Projectile

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CPC
H05K2203/0178

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0178Projectile

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and system for processing frozen adhesive particles
- Patent number 8,236,377
- Issue date Aug 7, 2012
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Erik Christian Nicolaas Puik
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Printed Circuit Board and Method Of Manufacturing The Same
- Publication number 20130139383
- Publication date Jun 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Kye Won Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROCESSING FROZEN ADHESIVE PARTICLES
- Publication number 20120304923
- Publication date Dec 6, 2012
- Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO
- Erik Christian Nicolaas Puik
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD ADN METHOD OF MANUFACTURING THE SAME
- Publication number 20110266038
- Publication date Nov 3, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kye Won CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PROCESSING FROZEN ADHESIVE PARTICLES
- Publication number 20100189892
- Publication date Jul 29, 2010
- Erik Christian Nicolaas Puik
- B81 - MICRO-STRUCTURAL TECHNOLOGY