Providing micro- or nanometer scale roughness on a metal surface

Industry

CPC
H05K2203/0307

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0307Providing micro- or nanometer scale roughness on a metal surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Catalyzed metal foil and uses thereof to produce electrical circuits
- Patent number 12,063,748
- Issue date Aug 13, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sheet material, metal mesh and manufacturing methods thereof
- Patent number 11,466,368
- Issue date Oct 11, 2022
- TDK Corporation
- Makoto Orikasa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of copper foil and circuit board assembly for...
- Patent number 11,466,379
- Issue date Oct 11, 2022
- Nan Ya Plastics Corporation
- Shih-Ching Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil, copper foil having carrier, laminated...
- Patent number 11,401,612
- Issue date Aug 2, 2022
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,382,217
- Issue date Jul 5, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,375,624
- Issue date Jun 28, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrodeposited copper foil and electrode, and lithium-ion seconda...
- Patent number 11,362,337
- Issue date Jun 14, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,314
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface treated copper foil, copper clad laminate, and printed circ...
- Patent number 11,337,315
- Issue date May 17, 2022
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil, current collector, electrode, and lit...
- Patent number 11,283,080
- Issue date Mar 22, 2022
- Chang Chun Petrochemical Co., Ltd.
- Huei-Fang Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil
- Patent number 11,145,867
- Issue date Oct 12, 2021
- Chang Chun Petrochemical Co., Ltd.
- Chien-Ming Lai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Microetchant for copper and method for producing wiring board
- Patent number 11,053,594
- Issue date Jul 6, 2021
- MEC Company Ltd.
- Keisuke Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB transmission lines having reduced loss
- Patent number 10,903,543
- Issue date Jan 26, 2021
- Hewlett Packard Enterprise Development LP
- Andy Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing printed circuit...
- Patent number 10,827,619
- Issue date Nov 3, 2020
- Mitsubishi Electric Corporation
- Nicolas Degrenne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board pad resonance control system
- Patent number 10,779,404
- Issue date Sep 15, 2020
- Dell Products L.P.
- Vasa Mallikarjun Goud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper foil for printed circuit board with low transmi...
- Patent number 10,765,010
- Issue date Sep 1, 2020
- Chang Chun Petrochemical Co., Ltd.
- Jian-Ming Huang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Evacuated core circuit board
- Patent number 10,670,255
- Issue date Jun 2, 2020
- Thin Thermal Exchange Pte. Ltd.
- Aldo Contarino
- F21 - LIGHTING
Information Patent Grant
Metallic nano structure, method of fabricating the same, and electr...
- Patent number 10,624,205
- Issue date Apr 14, 2020
- University-Industry Foundation (UIF), Yonsei University
- Dahl-Young Khang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for printed circuit
- Patent number 10,472,728
- Issue date Nov 12, 2019
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface treated copper foil for high speed printed circuit board pr...
- Patent number 10,337,115
- Issue date Jul 2, 2019
- Chang Chun Petrochemical Co., Ltd.
- Yao-Sheng Lai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Carrier-attached copper foil, laminate, method for manufacturing pr...
- Patent number 10,332,756
- Issue date Jun 25, 2019
- JX Nippon Mining & Metals Corporation
- Terumasa Moriyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing touch sensor
- Patent number 10,303,316
- Issue date May 28, 2019
- Nissha Co., Ltd.
- Ryomei Omote
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,299,385
- Issue date May 21, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Roughened copper foil, copper clad laminate, and printed circuit board
- Patent number 10,280,501
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Satoshi Mogi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 10,257,938
- Issue date Apr 9, 2019
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Carrier-attached copper foil, laminate, method for producing printe...
- Patent number 10,251,283
- Issue date Apr 2, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method for copper-clad laminate plate
- Patent number 10,244,635
- Issue date Mar 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board for mounting electronic component
- Patent number 10,231,336
- Issue date Mar 12, 2019
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Catalyzed Metal Foil and Uses Thereof
- Publication number 20240407106
- Publication date Dec 5, 2024
- Averatek Corporation
- Shinichi Iketani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
- Publication number 20240349427
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Takehisa TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...
- Publication number 20230397332
- Publication date Dec 7, 2023
- JUMATECH GMBH
- Philipp WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD
- Publication number 20230276571
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER CLAD LAMINATE AND PRINT CIRCUIT BOARD COMPRISING THE SAME
- Publication number 20210368628
- Publication date Nov 25, 2021
- Circuit Foil Luxembourg, Sàrl
- Thomas DEVAHIF
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210360785
- Publication date Nov 18, 2021
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...
- Publication number 20210337664
- Publication date Oct 28, 2021
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY S...
- Publication number 20210259113
- Publication date Aug 19, 2021
- Nan Ya Plastics Corporation
- SHIH-CHING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CATALYZED METAL FOIL AND USES THEREOF
- Publication number 20210259112
- Publication date Aug 19, 2021
- Averatek Corporation
- Shinichi IKETANI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC COPPER FOIL FOR PRINTED CIRCUIT BOARD WITH LOW TRANSMI...
- Publication number 20200253061
- Publication date Aug 6, 2020
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Jian-Ming Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20200141010
- Publication date May 7, 2020
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD PAD RESONANCE CONTROL SYSTEM
- Publication number 20190320529
- Publication date Oct 17, 2019
- Dell Products L.P.
- Vasa Mallikarjun Goud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL FOR HIGH SPEED PRINTED CIRCUIT BOARD PR...
- Publication number 20190211466
- Publication date Jul 11, 2019
- CHANG CHUN PETROCHEMICAL CO., LTD.
- Yao-Sheng LAI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MANUFACTURING METHOD OF COPPER FOIL AND CIRCUIT BOARD ASSEMBLY FOR...
- Publication number 20190182964
- Publication date Jun 13, 2019
- Nan Ya Plastics Corporation
- SHIH-CHING LIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR HIGH FREQUENCY CIRCUIT AND METHOD FOR MANUFACTURING...
- Publication number 20190145014
- Publication date May 16, 2019
- Industrial Technology Research Institute
- Jhen-Rong Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SHEET MATERIAL, METAL MESH AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20190032221
- Publication date Jan 31, 2019
- TDK Corporation
- Makoto ORIKASA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20190003062
- Publication date Jan 3, 2019
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...
- Publication number 20180288884
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- B32 - LAYERED PRODUCTS
Information Patent Application
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
- Publication number 20180223412
- Publication date Aug 9, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi MOGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION METHOD FOR COPPER-CLAD LAMINATE PLATE
- Publication number 20180139848
- Publication date May 17, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process for Forming a Cobalt-Iron Alloy Film on a Substrate
- Publication number 20180100218
- Publication date Apr 12, 2018
- CHUNG YUAN CHRISTIAN UNIVERSITY
- Chih-Chi Chen
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20180063950
- Publication date Mar 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING TOUCH SENSOR
- Publication number 20180018041
- Publication date Jan 18, 2018
- NISSHA PRINTING CO., LTD.
- Ryomei OMOTE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flexible Copper Clad Laminate Having High Peel Strength and Manufac...
- Publication number 20170273188
- Publication date Sep 21, 2017
- Zhi Su
- B32 - LAYERED PRODUCTS
Information Patent Application
Copper Foil, Copper-Clad Laminate Board, Method For Producing Print...
- Publication number 20170208680
- Publication date Jul 20, 2017
- JX NIPPON MINING & METALS CORPORATION
- Ryo Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...
- Publication number 20170042036
- Publication date Feb 9, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...
- Publication number 20160360615
- Publication date Dec 8, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Mitsuru NOZAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR A...
- Publication number 20160340788
- Publication date Nov 24, 2016
- MEC COMPANY LTD.
- Masayo Kurii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring B...
- Publication number 20160303829
- Publication date Oct 20, 2016
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Providing micro- or nanometer scale roughness on a metal surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Catalyzed metal foil and uses thereof to produce electrical circuits

