Properties and characteristics in general

Industry

CPC
H05K2201/0104

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0104Properties and characteristics in general

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,317,462
- Issue date May 27, 2025
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with self-healing properties
- Patent number 11,643,525
- Issue date May 9, 2023
- Korea University Research and Business Foundation
- Jeongsook Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board using low dielectric resin composition
- Patent number 11,261,328
- Issue date Mar 1, 2022
- Zhen Ding Technology Co., Ltd.
- Szu-Hsiang Su
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Insulation systems and methods of depositing insulation systems
- Patent number 10,968,529
- Issue date Apr 6, 2021
- General Electric Company
- Weijun Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric resin composition, film and circuit board using the...
- Patent number 10,894,882
- Issue date Jan 19, 2021
- Zhen Ding Technology Co., Ltd.
- Szu-Hsiang Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film and flexible metal laminate
- Patent number 10,716,203
- Issue date Jul 14, 2020
- AGC Inc.
- Tomoya Hosoda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Surface layer for electronic device
- Patent number 10,703,921
- Issue date Jul 7, 2020
- Xerox Corporation
- Jin Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Ultrasonic phased array probe using PCB as matching layer
- Patent number 10,576,499
- Issue date Mar 3, 2020
- Olympus Scientific Solutions Americas Inc.
- Sheng Liu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Transponder wire bonded to round wire on adhesive tape having a wat...
- Patent number 10,438,109
- Issue date Oct 8, 2019
- Automated Assembly Corporation
- Robert Neuman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nitride semiconductor light-emitting element base and manufacturing...
- Patent number 10,412,829
- Issue date Sep 10, 2019
- Soko Kagaku Co., Ltd.
- Akira Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive glass paste and electronic component
- Patent number 10,390,427
- Issue date Aug 20, 2019
- Murata Manufacturing Co., Ltd.
- Hiroyuki Kanbara
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Backplane electronic board and associated electronic control unit
- Patent number 10,375,849
- Issue date Aug 6, 2019
- Safran Electronics & Defense
- Francois Guillot
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printing method using two lasers
- Patent number 10,362,683
- Issue date Jul 23, 2019
- Centre National de la Recherche Scientifique
- Anne Patricia Blanche Alloncle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition, and film and printed circuit boar...
- Patent number 10,329,368
- Issue date Jun 25, 2019
- Zhen Ding Technology Co., Ltd.
- Mao-Feng Hsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for coating devices and resulting products
- Patent number 10,271,435
- Issue date Apr 23, 2019
- Nanoshield Technology Co., Ltd.
- James Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing substrate with transparent electrode, and subs...
- Patent number 10,138,541
- Issue date Nov 27, 2018
- Kaneka Corporation
- Hironori Hayakawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit boards having a dielectric layer which includes a p...
- Patent number 9,986,636
- Issue date May 29, 2018
- Infineon Technologies AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 9,924,594
- Issue date Mar 20, 2018
- Infineon Technologies AG
- Andre Arens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory card, printed circuit board for memory card an...
- Patent number 9,867,288
- Issue date Jan 9, 2018
- LG Innotek Co., Ltd
- Seol Hee Lim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Heat dissipating structure
- Patent number 9,826,623
- Issue date Nov 21, 2017
- Kaneka Corporation
- Aki Koukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate repair structure, manufacturing method thereof,...
- Patent number 9,763,322
- Issue date Sep 12, 2017
- Industrial Technology Research Institute
- Chao-Jen Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Boron nitride/resin composite circuit board, and circuit board incl...
- Patent number 9,516,741
- Issue date Dec 6, 2016
- Denka Company Limited
- Hideki Hirotsuru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for pore sealing of porous materials using polyimide langmui...
- Patent number 9,492,841
- Issue date Nov 15, 2016
- IMEC
- Victor Luchinin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 9,412,726
- Issue date Aug 9, 2016
- Japan Display Inc.
- Tsuneyuki Asaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Graphitic substrates with ceramic dielectric layers
- Patent number 9,107,308
- Issue date Aug 11, 2015
- PEN Inc.
- Nan Jiang
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT CARRIER AND METHOD
- Publication number 20250106993
- Publication date Mar 27, 2025
- Vitesco Technologies GMBH
- Detlev BAGUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20250098077
- Publication date Mar 20, 2025
- HZO, Inc.
