Printed component having superposed conductors, but integrated in one circuit layer

Industry

CPC
H05K2201/09763

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09763Printed component having superposed conductors, but integrated in one circuit layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Microelectronic devices designed with capacitive and enhanced induc...
- Patent number 10,910,305
- Issue date Feb 2, 2021
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses, multi-chip modules and capacitive chips
- Patent number 10,685,785
- Issue date Jun 16, 2020
- Micron Technology, Inc.
- Fred D. Fishburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing through wiring substrate and method for ma...
- Patent number 10,667,392
- Issue date May 26, 2020
- Canon Kabushiki Kaisha
- Shinan Wang
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Copper clad laminate for forming of embedded capacitor layer, multi...
- Patent number 10,524,360
- Issue date Dec 31, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatuses, multi-chip modules and capacitive chips
- Patent number 10,483,043
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Fred D. Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management module and method of manufacture
- Patent number 10,475,568
- Issue date Nov 12, 2019
- L. Pierre de Rochemont
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatuses, multi-chip modules and capacitive chips
- Patent number 10,418,182
- Issue date Sep 17, 2019
- Micron Technology, Inc.
- Fred D. Fishburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses, multi-chip modules and capacitive chips
- Patent number 10,236,127
- Issue date Mar 19, 2019
- Micron Technology, Inc.
- Fred D. Fishburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive within via
- Patent number 9,960,079
- Issue date May 1, 2018
- Intel Corporation
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper clad laminate for forming of embedded capacitor layer, multi...
- Patent number 9,924,597
- Issue date Mar 20, 2018
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components and method of manufacture
- Patent number 9,905,928
- Issue date Feb 27, 2018
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fanout line structure of array substrate and display panel
- Patent number 9,204,532
- Issue date Dec 1, 2015
- Peng Du
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with capacitor
- Patent number 8,730,647
- Issue date May 20, 2014
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical components and method of manufacture
- Patent number 8,715,839
- Issue date May 6, 2014
- L. Pierre de Rochemont
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Component-incorporating wiring board
- Patent number 8,698,278
- Issue date Apr 15, 2014
- NGK Spark Plug Co., Ltd.
- Masaki Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with embedded patterned capacitance
- Patent number 8,652,920
- Issue date Feb 18, 2014
- Kamet Electronics Corporation
- John D. Prymak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure with capacitors embedded therein
- Patent number 8,642,898
- Issue date Feb 4, 2014
- Unimicron Technology Corp.
- Chung-Cheng Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,585,937
- Issue date Nov 19, 2013
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 8,575,496
- Issue date Nov 5, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for reducing impedance
- Patent number 8,564,967
- Issue date Oct 22, 2013
- CDA Processing Limited Liability Company
- Daniel Irwin Amey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,563,420
- Issue date Oct 22, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-circuit board and manufacturing method thereof
- Patent number 8,536,463
- Issue date Sep 17, 2013
- Sony Corporation
- Mitsuharu Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of embedding passive component within via
- Patent number 8,487,446
- Issue date Jul 16, 2013
- Intel Corporation
- Todd B Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with embedded patterned capacitance
- Patent number 8,470,680
- Issue date Jun 25, 2013
- Kemet Electronics Corporation
- John D. Prymak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with embedded patterned capacitance
- Patent number 8,410,536
- Issue date Apr 2, 2013
- Kemet Electronics Corporation
- John D. Prymak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-incorporated printed wiring board and electronic component
- Patent number 8,391,015
- Issue date Mar 5, 2013
- Ibiden Co., Ltd.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin-film capacitor structures embedded in semiconductor packages a...
- Patent number 8,391,017
- Issue date Mar 5, 2013
- Georgia Tech Research Corporation
- David Ross McGregor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Screen-printable encapsulants based on polyhydroxyamides that therm...
- Patent number 8,357,753
- Issue date Jan 22, 2013
- CDA Processing Limited Liability Company
- John D. Summers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power management module and method of manufacture
- Patent number 8,350,657
- Issue date Jan 8, 2013
- L. Pierre deRochemont
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20200245463
- Publication date Jul 30, 2020
- Fujitsu Limited
- Tomoyuki Akahoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH CAPACITIVE AND ENHANCED INDUC...
- Publication number 20190326213
- Publication date Oct 24, 2019
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180233286
- Publication date Aug 16, 2018
- Samsung Electro-Mechanics CO., LTD.
- Il Hwan YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...
- Publication number 20180160536
- Publication date Jun 7, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...
- Publication number 20160330839
- Publication date Nov 10, 2016
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- B32 - LAYERED PRODUCTS
Information Patent Application
PASSIVE WITHIN VIA
- Publication number 20130249112
- Publication date Sep 26, 2013
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Management Module and Method of Manufacture
- Publication number 20130175664
- Publication date Jul 11, 2013
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Application
SUBSTRATE-INCORPORATED CAPACITOR, CAPACITOR-INCORPORATING SUBSTRATE...
- Publication number 20130120902
- Publication date May 16, 2013
- SANYO ELECTRIC CO., LTD.
- Hitoshi Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120302010
- Publication date Nov 29, 2012
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH CAPACITORS EMBEDDED THEREIN AND METHOD...
- Publication number 20120292089
- Publication date Nov 22, 2012
- Unimicron Technology Corp.
- Chung-Cheng LIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED PATTERNED CAPACITANCE
- Publication number 20120162857
- Publication date Jun 28, 2012
- John D. Prymak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS THICK FILM EMBEDDED PASSIVE MATERIAL
- Publication number 20120118623
- Publication date May 17, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED PATTERNED CAPACITANCE
- Publication number 20120106032
- Publication date May 3, 2012
- Kemet Electronics Corporation
- John D. Prymak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120037414
- Publication date Feb 16, 2012
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERED AND NANOPORE ELECTRIC CAPACITOR, ELECTROCHEMICAL CAPACITOR...
- Publication number 20110310530
- Publication date Dec 22, 2011
- LAOR CONSULTING LLC
- Herzel Laor
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110252638
- Publication date Oct 20, 2011
- IBIDEN CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA
- Publication number 20110198723
- Publication date Aug 18, 2011
- Todd B. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed-circuit board and manufacturing method thereof
- Publication number 20110114376
- Publication date May 19, 2011
- SONY CORPORATION
- Mitsuharu Shoji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT
- Publication number 20110115101
- Publication date May 19, 2011
- Alexander Knobloch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20110063811
- Publication date Mar 17, 2011
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF
- Publication number 20110035939
- Publication date Feb 17, 2011
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-INCORPORATING WIRING BOARD
- Publication number 20110018099
- Publication date Jan 27, 2011
- NGK SPARK PLUG CO., LTD.
- Masaki Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR
- Publication number 20100319970
- Publication date Dec 23, 2010
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR
- Publication number 20100319973
- Publication date Dec 23, 2010
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR
- Publication number 20100294553
- Publication date Nov 25, 2010
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...
- Publication number 20100270645
- Publication date Oct 28, 2010
- GEORGIA TECH RESEARCH CORPORATION
- DAVID ROSS MCGREGOR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER
- Publication number 20100233359
- Publication date Sep 16, 2010
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing capacitor device
- Publication number 20100181285
- Publication date Jul 22, 2010
- IBIDEN, CO., LTD.
- Hironori Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ATOMIC LAYER DEPOSITION PROCESS FOR MANUFACTURE OF BATTERY ELECTROD...
- Publication number 20100123993
- Publication date May 20, 2010
- Herzel Laor
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD FOR FABRICATING PRINTED CIRCUIT BOARD HAVING CAPACITANCE COM...
- Publication number 20100115767
- Publication date May 13, 2010
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Printed component having superposed conductors, but integrated in one circuit layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modulated inductance module

