Protection against vibrations

Industry

CPC
H05K2201/2045

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/2045Protection against vibrations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Implantable medical device with relative motion control
- Patent number 12,172,022
- Issue date Dec 24, 2024
- Cardiac Pacemakers, Inc.
- Joel Becklund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tools and methods for reduced mechanical ringing
- Patent number 12,038,549
- Issue date Jul 16, 2024
- Halliburton Energy Services, Inc.
- Chang S. Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical energy absorbing bracket apparatus
- Patent number 11,832,410
- Issue date Nov 28, 2023
- PURE STORAGE, INC.
- Dominique Brych
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low noise capacitors
- Patent number 11,817,262
- Issue date Nov 14, 2023
- KYOCERA AVX Components Corporation
- Andrew P. Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having the same mounted thereon
- Patent number 11,665,825
- Issue date May 30, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibration isolator and method of assembly using flex circuits
- Patent number 11,572,929
- Issue date Feb 7, 2023
- Raytheon Company
- Daniel R. Farmer
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Vibration-damped circuit arrangement, converter, and aircraft havin...
- Patent number 11,564,310
- Issue date Jan 24, 2023
- Rolls-Royce Deutschland Ltd & Co KG
- Rene Blank
- G11 - INFORMATION STORAGE
Information Patent Grant
Mounting aid and method for mounting electrical components on a pri...
- Patent number 11,357,114
- Issue date Jun 7, 2022
- BorgWarner Ludwigsburg GmbH
- Sisay Tadele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vibration isolator platform with electronic acceleration compensation
- Patent number 11,332,362
- Issue date May 17, 2022
- BLILEY TECHNOLOGIES, INC.
- Jay Mitchell
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed circuit board assembly
- Patent number 11,277,914
- Issue date Mar 15, 2022
- Mitsubishi Electric Corporation
- Shusaku Nakase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and electronic component including the same
- Patent number 11,264,166
- Issue date Mar 1, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Rim Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,206,737
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,166,375
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with SA/BW ratio and board having the same mou...
- Patent number 11,166,376
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting system for mechanical-shock resistant printed circuit boar...
- Patent number 11,147,179
- Issue date Oct 12, 2021
- AEROVIRONMENT, INC.
- William John Nicoloff
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Printed circuit board assembly
- Patent number 11,140,770
- Issue date Oct 5, 2021
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and board having the same mounted thereon
- Patent number 11,133,132
- Issue date Sep 28, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-vibration and heat dissipation structure for memory socket
- Patent number 11,083,076
- Issue date Aug 3, 2021
- ADLINK TECHNOLOGY INC.
- Chih-Liang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component
- Patent number 11,004,608
- Issue date May 11, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,980,124
- Issue date Apr 13, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder alloy, solder joint, solder paste composition, ele...
- Patent number 10,926,360
- Issue date Feb 23, 2021
- Tamura Corporation
- Masaya Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low noise capacitors
- Patent number 10,923,277
- Issue date Feb 16, 2021
- AVX Corporation
- Andrew P. Ritter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component
- Patent number 10,910,157
- Issue date Feb 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive vibration isolating connector
- Patent number 10,912,224
- Issue date Feb 2, 2021
- Amazon Technologies, Inc.
- Jonathan Barak Flowers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Ceramic electronic component, method of producing the same, and ele...
- Patent number 10,854,388
- Issue date Dec 1, 2020
- Taiyo Yuden Co., Ltd.
- Masaki Mochigi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for reducing audible and/or electrical noise from...
- Patent number 10,832,870
- Issue date Nov 10, 2020
- Allison Transmission, Inc.
- Steven D. Slagle
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Control boxes and system-on-module circuit boards for unmanned vehi...
- Patent number 10,827,629
- Issue date Nov 3, 2020
- GE Aviation Systems LLC
- Randall Lee Neuman
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Vibration-resistant circuit arrangement for electrically connecting...
- Patent number 10,785,861
- Issue date Sep 22, 2020
- Vitesco Technologies GmbH
- Magnus Jaster
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Conductor path structure having a component received in a vibration...
- Patent number 10,779,399
- Issue date Sep 15, 2020
- POSSEHL ELECTRONICS DEUTSCHLAND GMBH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low profile, nesting capacitor collars
- Patent number 10,716,232
- Issue date Jul 14, 2020
- Raytheon Company
- Derek B. Wells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD
- Publication number 20240381524
- Publication date Nov 14, 2024
- Western Digital Technologies, Inc.