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF
- Publication number 20240206050
- Publication date Jun 20, 2024
- WUHAN TIANMA MICROELECTRONICS CO., LTD.
- Xuejing XIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240182614
- Publication date Jun 6, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masashi KODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240074127
- Publication date Feb 29, 2024
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BASE SUBSTRATE
- Publication number 20230110469
- Publication date Apr 13, 2023
- MITSUBISHI MATERIALS CORPORATION
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD USING LOW DIELECTRIC RESIN COMPOSITION
- Publication number 20210102067
- Publication date Apr 8, 2021
- ZHEN DING TECHNOLOGY CO., LTD.
- SZU-HSIANG SU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC DEVICE WITH SELF-HEALING PROPERTIES
- Publication number 20210095101
- Publication date Apr 1, 2021
- Korea University Research and Business Foundation
- Jeongsook HA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INSULATION SYSTEMS AND METHODS OF DEPOSITING INSULATION SYSTEMS
- Publication number 20200347509
- Publication date Nov 5, 2020
- GENERAL ELECTRIC COMPANY
- Weijun Yin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE LAYER FOR ELECTRONIC DEVICE
- Publication number 20190225815
- Publication date Jul 25, 2019
- Xerox Corporation
- Jin WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190090358
- Publication date Mar 21, 2019
- Semblant Limited
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW DIELECTRIC RESIN COMPOSITION, FILM AND CIRCUIT BOARD USING THE...
- Publication number 20180265699
- Publication date Sep 20, 2018
- ZHEN DING TECHNOLOGY CO., LTD.
- SZU-HSIANG SU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE GLASS PASTE AND ELECTRONIC COMPONENT
- Publication number 20180220529
- Publication date Aug 2, 2018
- Murata Manufacturing Co., Ltd.
- Hiroyuki KANBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT BASE AND MANUFACTURING...
- Publication number 20180199433
- Publication date Jul 12, 2018
- Soko Kagaku Co., Ltd.
- Akira HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUPPORT FOR AN ELECTRONIC CIRCUIT, AND METHOD FOR MANUFACTU...
- Publication number 20180192507
- Publication date Jul 5, 2018
- OSRAM GMBH
- Michael Schöwel
- F21 - LIGHTING
Information Patent Application
BACKPLANE ELECTRONIC BOARD AND ASSOCIATED ELECTRONIC CONTROL UNIT
- Publication number 20180110149
- Publication date Apr 19, 2018
- SAFRAN ELECTRONICS & DEFENSE
- Francois GUILLOT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20180067581
- Publication date Mar 8, 2018
- LG CHEM, LTD.
- Ilha LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR COATING DEVICES AND RESULTING PRODUCTS
- Publication number 20170367192
- Publication date Dec 21, 2017
- Nanoshield Technology Co. Ltd.
- James Cheng LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW DK/DF SOLDER RESISTANT COMPOSITION USE FOR PRINTED CIRCUIT BOARD
- Publication number 20170363958
- Publication date Dec 21, 2017
- Nan Ya Plastics Corporation
- Cheng-Chung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, AND FILM AND PRINTED CIRCUIT BOAR...
- Publication number 20170362361
- Publication date Dec 21, 2017
- ZHEN DING TECHNOLOGY CO., LTD.
- MAO-FENG HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC PHASED ARRAY PROBE USING PCB AS MATCHING LAYER
- Publication number 20170246663
- Publication date Aug 31, 2017
- Olympus Scientific Solutions Americas Inc.
- Sheng Liu
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
FLEXIBLE SUBSTRATE REPAIR STRUCTURE, MANUFACTURING METHOD THEREOF,...
- Publication number 20170208682
- Publication date Jul 20, 2017
- Industrial Technology Research Institute
- Chao-Jen Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Boards Having a Dielectric Layer Which Includes a P...
- Publication number 20170208684
- Publication date Jul 20, 2017
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THER...
- Publication number 20170158807
- Publication date Jun 8, 2017
- DIC CORPORATION
- Yasuyo YOSHIMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS
- Publication number 20170094787
- Publication date Mar 30, 2017
- Samsung Electronics Co., Ltd.
- Sung-yong JOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20170094810
- Publication date Mar 30, 2017
- Semblant Limited
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20160270220
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Hirofumi Omote
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ADHESIVE FILM AND FLEXIBLE METAL LAMINATE
- Publication number 20160242274
- Publication date Aug 18, 2016
- Asahi Glass Company, Limited
- Tomoya HOSODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCL...
- Publication number 20160227644
- Publication date Aug 4, 2016
- Denka Company Limited
- Hideki HIROTSURU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING STRUCTURE
- Publication number 20160157334
- Publication date Jun 2, 2016
- Kaneka Corporation
- Aki KOUKAMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Properties and characteristics in general