Microelectronic devices designed with capacitive and enhanced induc...

Apparatuses, multi-chip modules and capacitive chips

Method for manufacturing through wiring substrate and method for ma...

Copper clad laminate for forming of embedded capacitor layer, multi...

Apparatuses, multi-chip modules and capacitive chips

Power management module and method of manufacture

Apparatuses, multi-chip modules and capacitive chips

Apparatuses, multi-chip modules and capacitive chips

Passive within via

Copper clad laminate for forming of embedded capacitor layer, multi...

Electrical components and method of manufacture

Fanout line structure of array substrate and display panel

Printed wiring board with capacitor

Electrical components and method of manufacture

Component-incorporating wiring board

Substrate with embedded patterned capacitance

Circuit board structure with capacitors embedded therein

Glass thick film embedded passive material

Multilayer printed wiring board and method of manufacturing the same

Device and method for reducing impedance

Multilayer printed wiring board

Printed-circuit board and manufacturing method thereof

Method of embedding passive component within via

Substrate with embedded patterned capacitance

Substrate with embedded patterned capacitance

Capacitor-incorporated printed wiring board and electronic component

Thin-film capacitor structures embedded in semiconductor packages a...

Screen-printable encapsulants based on polyhydroxyamides that therm...

Power management module and method of manufacture

Patents Applicationslast 30 patents

CAPACITOR-EMBEDDED SUBSTRATE AND ELECTRONIC APPARATUS

MICROELECTRONIC DEVICES DESIGNED WITH CAPACITIVE AND ENHANCED INDUC...

CAPACITOR COMPONENT AND METHOD OF MANUFACTURING THE SAME

COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...

COPPER CLAD LAMINATE FOR FORMING OF EMBEDDED CAPACITOR LAYER, MULTI...

PASSIVE WITHIN VIA

Power Management Module and Method of Manufacture

SUBSTRATE-INCORPORATED CAPACITOR, CAPACITOR-INCORPORATING SUBSTRATE...

MULTILAYER PRINTED WIRING BOARD

CIRCUIT BOARD STRUCTURE WITH CAPACITORS EMBEDDED THEREIN AND METHOD...

SUBSTRATE WITH EMBEDDED PATTERNED CAPACITANCE

GLASS THICK FILM EMBEDDED PASSIVE MATERIAL

SUBSTRATE WITH EMBEDDED PATTERNED CAPACITANCE

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

SINTERED AND NANOPORE ELECTRIC CAPACITOR, ELECTROCHEMICAL CAPACITOR...

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

METHOD OF EMBEDDING PASSIVE COMPONENT WITHIN VIA

Printed-circuit board and manufacturing method thereof

ELECTRONIC CIRCUIT

MULTILAYER PRINTED WIRING BOARD

MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF

COMPONENT-INCORPORATING WIRING BOARD

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES A...

METHOD FOR MANUFACTURING CAPACITOR EMBEDDED IN INTERPOSER

Method of manufacturing capacitor device

ATOMIC LAYER DEPOSITION PROCESS FOR MANUFACTURE OF BATTERY ELECTROD...

METHOD FOR FABRICATING PRINTED CIRCUIT BOARD HAVING CAPACITANCE COM...