Printed circuits

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CPC
B23K2201/42

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BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K2201/00Articles made by soldering, welding or cutting by applying heat locally

Current Industry

B23K2201/42Printed circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Producing metal/ceramic circuit board by removing residual silver
- Patent number 10,834,823
- Issue date Nov 10, 2020
- Dowa Metaltech Co., Ltd.
- Takashi Ideno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,286,471
- Issue date May 14, 2019
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,286,472
- Issue date May 14, 2019
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transistor work function adjustment by laser stimulation
- Patent number 10,177,051
- Issue date Jan 8, 2019
- Apple Inc.
- Michael R. Seningen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an inductive conductivity sensor and induc...
- Patent number 10,156,533
- Issue date Dec 18, 2018
- Endress + Hauser Conducta GmbH + Co. KG
- Thomas Nagel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,157,877
- Issue date Dec 18, 2018
- Fuji Electric Co., Ltd.
- Kazumasa Kido
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux reservoir apparatus
- Patent number 10,137,519
- Issue date Nov 27, 2018
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect alloy material and methods
- Patent number 10,099,307
- Issue date Oct 16, 2018
- Intel Corporation
- Ting Zhong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallized particle interconnect with solder components
- Patent number 10,104,772
- Issue date Oct 16, 2018
- International Business Machines Incorporated
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip interconnection with reduced current density
- Patent number 10,090,274
- Issue date Oct 2, 2018
- Efficient Power Conversion Corporation
- Robert Strittmatter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless multi-layered ceramic capacitor stacks
- Patent number 10,068,707
- Issue date Sep 4, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonded structure
- Patent number 10,052,713
- Issue date Aug 21, 2018
- ULTEX CORPORATION
- Shigeru Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for improved bonding
- Patent number 10,050,009
- Issue date Aug 14, 2018
- Semiconductor Components Industries, LLC
- Nobuhisa Onai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water soluble flux with modified viscosity
- Patent number 10,037,898
- Issue date Jul 31, 2018
- Intel Corporation
- Kabir J. Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal wiring bonding structure and production method therefor
- Patent number 10,029,328
- Issue date Jul 24, 2018
- NGK Insulators, Ltd.
- Rishun Kin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED tube lamp
- Patent number 10,024,503
- Issue date Jul 17, 2018
- JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- Li-Qin Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stencil set and system for printing solder paste for printed circui...
- Patent number 10,028,392
- Issue date Jul 17, 2018
- General Electric Company
- John Andrew Trelford
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an inductive conductivity sensor and an in...
- Patent number 10,012,608
- Issue date Jul 3, 2018
- Endress + Hauser Conducta GmbH + Co. KG
- Thomas Nagel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering module
- Patent number 10,010,958
- Issue date Jul 3, 2018
- ERSA GmbH
- Rainer Kurtz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transistor work function adjustment by laser stimulation
- Patent number 10,008,423
- Issue date Jun 26, 2018
- Apple Inc.
- Michael R. Seningen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,986,649
- Issue date May 29, 2018
- International Business Machine Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating element for SMD mounting
- Patent number 9,986,648
- Issue date May 29, 2018
- Siemens Aktiengesellschaft
- Michael Hanisch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Holding stand
- Patent number 9,981,332
- Issue date May 29, 2018
- HAKKO CORP.
- Yoshitomo Teraoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support entering into the fabrication of an electronic device, corr...
- Patent number 9,980,374
- Issue date May 22, 2018
- INGENICO GROUP
- Stephane Pavageau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array rework
- Patent number 9,978,706
- Issue date May 22, 2018
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDERING APPARATUS AND SOLDER NOZZLE MODULE THEREOF
- Publication number 20190366460
- Publication date Dec 5, 2019
- PROGRESS Y&Y CORP.
- Ming-Chih CHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE
- Publication number 20190230796
- Publication date Jul 25, 2019
- NCC NANO, LLC
- ROB JACOB HENDRIKS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Engineered Polymer-Based Electronic Materials
- Publication number 20190143461
- Publication date May 16, 2019
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER FLUX CONTAINING FLUORESCENT MICROCAPSULES AND METHOD TO VISU...
- Publication number 20190118312
- Publication date Apr 25, 2019
- International Business Machines Corporation
- Jennifer I. BENNETT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC BONDING JIG, BONDING STRUCTURE, AND BONDING METHOD
- Publication number 20190009357
- Publication date Jan 10, 2019
- NIPPON MEKTRON, LTD.
- Hiroshi MIYASHIRO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318968
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318969
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED TUBE LAMP
- Publication number 20180320831
- Publication date Nov 8, 2018
- JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD
- LI-QIN LI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSISTOR WORK FUNCTION ADJUSTMENT BY LASER STIMULATION
- Publication number 20180308772
- Publication date Oct 25, 2018
- Apple Inc.
- Michael R. Seningen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ADHERING A FIRST STRUCTURE AND A SECOND STRUCTURE
- Publication number 20180297143
- Publication date Oct 18, 2018
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Bruno IMBERT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Impact Solder Toughness Alloy
- Publication number 20180290244
- Publication date Oct 11, 2018
- ALPHA METALS, INC.
- Ranjit Pandher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD
- Publication number 20180255645
- Publication date Sep 6, 2018
- DOWA METALTECH CO., LTD.
- Takashi Ideno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND MOUNT STRUCTURE OBTAINED BY USING SAME
- Publication number 20180229333
- Publication date Aug 16, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- HIROHISA HINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER MACHINING MACHINES AND METHODS FOR LAP WELDING OF WORKPIECES
- Publication number 20180214981
- Publication date Aug 2, 2018
- TRUMPF LASER GMBH
- Elke Kaiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING SYSTEM, COMPONENT MOUNTER AND COMPONENT MOUNTING...
- Publication number 20180199476
- Publication date Jul 12, 2018
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Daisuke MATSUSHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ball Grid Array Rework
- Publication number 20180190609
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL CORED SOLDER DECAL STRUCTURE AND PROCESS
- Publication number 20180174949
- Publication date Jun 21, 2018
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC UNIT
- Publication number 20180126474
- Publication date May 10, 2018
- DENSO CORPORATION
- Shinichiro SHIRAISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...
- Publication number 20180132361
- Publication date May 10, 2018
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKTABLE FOR SOLDERING IRON
- Publication number 20180111212
- Publication date Apr 26, 2018
- Ming-Chin Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD AND BONDED STRUCTURE
- Publication number 20180111220
- Publication date Apr 26, 2018
- ULTEX CORPORATION
- Shigeru SATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heating Element For SMD Mounting
- Publication number 20180110131
- Publication date Apr 19, 2018
- Siemens Aktiengesellschaft
- Michael Hanisch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR VOID REDUCTION IN SOLDER JOINTS
- Publication number 20180093338
- Publication date Apr 5, 2018
- ZKW GROUP GMBH
- Erik EDLINGER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE POLYMER COMPOSITE AS PLASTIC SOLDER
- Publication number 20180085862
- Publication date Mar 29, 2018
- Agency for Science, Technology and Research
- Kuan Eng Johnson GOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PROCESSING DEVICE
- Publication number 20180056423
- Publication date Mar 1, 2018
- AND Co., Ltd.
- Mitsuo EBISAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnections Formed with Conductive Traces Applied onto Substra...
- Publication number 20180063967
- Publication date Mar 1, 2018
- Tyco Electronics Corporation
- Miguel A. Morales
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Engineered Polymer-Based Electronic Materials
- Publication number 20180056455
- Publication date Mar 1, 2018
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC SOLDERING APPARATUS
- Publication number 20180050407
- Publication date Feb 22, 2018
- Mark Richards
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSPECTION APPARATUS AND QUALITY CONTROL SYSTEM FOR SURFACE MOUNTIN...
- Publication number 20180049356
- Publication date Feb 15, 2018
- Omron Corporation
- Hiroyuki MORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacture of Electronic Circuits
- Publication number 20180049315
- Publication date Feb 15, 2018
- Siemens Aktiengesellschaft
- Bernd Mueller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Producing metal/ceramic circuit board by removing residual silver