Sheet material, metal mesh and manufacturing methods thereof

Manufacturing method of copper foil and circuit board assembly for...

Surface-treated copper foil, copper foil having carrier, laminated...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Electrodeposited copper foil and electrode, and lithium-ion seconda...

Surface treated copper foil, copper clad laminate, and printed circ...

Surface treated copper foil, copper clad laminate, and printed circ...

Electrodeposited copper foil, current collector, electrode, and lit...

Surface treated copper foil

Microetchant for copper and method for producing wiring board

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, surface treated copper foil with resin...

PCB transmission lines having reduced loss

Printed circuit board and method for manufacturing printed circuit...

Circuit board pad resonance control system

Electrolytic copper foil for printed circuit board with low transmi...

Evacuated core circuit board

Metallic nano structure, method of fabricating the same, and electr...

Copper foil for printed circuit

Surface treated copper foil for high speed printed circuit board pr...

Carrier-attached copper foil, laminate, method for manufacturing pr...

Method for manufacturing touch sensor

Carrier-attached copper foil, laminate, method for producing printe...

Roughened copper foil, copper clad laminate, and printed circuit board

Surface-treated copper foil, copper foil with carrier, substrate, r...

Carrier-attached copper foil, laminate, method for producing printe...

Production method for copper-clad laminate plate

Printed wiring board for mounting electronic component

Patents Applicationslast 30 patents

LEAD FRAME AND MANUFACTURING METHOD THEREOF

Catalyzed Metal Foil and Uses Thereof

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...

METHOD FOR PRODUCING A CIRCUIT BOARD AND A SHAPED PART FOR USE IN T...

COPPER-CLAD LAMINATE PLATE AND PRINTED WIRING BOARD

COPPER CLAD LAMINATE AND PRINT CIRCUIT BOARD COMPRISING THE SAME

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

Surface Treated Copper Foil, Copper Clad Laminate, And Printed Circ...

MANUFACTURING METHOD OF CIRCUIT BOARD ASSEMBLY FOR HIGH FREQUENCY S...

CATALYZED METAL FOIL AND USES THEREOF

ELECTROLYTIC COPPER FOIL FOR PRINTED CIRCUIT BOARD WITH LOW TRANSMI...

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

CIRCUIT BOARD PAD RESONANCE CONTROL SYSTEM

SURFACE TREATED COPPER FOIL FOR HIGH SPEED PRINTED CIRCUIT BOARD PR...

MANUFACTURING METHOD OF COPPER FOIL AND CIRCUIT BOARD ASSEMBLY FOR...

COPPER FOIL FOR HIGH FREQUENCY CIRCUIT AND METHOD FOR MANUFACTURING...

SHEET MATERIAL, METAL MESH AND METHOD FOR MANUFACTURING THEREOF

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...

ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

PRODUCTION METHOD FOR COPPER-CLAD LAMINATE PLATE

Process for Forming a Cobalt-Iron Alloy Film on a Substrate

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

METHOD FOR MANUFACTURING TOUCH SENSOR

Flexible Copper Clad Laminate Having High Peel Strength and Manufac...

Copper Foil, Copper-Clad Laminate Board, Method For Producing Print...

Carrier-Attached Copper Foil, Laminate, Method For Producing Printe...

RESIN COMPOSITE ELECTROLYTIC COPPER FOIL, COPPER CLAD LAMINATE AND...

MICROETCHING SOLUTION FOR COPPER, REPLENISHMENT SOLUTION THEREFOR A...

Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring B...