- MyungJin Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHOCK ABSORBER AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20240357737
- Publication date Oct 24, 2024
- SAMSUNG ELECTRONICS CO., LTD.
- Jaeyong PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIBRATION DAMPENING FOR HIGH-DENSITY STORAGE SYSTEM STRUCTURE
- Publication number 20240292521
- Publication date Aug 29, 2024
- Hyve Solutions Corporation
- Jayarama Narayan Shenoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INVERTER MODULE
- Publication number 20240090114
- Publication date Mar 14, 2024
- LS ELECTRIC CO., LTD.
- Jae Moon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR NONINVASIVE ACOUSTIC NOISE REDUCTION IN ELE...
- Publication number 20230217585
- Publication date Jul 6, 2023
- Microsoft Technology Licensing, LLC
- Donghwi KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAMPER SYSTEM FOR A LIDLESS INTEGRATED CIRCUIT
- Publication number 20230067409
- Publication date Mar 2, 2023
- Arista Networks, Inc.
- Robert Morris Wilcox
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220386467
- Publication date Dec 1, 2022
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION
- Publication number 20220234884
- Publication date Jul 28, 2022
- Bliley Technologies, Inc.
- Jay MITCHELL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IMPLANTABLE MEDICAL DEVICE WITH RELATIVE MOTION CONTROL
- Publication number 20220047876
- Publication date Feb 17, 2022
- Cardiac Pacemakers, Inc.
- JOEL BECKLUND
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20220030719
- Publication date Jan 27, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-VIBRATION AND HEAT DISSIPATION STRUCTURE FOR MEMORY SOCKET
- Publication number 20210219414
- Publication date Jul 15, 2021
- ADLINK TECHNOLOGY INC.
- Chih-Liang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATION-DAMPED CIRCUIT ARRANGEMENT, CONVERTER, AND AIRCRAFT HAVIN...
- Publication number 20210161002
- Publication date May 27, 2021
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Rene Blank
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20210076499
- Publication date Mar 11, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20210065983
- Publication date Mar 4, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND ELECTRONIC COMPONENT INCLUDING THE SAME
- Publication number 20200343044
- Publication date Oct 29, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Su Rim BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20200260583
- Publication date Aug 13, 2020
- Mitsubishi Electric Corporation
- Shusaku NAKASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting System for Mechanical-Shock Resistant Printed Circuit Boar...
- Publication number 20200196476
- Publication date Jun 18, 2020
- AEROVIRONMENT, INC.
- William John Nicoloff
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...
- Publication number 20200170105
- Publication date May 28, 2020
- Possehl Electronics Deutschland GmbH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Low Profile, Nesting Capacitor Collars
- Publication number 20200068738
- Publication date Feb 27, 2020
- Raytheon Company
- Derek B. Wells
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNIDIRECTIONAL PARTICLE DAMPER FOR PRINTED CIRCUIT BOARDS AND PLANA...
- Publication number 20200056673
- Publication date Feb 20, 2020
- TopLine Corporation
- Martin B. Hart
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
TOOLS AND METHODS FOR REDUCED MECHANICAL RINGING
- Publication number 20200041682
- Publication date Feb 6, 2020
- Halliburton Energy Services, Inc.
- Chang S. SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vibration-Resistant Circuit Arrangement for Electrically Connecting...
- Publication number 20200037431
- Publication date Jan 30, 2020
- CONTINENTAL AUTOMOTIVE GMBH
- Magnus Jaster
- B60 - VEHICLES IN GENERAL
Information Patent Application
AUDIBLE SIGNAL ATTENUATING PRINTED CIRCUIT BOARD
- Publication number 20190373717
- Publication date Dec 5, 2019
- Microsoft Technology Licensing, LLC
- Brian J. TOLENO
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
THERMALLY CONDUCTIVE VIBRATION ISOLATING CONNECTOR
- Publication number 20190373769
- Publication date Dec 5, 2019
- AMAZON TECHNOLOGIES, INC.
- Jonathan Barak Flowers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20190326060
- Publication date Oct 24, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20190297724
- Publication date Sep 26, 2019
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION
- Publication number 20190256348
- Publication date Aug 22, 2019
- EPACK, INC.
- Jay MITCHELL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTILAYER CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND BOARD H...
- Publication number 20190198248
- Publication date Jun 27, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Soo Hwan SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mounting System for Mechanical-Shock Resistant Printed Circuit Boar...
- Publication number 20190132981
- Publication date May 2, 2019
- AEROVIRONMENT, INC.
- William John Nicoloff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND METHOD OF MANUFACT...
- Publication number 20180268996
- Publication date Sep 20, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Jae Young NA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Protection against vibrations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Implantable medical device with relative motion control

Tools and methods for reduced mechanical ringing

Mechanical energy absorbing bracket apparatus

Low noise capacitors

Electronic component and board having the same mounted thereon

Vibration isolator and method of assembly using flex circuits

Vibration-damped circuit arrangement, converter, and aircraft havin...

Mounting aid and method for mounting electrical components on a pri...

Vibration isolator platform with electronic acceleration compensation

Printed circuit board assembly

Interposer and electronic component including the same

Composite electronic component and board having the same

Composite electronic component and board having the same

Electronic component with SA/BW ratio and board having the same mou...

Mounting system for mechanical-shock resistant printed circuit boar...

Printed circuit board assembly

Electronic component and board having the same mounted thereon

Anti-vibration and heat dissipation structure for memory socket

Composite electronic component

Multilayer electronic component and board having the same

Lead-free solder alloy, solder joint, solder paste composition, ele...

Low noise capacitors

Electronic component

Thermally conductive vibration isolating connector

Ceramic electronic component, method of producing the same, and ele...

Method and system for reducing audible and/or electrical noise from...

Control boxes and system-on-module circuit boards for unmanned vehi...

Vibration-resistant circuit arrangement for electrically connecting...

Conductor path structure having a component received in a vibration...

Low profile, nesting capacitor collars

Patents Applicationslast 30 patents

SHOCK ABSORBER ASSEMBLY FOR A PRINTED CIRCUIT BOARD

SHOCK ABSORBER AND ELECTRONIC DEVICE HAVING THE SAME

VIBRATION DAMPENING FOR HIGH-DENSITY STORAGE SYSTEM STRUCTURE

INVERTER MODULE

SYSTEMS AND METHODS FOR NONINVASIVE ACOUSTIC NOISE REDUCTION IN ELE...

DAMPER SYSTEM FOR A LIDLESS INTEGRATED CIRCUIT

METHOD OF MANUFACTURING ELECTRONIC COMPONENT

VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION

IMPLANTABLE MEDICAL DEVICE WITH RELATIVE MOTION CONTROL

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

ANTI-VIBRATION AND HEAT DISSIPATION STRUCTURE FOR MEMORY SOCKET

VIBRATION-DAMPED CIRCUIT ARRANGEMENT, CONVERTER, AND AIRCRAFT HAVIN...

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

INTERPOSER AND ELECTRONIC COMPONENT INCLUDING THE SAME

PRINTED CIRCUIT BOARD ASSEMBLY

Mounting System for Mechanical-Shock Resistant Printed Circuit Boar...

CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...

Low Profile, Nesting Capacitor Collars

UNIDIRECTIONAL PARTICLE DAMPER FOR PRINTED CIRCUIT BOARDS AND PLANA...

TOOLS AND METHODS FOR REDUCED MECHANICAL RINGING

Vibration-Resistant Circuit Arrangement for Electrically Connecting...

AUDIBLE SIGNAL ATTENUATING PRINTED CIRCUIT BOARD

THERMALLY CONDUCTIVE VIBRATION ISOLATING CONNECTOR

COMPOSITE ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD ASSEMBLY

VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION

MULTILAYER CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND BOARD H...

Mounting System for Mechanical-Shock Resistant Printed Circuit Boar...

ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND METHOD OF MANUFACT...