Solder paste misprint cleaning

Solder paste misprint cleaning

Transistor work function adjustment by laser stimulation

Method for manufacturing an inductive conductivity sensor and induc...

Semiconductor device and manufacturing method of semiconductor device

Method for producing metal ball, joining material, and metal ball

Flux reservoir apparatus

Interconnect alloy material and methods

Metallized particle interconnect with solder components

Bonding method using bonding material

Flip chip interconnection with reduced current density

Leadless multi-layered ceramic capacitor stacks

Bonding method and bonded structure

Methods and apparatus for improved bonding

Water soluble flux with modified viscosity

Metal wiring bonding structure and production method therefor

LED tube lamp

Stencil set and system for printing solder paste for printed circui...

Method for manufacturing an inductive conductivity sensor and an in...

Soldering module

Bonding material and bonding method using the same

Transistor work function adjustment by laser stimulation

Lead-free soldering method and soldered article

Semiconductor package alignment frame for local reflow

Increasing solder hole-fill in a printed circuit board assembly

Heating element for SMD mounting

Holding stand

Support entering into the fabrication of an electronic device, corr...

Ball grid array rework

Patents Applicationslast 30 patents

SOLDERING APPARATUS AND SOLDER NOZZLE MODULE THEREOF

METHOD FOR CURING SOLDER PASTE ON A THERMALLY FRAGILE SUBSTRATE

Engineered Polymer-Based Electronic Materials

SOLDER FLUX CONTAINING FLUORESCENT MICROCAPSULES AND METHOD TO VISU...

ULTRASONIC BONDING JIG, BONDING STRUCTURE, AND BONDING METHOD

Solder for Limiting Substrate Damage Due to Discrete Failure

Solder for Limiting Substrate Damage Due to Discrete Failure

LED TUBE LAMP

TRANSISTOR WORK FUNCTION ADJUSTMENT BY LASER STIMULATION

METHOD FOR ADHERING A FIRST STRUCTURE AND A SECOND STRUCTURE

High Impact Solder Toughness Alloy

METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD

SOLDER PASTE AND MOUNT STRUCTURE OBTAINED BY USING SAME

LASER MACHINING MACHINES AND METHODS FOR LAP WELDING OF WORKPIECES

COMPONENT MOUNTING SYSTEM, COMPONENT MOUNTER AND COMPONENT MOUNTING...

Ball Grid Array Rework

METAL CORED SOLDER DECAL STRUCTURE AND PROCESS

SOLDERING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC UNIT

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...

WORKTABLE FOR SOLDERING IRON

BONDING METHOD AND BONDED STRUCTURE

Heating Element For SMD Mounting

METHOD FOR VOID REDUCTION IN SOLDER JOINTS

CONDUCTIVE POLYMER COMPOSITE AS PLASTIC SOLDER

SOLDER PROCESSING DEVICE

Interconnections Formed with Conductive Traces Applied onto Substra...

Engineered Polymer-Based Electronic Materials

MAGNETIC SOLDERING APPARATUS

INSPECTION APPARATUS AND QUALITY CONTROL SYSTEM FOR SURFACE MOUNTIN...

Manufacture of Electronic Circuits