Processing both sides of a PCB by the same process Providing a similar arrangement of components on both sides Making interlayer connections from two sides

Industry

CPC
H05K2203/1572

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1572Processing both sides of a PCB by the same process Providing a similar arrangement of components on both sides Making interlayer connections from two sides

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional circuit board processing apparatus
- Patent number 12,207,417
- Issue date Jan 21, 2025
- Simetric Semiconductor Solutions Co., Ltd.
- Marcus Elmar Lang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,963,306
- Issue date Apr 16, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,917,767
- Issue date Feb 27, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic printed conductors
- Patent number 11,849,540
- Issue date Dec 19, 2023
- The Governors of the University of Alberta
- Hyun-Joong Chung
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electrical connector and printed circuit board with electrical conn...
- Patent number 11,804,666
- Issue date Oct 31, 2023
- Unify Patente GmbH & Co. KG
- Marcelo Samsoniuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,785,724
- Issue date Oct 10, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with through hole filled with extra plating struc...
- Patent number 11,778,754
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board assemblies with engin...
- Patent number 11,711,885
- Issue date Jul 25, 2023
- TTM Technologies, Inc.
- Rick Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elastic printed conductors
- Patent number 11,343,910
- Issue date May 24, 2022
- The Governors of the University of Alberta
- Hyun-Joong Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board mounting piezoelectric transformer
- Patent number 11,307,525
- Issue date Apr 19, 2022
- Canon Kabushiki Kaisha
- Taro Minobe
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,294,285
- Issue date Apr 5, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit package substrate
- Patent number 11,166,379
- Issue date Nov 2, 2021
- Intel Corporation
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar coil element and method for producing planar coil element
- Patent number 11,083,092
- Issue date Aug 3, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating of printed circuit board core during laminate cure
- Patent number 11,044,819
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Eric J. Campbell
- B32 - LAYERED PRODUCTS
Information Patent Grant
Capacitive devices and methods of fabricating same
- Patent number 10,845,924
- Issue date Nov 24, 2020
- Sun Chemical Corporation
- Mathew Mathew
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for reducing audible and/or electrical noise from...
- Patent number 10,832,870
- Issue date Nov 10, 2020
- Allison Transmission, Inc.
- Steven D. Slagle
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Printed circuit board mounting piezoelectric transformer
- Patent number 10,671,009
- Issue date Jun 2, 2020
- Canon Kabushiki Kaisha
- Taro Minobe
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,653,011
- Issue date May 12, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 10,522,515
- Issue date Dec 31, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising a deformation counteracting structure
- Patent number 10,420,206
- Issue date Sep 17, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 10,420,214
- Issue date Sep 17, 2019
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 10,390,438
- Issue date Aug 20, 2019
- Intel Corporation
- Qinglei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device module and method of manufacturing the same
- Patent number 10,356,911
- Issue date Jul 16, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method of manufacturing the same
- Patent number 10,321,566
- Issue date Jun 11, 2019
- Toppan Printing Co., Ltd.
- Yasuyuki Hitsuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heating of printed circuit board core during laminate cure
- Patent number 10,285,283
- Issue date May 7, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 10,256,214
- Issue date Apr 9, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a printed circuit board having high densi...
- Patent number 10,219,387
- Issue date Feb 26, 2019
- NVIDIA Corporation
- Leilei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for encapsulating a hybrid assembly of electronic component...
- Patent number 10,201,094
- Issue date Feb 5, 2019
- Medtronic, Inc.
- Chunho Kim
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL CIRCUIT BOARD PROCESSING APPARATUS
- Publication number 20240224428
- Publication date Jul 4, 2024
- Simetric Semiconductor Solutions Co., Ltd.
- Marcus Elmar Lang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20240155773
- Publication date May 9, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Sheet with Double-Sided Structured Condu...
- Publication number 20240032207
- Publication date Jan 25, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Antonio ALTANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD
- Publication number 20230380075
- Publication date Nov 23, 2023
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING
- Publication number 20230262904
- Publication date Aug 17, 2023
- Peters Research GmbH & Co. Kommanditgesellschaft
- Ralf SCHWARTZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR AND PRINTED CIRCUIT BOARD WITH ELECTRICAL CONN...
- Publication number 20220045447
- Publication date Feb 10, 2022
- Unify Patente GmbH & Co. KG
- Marcelo Samsoniuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT
- Publication number 20210329795
- Publication date Oct 21, 2021
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED ASSEMBLY ON FLEXIBLE SUBSTRATES
- Publication number 20210076504
- Publication date Mar 11, 2021
- Molex, LLC
- Michael DEPPE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MOUNTING PIEZOELECTRIC TRANSFORMER
- Publication number 20200257234
- Publication date Aug 13, 2020
- Canon Kabushiki Kaisha
- Taro Minobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Through Hole Filled With Extra Plating Struc...
- Publication number 20200253062
- Publication date Aug 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, DEVICE, AND SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20200221579
- Publication date Jul 9, 2020
- Gebr. Schmid GmbH
- Christian Schmid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20190279964
- Publication date Sep 12, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE
- Publication number 20190200463
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINT HEAD MAINTENANCE
- Publication number 20190037704
- Publication date Jan 31, 2019
- MUTRACX INTERNATIONAL B.V.
- Henk Jan ZWIERS
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
A Method for Making Patterned Conductive Textiles
- Publication number 20180168032
- Publication date Jun 14, 2018
- DST Innovations Limited
- Anthony Miles
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR REDUCING AUDIBLE AND/OR ELECTRICAL NOISE FROM...
- Publication number 20180068799
- Publication date Mar 8, 2018
- ALLISON TRANSMISSION, INC.
- Steven D. Slagle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD
- Publication number 20170347461
- Publication date Nov 30, 2017
- MUTRACX INTERNATIONAL B.V.
- Henk Jan ZWIERS
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
- Publication number 20170208696
- Publication date Jul 20, 2017
- Subtron Technology Co., Ltd.
- Tzu-Wei Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING GLASS COMPONENT, GLASS COMPONENT, AND GLASS...
- Publication number 20150313020
- Publication date Oct 29, 2015
- Asahi Glass Company, Limited
- Shintaro TAKAHASHI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD
- Publication number 20140374375
- Publication date Dec 25, 2014
- Henk Jan Zwiers
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
CONDUCTIVE CONNECTION STRUCTURE FOR CONDUCTIVE WIRING LAYER OF FLEX...
- Publication number 20140374148
- Publication date Dec 25, 2014
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20140374152
- Publication date Dec 25, 2014
- Yuichi Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING T...
- Publication number 20140369016
- Publication date Dec 18, 2014
- Seol Hee Lim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TRANSPARENT CONDUCTIVE FILM
- Publication number 20140353009
- Publication date Dec 4, 2014
- NANCHANG O-FILM TECH CO., LTD.
- YUNHUA ZHAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140353027
- Publication date Dec 4, 2014
- IBIDEN CO., LTD.
- Atsushi OSAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED TOUCH SENSOR WITH DECORATIVE...
- Publication number 20140338191
- Publication date Nov 20, 2014
- Uni-Pixel Displays, Inc.
- Robert J. Petcavich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...
- Publication number 20140339094
- Publication date Nov 20, 2014
- Hajime WATANABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20140321087
- Publication date Oct 30, 2014
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PRODUCING TWO-SIDED PATTERNED WEB IN REGIS...
- Publication number 20140239555
- Publication date Aug 28, 2014
- 3M Innovative Properties Company
- John S. Huizinga
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Processing both sides of a PCB by the same process Providing a similar arrangement of components on both sides Making interlayer connections from two sides