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package and method of manufacturing the same

Electronic device with self-healing properties

Circuit board using low dielectric resin composition

Insulation systems and methods of depositing insulation systems

Low dielectric resin composition, film and circuit board using the...

Adhesive film and flexible metal laminate

Surface layer for electronic device

Ultrasonic phased array probe using PCB as matching layer

Transponder wire bonded to round wire on adhesive tape having a wat...

Nitride semiconductor light-emitting element base and manufacturing...

Photosensitive glass paste and electronic component

Backplane electronic board and associated electronic control unit

Printing method using two lasers

Photosensitive resin composition, and film and printed circuit boar...

Method for coating devices and resulting products

Method for producing substrate with transparent electrode, and subs...

Printed circuit boards having a dielectric layer which includes a p...

Power semiconductor module and method for producing a power semicon...

Semiconductor memory card, printed circuit board for memory card an...

Heat dissipating structure

Flexible substrate repair structure, manufacturing method thereof,...

Boron nitride/resin composite circuit board, and circuit board incl...

Method for pore sealing of porous materials using polyimide langmui...

Display device

Graphitic substrates with ceramic dielectric layers

Patents Applicationslast 30 patents

CIRCUIT CARRIER AND METHOD

COATED ELECTRICAL ASSEMBLY

CIRCUIT BOARD AND ELECTRONIC DEVICE THEREOF

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

METAL BASE SUBSTRATE

CIRCUIT BOARD USING LOW DIELECTRIC RESIN COMPOSITION

ELECTRONIC DEVICE WITH SELF-HEALING PROPERTIES

INSULATION SYSTEMS AND METHODS OF DEPOSITING INSULATION SYSTEMS

SURFACE LAYER FOR ELECTRONIC DEVICE

COATED ELECTRICAL ASSEMBLY

LOW DIELECTRIC RESIN COMPOSITION, FILM AND CIRCUIT BOARD USING THE...

PHOTOSENSITIVE GLASS PASTE AND ELECTRONIC COMPONENT

NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT BASE AND MANUFACTURING...

CIRCUIT SUPPORT FOR AN ELECTRONIC CIRCUIT, AND METHOD FOR MANUFACTU...

BACKPLANE ELECTRONIC BOARD AND ASSOCIATED ELECTRONIC CONTROL UNIT

CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREFOR

METHOD FOR COATING DEVICES AND RESULTING PRODUCTS

LOW DK/DF SOLDER RESISTANT COMPOSITION USE FOR PRINTED CIRCUIT BOARD

PHOTOSENSITIVE RESIN COMPOSITION, AND FILM AND PRINTED CIRCUIT BOAR...

ULTRASONIC PHASED ARRAY PROBE USING PCB AS MATCHING LAYER

FLEXIBLE SUBSTRATE REPAIR STRUCTURE, MANUFACTURING METHOD THEREOF,...

Printed Circuit Boards Having a Dielectric Layer Which Includes a P...

EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THER...

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

COATED ELECTRICAL ASSEMBLY

ELECTRONIC APPARATUS

ADHESIVE FILM AND FLEXIBLE METAL LAMINATE

BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCL...

HEAT DISSIPATING STRUCTURE