Punching of holes

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CPC
H05K3/005

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/005Punching of holes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Fold flex circuit for LNOP
- Patent number 12,207,419
- Issue date Jan 21, 2025
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 12,193,164
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing microelectrode film
- Patent number 12,063,749
- Issue date Aug 13, 2024
- BOE Technology Group Co., Ltd.
- Fan Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,979,982
- Issue date May 7, 2024
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 11,950,360
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method for producing circuit board, and imaging appa...
- Patent number 11,929,569
- Issue date Mar 12, 2024
- Ricoh Company, Ltd.
- Takayoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,917,757
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Maegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bonded body for insulation circuit substrat...
- Patent number 11,908,768
- Issue date Feb 20, 2024
- Mitsubishi Materials Corporation
- Ryohei Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fold flex circuit for LNOP
- Patent number 11,903,140
- Issue date Feb 13, 2024
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a computer device
- Patent number 11,889,615
- Issue date Jan 30, 2024
- Graphcore Limited
- Stephen Felix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 11,723,152
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unit unloading system
- Patent number 11,706,875
- Issue date Jul 18, 2023
- Rokko Systems Pte Ltd.
- Yun Suk Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 11,690,178
- Issue date Jun 27, 2023
- Toppan Printing Co., Ltd.
- Hiroshi Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with low shrinkage dielectric material
- Patent number 11,688,668
- Issue date Jun 27, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight conformal phased array antenna using aerogel substrate
- Patent number 11,658,398
- Issue date May 23, 2023
- United States of America as represented by the Administrator of National Aero...
- James M. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,658,082
- Issue date May 23, 2023
- NGK Spark Plug Co., Ltd.
- Hirotake Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for manufacturing semiconductor modules
- Patent number 11,652,132
- Issue date May 16, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of making a closed cavity printed circuit board with pattern...
- Patent number 11,622,453
- Issue date Apr 4, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Method and control device for laminating display panel as well as v...
- Patent number 11,604,372
- Issue date Mar 14, 2023
- HKC CORPORATION LIMITED
- Xin Chen
- G02 - OPTICS
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 11,602,055
- Issue date Mar 7, 2023
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBOSSED INDUCTOR DESIGN FOR MOTHERBOARD VOLTAGE REGULATORS TO INCR...
- Publication number 20240312690
- Publication date Sep 19, 2024
- Intel Corporation
- Ashish SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240290632
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...
- Publication number 20240264219
- Publication date Aug 8, 2024
- MPI Corporation
- SHIH-CHING CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240244744
- Publication date Jul 18, 2024
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237221
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSPARENT LED DISPLAY DEVICE INTEGRATED WITH SMPS AND MANUFACTURI...
- Publication number 20240234393
- Publication date Jul 11, 2024
- LEORIA Inc.
- Jun Cheol KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237231
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...
- Publication number 20240147627
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMI...
- Publication number 20240147609
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tomohiro FUKAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138076
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138071
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Shogo FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240130035
- Publication date Apr 18, 2024
- FUJIFILM CORPORATION
- Yota AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240121889
- Publication date Apr 11, 2024
- Innolux Corporation
- Chi-Liang Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET
- Publication number 20240107679
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD
- Publication number 20240049396
- Publication date Feb 8, 2024
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- Cheng Ming LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING SUBSTRATE
- Publication number 20240040704
- Publication date Feb 1, 2024
- VIA MECHANICS, LTD.
- Yasushi ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Gripping Plurality of Types of Circuit Boards
- Publication number 20240025669
- Publication date Jan 25, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Yong Wang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
DISPLAY PANEL AND METHOD FOR ASSEMBLING SAME AND SPLICED DISPLAY DE...
- Publication number 20240023247
- Publication date Jan 18, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Kanmeng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE SUBSTRATE, AND METHOD FOR MANUFACTURING STRETCHABLE SUB...
- Publication number 20240008173
- Publication date Jan 4, 2024
- KOREA PHOTONICS TECHNOLOGY INSTITUTE
- Gi Dong SA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20230337365
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...
- Publication number 20230309239
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- Minoru Kambegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230275005
- Publication date Aug 31, 2023
- Mitsubishi Electric Corporation
- Shogo TOKUMARU
- H01 - BASIC ELECTRIC ELEMENTS

Punching of holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fold flex circuit for LNOP

Oxygen and humidity control in storage device

Overmolded components having sub-flush residuals

Hermetic metallized via with improved reliability

Method for manufacturing microelectrode film

Devices and methods related to metallization of ceramic substrates...

Printed wiring board and method for manufacturing printed wiring board

Substrate for high-frequency printed wiring board

Method for manufacturing ceramic substrate and ceramic substrate

Circuit board, method for producing circuit board, and imaging appa...

Circuit board

Method for fabricating asymmetric board

Method of manufacturing bonded body for insulation circuit substrat...

Fold flex circuit for LNOP

Method of manufacturing a computer device

Flexible circuit mother board and detection method thereof

Multilayer coil circuit substrate

Panel-molded electronic assemblies

Oxygen and humidity control in storage device

Unit unloading system

Multilayer printed wiring board and method of manufacturing the same

Component carrier with low shrinkage dielectric material

Adapter board and method for making adapter board

Lightweight conformal phased array antenna using aerogel substrate

Wiring substrate and method of manufacturing the same

Systems and methods for manufacturing semiconductor modules

Method of making a closed cavity printed circuit board with pattern...

Electronics assemblies for downhole use

Method and control device for laminating display panel as well as v...

Overmolded components having sub-flush residuals

Patents Applicationslast 30 patents

WIRING SUBSTRATE

HEAT SPREADER FOR MODIFIED EDGE COOLING

EMBOSSED INDUCTOR DESIGN FOR MOTHERBOARD VOLTAGE REGULATORS TO INCR...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

CIRCUIT BOARD FOR SEMICONDUCTOR TESTING AND METHOD OF MANUFACTURING...

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD FOR MANUFACTURING WIRING SUBSTRATE

TRANSPARENT LED DISPLAY DEVICE INTEGRATED WITH SMPS AND MANUFACTURI...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE PATTERN ATTACHED...

METHOD FOR MANUFACTURING STRETCHABLE CIRCUIT BOARD, METAL-CLAD LAMI...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING WIRING SUBSTRATE

ELECTRONIC APPARATUS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ASSEMBLY SHEET

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD

METHOD OF PROCESSING SUBSTRATE

Method and Apparatus for Gripping Plurality of Types of Circuit Boards

DISPLAY PANEL AND METHOD FOR ASSEMBLING SAME AND SPLICED DISPLAY DE...

STRETCHABLE SUBSTRATE, AND METHOD FOR MANUFACTURING STRETCHABLE SUB...

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

SEMICONDUCTOR DEVICE