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional circuit board processing apparatus

Method for manufacturing shielded printed wiring board and shielded...

Apparatus for manufacturing printed circuit boards

Method for manufacturing transparent circuit board

Apparatus for manufacturing printed circuit boards

Elastic printed conductors

Electrical connector and printed circuit board with electrical conn...

Planar coil element and method for producing planar coil element

Component carrier with through hole filled with extra plating struc...

Method of manufacturing printed circuit board assemblies with engin...

Elastic printed conductors

Printed circuit board mounting piezoelectric transformer

Method for manufacturing circuit board

Integrated circuit package substrate

Planar coil element and method for producing planar coil element

Heating of printed circuit board core during laminate cure

Capacitive devices and methods of fabricating same

Method and system for reducing audible and/or electrical noise from...

Printed circuit board mounting piezoelectric transformer

Method for manufacturing circuit board

Computer modules with small thicknesses and associated methods of m...

Component carrier comprising a deformation counteracting structure

Printed wiring board

Integrated circuit package substrate

Electronic device module and method of manufacturing the same

Printed wiring board and method of manufacturing the same

Heating of printed circuit board core during laminate cure

Computer modules with small thicknesses and associated methods of m...

Process for manufacturing a printed circuit board having high densi...

Systems for encapsulating a hybrid assembly of electronic component...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL CIRCUIT BOARD PROCESSING APPARATUS

TRANSPARENT CIRCUIT BOARD

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

Method for Manufacturing a Sheet with Double-Sided Structured Condu...

CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD

METHOD FOR AT LEAST PARTIALLY CLOSING A CHANNEL-SHAPED OPENING

ELECTRICAL CONNECTOR AND PRINTED CIRCUIT BOARD WITH ELECTRICAL CONN...

PLANAR COIL ELEMENT AND METHOD FOR PRODUCING PLANAR COIL ELEMENT

DOUBLE-SIDED ASSEMBLY ON FLEXIBLE SUBSTRATES

PRINTED CIRCUIT BOARD MOUNTING PIEZOELECTRIC TRANSFORMER

Component Carrier With Through Hole Filled With Extra Plating Struc...

METHOD, DEVICE, AND SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARDS

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

HEATING OF PRINTED CIRCUIT BOARD CORE DURING LAMINATE CURE

PRINT HEAD MAINTENANCE

A Method for Making Patterned Conductive Textiles

METHOD AND SYSTEM FOR REDUCING AUDIBLE AND/OR ELECTRICAL NOISE FROM...

INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD

MANUFACTURING METHOD OF CIRCUIT SUBSTRATE

METHOD OF MANUFACTURING GLASS COMPONENT, GLASS COMPONENT, AND GLASS...

INKJET SYSTEM FOR PRINTING A PRINTED CIRCUIT BOARD

CONDUCTIVE CONNECTION STRUCTURE FOR CONDUCTIVE WIRING LAYER OF FLEX...

CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENTS

PRINTED CIRCUIT BOARD FOR MEMORY CARD AND METHOD OF MANUFACTURING T...

TRANSPARENT CONDUCTIVE FILM

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD OF MANUFACTURING AN INTEGRATED TOUCH SENSOR WITH DECORATIVE...

PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND...

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

APPARATUS AND METHOD FOR PRODUCING TWO-SIDED PATTERNED WEB IN REGIS...