblies

Sandwich structure power supply module

Electronic component module, sub-module, and method for manufacturi...

Photonic wafer communication systems and related packages

Optical sensor assembly and front cover of optical sensor assembly

Pressure sensor device, pressure sensor module, and signal correcti...

Display device

Multilayer circuit board having signal and power isolation circuit

Printed circuit board and method for manufacturing the same

High capacitance memory device

Patents Applicationslast 30 patents

KEY DEPRESSION AMOUNT SENSOR DEVICE

BATTERY CHARGER

CAPACITOR EMBEDDED SUBSTRATE

FLEXIBLE PRESSURE SENSORS AND USER INTERFACES

LOAD REDUCED MEMORY MODULE

SEMICONDUCTOR PACKAGE

CURRENT SENSOR FOR PRINTED CIRCUIT BOARD

PANEL AND MANUFACTURING METHOD

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

ADAPTER BOARD AND MANUFACTURING METHOD THEREFOR, AND BOARD CARD CON...

MOLDED PACKAGES WITH THROUGH-MOLD INTERCONNECTS

DISPLAY DEVICE

METHODS AND SYSTEMS OF COMPRESSOR CONTROL WITH SURGE AVOIDANCE AND...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

WIRING BOARD

Heatsink techniques for optical and electrical modules

CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD ASSEMBLY

FLEXIBLE CIRCUIT BOARD, DISPLAY MODULE, AND ELECTRONIC DEVICE

Method For Manufacturing Electronic Device

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT STRUCTURE

PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS