Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations

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G02B6/4279

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4279Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations

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Patents Grantslast 30 patents

Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards and methods for manufacturing thereof for RF...
- Patent number 12,087,987
- Issue date Sep 10, 2024
- Ciena Corporation
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit boards and methods for manufacturing thereof for RF...
- Patent number 11,791,527
- Issue date Oct 17, 2023
- Ciena Corporation
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for launching tranverse magnetic waves using da...
- Patent number 11,641,239
- Issue date May 2, 2023
- ARRIS Enterprises LLC
- David B. Bowler
- G02 - OPTICS
Information Patent Grant
Interposer and electronic package
- Patent number 11,621,237
- Issue date Apr 4, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 11,592,629
- Issue date Feb 28, 2023
- Nippon Telegraph and Telephone Corporation
- Yuriko Kawamura
- G02 - OPTICS
Information Patent Grant
Active optical cable assemblies
- Patent number 11,585,994
- Issue date Feb 21, 2023
- CommScope Technologies LLC
- Nahid Islam
- G02 - OPTICS
Information Patent Grant
Data-carrying arrester
- Patent number 11,588,552
- Issue date Feb 21, 2023
- ARRIS Enterprises LLC
- David B. Bowler
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Geometric configuration of device for launching tranverse magnetic...
- Patent number 11,563,491
- Issue date Jan 24, 2023
- ARRIS Enterprises LLC
- David B. Bowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid port to legacy port converter
- Patent number 11,493,712
- Issue date Nov 8, 2022
- Dell Products L.P.
- Neal Beard
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Computing device
- Patent number 11,483,943
- Issue date Oct 25, 2022
- Hewlett Packard Enterprise Development LP
- Kevin B. Leigh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dense hybrid package integration of optically programmable chip
- Patent number 11,476,238
- Issue date Oct 18, 2022
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for large silicon photonic interposers by stitching
- Patent number 11,424,837
- Issue date Aug 23, 2022
- Cisco Technology, Inc.
- Peter De Dobbelaere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component bridge for increasing mounting surface area on feedthroug...
- Patent number 11,411,650
- Issue date Aug 9, 2022
- Applied Optoelectronics, Inc.
- Kai-Sheng Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Light emitting assembly and optical module
- Patent number 11,320,609
- Issue date May 3, 2022
- LINKTEL TECHNOLOGIES CO., LTD
- Linke Li
- G02 - OPTICS
Information Patent Grant
Fiber-optically powered antenna
- Patent number 11,309,975
- Issue date Apr 19, 2022
- Schweitzer Engineering Laboratories, Inc.
- Daniel B. Rippon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board, optical module, and optical transmission equ...
- Patent number 11,234,326
- Issue date Jan 25, 2022
- Lumentum Japan, Inc.
- Osamu Kagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Print circuit board, optical module, and optical transmission equip...
- Patent number 11,224,120
- Issue date Jan 11, 2022
- Lumentum Japan, Inc.
- Osamu Kagaya
- G02 - OPTICS
Information Patent Grant
Printed circuit boards and methods for manufacturing thereof for RF...
- Patent number 11,217,869
- Issue date Jan 4, 2022
- Ciena Corporation
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based lithium niobate film electro-optic modulator array an...
- Patent number 11,204,535
- Issue date Dec 21, 2021
- Shanghai Jiao Tong University
- Weiwen Zou
- G02 - OPTICS
Information Patent Grant
Interposer circuit
- Patent number 11,152,308
- Issue date Oct 19, 2021
- II-VI DELAWARE, INC.
- Norbert Schlepple
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical coupling assemblies and methods for optoelectronic modules
- Patent number 11,139,412
- Issue date Oct 5, 2021
- II-VI DELAWARE, INC.
- Tao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electrical/optical interface with two-tiered packaging
- Patent number 11,107,770
- Issue date Aug 31, 2021
- Xilinx, Inc.
- Suresh Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiband photonic integrated circuit (PIC) I and Q demodulator
- Patent number 11,101,894
- Issue date Aug 24, 2021
- Raytheon Company
- Michael D. Wetle
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device and method for launching tranverse magnetic waves
- Patent number 11,095,369
- Issue date Aug 17, 2021
- ARRIS Enterprises LLC
- David B. Bowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 11,054,594
- Issue date Jul 6, 2021
- Hisense Broadband Multimedia Technologies Co., Ltd
- Qiang Zhang
- G02 - OPTICS
Information Patent Grant
Methods and systems for launching tranverse magnetic waves using da...
- Patent number 11,050,490
- Issue date Jun 29, 2021
- ARRIS Enterprises LLC
- David B. Bowler
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Transmitter optical subassembly (TOSA) with laser diode driver (LDD...
- Patent number 10,948,671
- Issue date Mar 16, 2021
- Applied Optoelectronics, Inc.
- Kai-Sheng Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module
- Patent number 10,948,670
- Issue date Mar 16, 2021
- Lumentum Japan, Inc.
- Sachiko Mizuseki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods for communicating high speed signals in a commu...
- Patent number 10,944,599
- Issue date Mar 9, 2021
- Adtran, Inc.
- Daniel M. Joffe
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES
- Publication number 20240385400
- Publication date Nov 21, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Amit Oren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATER ASSEMBLY
- Publication number 20240369784
- Publication date Nov 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefano ORSI
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSMITTER AND PHOTONIC INTEGRATED CIRCUIT THEREOF
- Publication number 20240361548
- Publication date Oct 31, 2024
- Wistron Corporation
- Cheng-Hung LU
- G02 - OPTICS
Information Patent Application
MANAGING ADHESIVE MATERIAL SHAPING USING STRUCTURE ARRAYS
- Publication number 20240345336
- Publication date Oct 17, 2024
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- G02 - OPTICS
Information Patent Application
MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...
- Publication number 20240272383
- Publication date Aug 15, 2024
- PICadvanced S.A.
- Francisco Manuel RUIVO RODRIGUES
- G02 - OPTICS
Information Patent Application
SUB-MOUNT, OPTICAL MODULATION MODULE, AND OPTICAL COMMUNICATION DEVICE
- Publication number 20240151918
- Publication date May 9, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jaegyu PARK
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
- Publication number 20240103238
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- G02 - OPTICS
Information Patent Application
LOW-LOSS COPLANAR WAVEGUIDE BONDING STRUCTURE AND MANUFACTURING MET...
- Publication number 20240045160
- Publication date Feb 8, 2024
- BEIHANG UNIVERSITY
- Chen XIAO
- G02 - OPTICS
Information Patent Application
Printed circuit boards and methods for manufacturing thereof for RF...
- Publication number 20240021970
- Publication date Jan 18, 2024
- CIENA CORPORATION
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20230251441
- Publication date Aug 10, 2023
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE OPTICAL CABLE ASSEMBLIES
- Publication number 20230161123
- Publication date May 25, 2023
- CommScope Technologies LLC
- Nahid Islam
- G02 - OPTICS
Information Patent Application
HYBRID PORT TO LEGACY PORT CONVERTER
- Publication number 20220317396
- Publication date Oct 6, 2022
- Dell Products L.P.
- Neal BEARD
- G02 - OPTICS
Information Patent Application
Printed circuit boards and methods for manufacturing thereof for RF...
- Publication number 20220181761
- Publication date Jun 9, 2022
- CIENA CORPORATION
- Kaisheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Module
- Publication number 20220066110
- Publication date Mar 3, 2022
- Nippon Telegraph and Telephone Corporation
- Yuriko Kawamura
- G02 - OPTICS
Information Patent Application
Integrated Silicon Photonics Transceivers Enabling Ultra-High-Speed...
- Publication number 20220003948
- Publication date Jan 6, 2022
- Intel Corporation
- Jianying Zhou
- G02 - OPTICS
Information Patent Application
METHODS AND SYSTEMS FOR LAUNCHING TRANVERSE MAGNETIC WAVES USING DA...
- Publication number 20210391924
- Publication date Dec 16, 2021
- ARRIS Enterprises LLC
- David B. Bowler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING BOOTS FOR PROTECTING OPTICAL INTERCONNECTIONS AND RELATED A...
- Publication number 20210373260
- Publication date Dec 2, 2021
- CommScope Technologies LLC
- Nahid Islam
- G02 - OPTICS
Information Patent Application
ACTIVE OPTICAL CABLE ASSEMBLIES
- Publication number 20210364715
- Publication date Nov 25, 2021
- CommScope Technologies LLC
- Nahid Islam
- G02 - OPTICS
Information Patent Application
STACKED TRANSCEIVER ARCHITECTURE
- Publication number 20210349272
- Publication date Nov 11, 2021
- T&S Communications Co. Ltd.
- Bardia Pezeshki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Dense Hybrid Package Integration Of Optically Programmable Chip
- Publication number 20210351169
- Publication date Nov 11, 2021
- International Business Machines Corporation
- Frank Robert Libsch
- G11 - INFORMATION STORAGE
Information Patent Application
COMPUTING DEVICE
- Publication number 20210345511
- Publication date Nov 4, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Kevin B. Leigh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIBER-OPTICALLY POWERED ANTENNA
- Publication number 20210250103
- Publication date Aug 12, 2021
- Schweitzer Engineering Laboratories, Inc.
- Daniel B. Rippon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPONENT BRIDGE FOR INCREASING MOUNTING SURFACE AREA ON FEEDTHROUG...
- Publication number 20210234612
- Publication date Jul 29, 2021
- APPLIED OPTOELECTRONICS, INC.
- Kai-Sheng LIN
- G02 - OPTICS
Information Patent Application
METHOD AND SYSTEM FOR LARGE SILICON PHOTONIC INTERPOSERS BY STITCHING
- Publication number 20210175979
- Publication date Jun 10, 2021
- Luxtera LLC
- Peter DE DOBBELAERE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light emitting assembly and optical module
- Publication number 20210149132
- Publication date May 20, 2021
- Linktel Technologies Co., LTD
- Linke LI
- G02 - OPTICS
Information Patent Application
MULTIBAND PHOTONIC INTEGRATED CIRCUIT (PIC) I AND Q DEMODULATOR
- Publication number 20210124106
- Publication date Apr 29, 2021
- Raytheon Company
- Michael D. Wetle
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD, OPTICAL MODULE, AND OPTICAL TRANSMISSION EQU...
- Publication number 20210127481
- Publication date Apr 29, 2021
- Lumentum Japan, Inc.
- Osamu KAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ANTENNA PACKAGING FOR A WIRELESS ACCESS POINT
- Publication number 20210104812
- Publication date Apr 8, 2021
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COMMUNICATING HIGH SPEED SIGNALS IN A COMMU...
- Publication number 20200412584
- Publication date Dec 31, 2020
- Adtran, Inc
- Daniel M. Joffe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transceiver and interface for IC package

Printed circuit boards and methods for manufacturing thereof for RF...

Printed circuit boards and methods for manufacturing thereof for RF...

Methods and systems for launching tranverse magnetic waves using da...

Interposer and electronic package

Optical module

Active optical cable assemblies

Data-carrying arrester

Geometric configuration of device for launching tranverse magnetic...

Hybrid port to legacy port converter

Computing device

Dense hybrid package integration of optically programmable chip

Method and system for large silicon photonic interposers by stitching

Component bridge for increasing mounting surface area on feedthroug...

Light emitting assembly and optical module

Fiber-optically powered antenna

Printed circuit board, optical module, and optical transmission equ...

Print circuit board, optical module, and optical transmission equip...

Printed circuit boards and methods for manufacturing thereof for RF...

Silicon-based lithium niobate film electro-optic modulator array an...

Interposer circuit

Electrical coupling assemblies and methods for optoelectronic modules

Integrated electrical/optical interface with two-tiered packaging

Multiband photonic integrated circuit (PIC) I and Q demodulator

Device and method for launching tranverse magnetic waves

Optical module

Methods and systems for launching tranverse magnetic waves using da...

Transmitter optical subassembly (TOSA) with laser diode driver (LDD...

Optical module

Systems and methods for communicating high speed signals in a commu...

Patents Applicationslast 30 patents

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES

HEAT DISSIPATER ASSEMBLY

OPTICAL TRANSMITTER AND PHOTONIC INTEGRATED CIRCUIT THEREOF

MANAGING ADHESIVE MATERIAL SHAPING USING STRUCTURE ARRAYS

MULTIFUNCTIONAL SELF-SUSTAINED HOSTING APPARATUS AND RELATED BIDIRE...

SUB-MOUNT, OPTICAL MODULATION MODULE, AND OPTICAL COMMUNICATION DEVICE

3D System and Wafer Reconstitution with Mid-layer Interposer

LOW-LOSS COPLANAR WAVEGUIDE BONDING STRUCTURE AND MANUFACTURING MET...

Printed circuit boards and methods for manufacturing thereof for RF...

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

ACTIVE OPTICAL CABLE ASSEMBLIES

HYBRID PORT TO LEGACY PORT CONVERTER

Printed circuit boards and methods for manufacturing thereof for RF...

Optical Module

Integrated Silicon Photonics Transceivers Enabling Ultra-High-Speed...

METHODS AND SYSTEMS FOR LAUNCHING TRANVERSE MAGNETIC WAVES USING DA...

SEALING BOOTS FOR PROTECTING OPTICAL INTERCONNECTIONS AND RELATED A...

ACTIVE OPTICAL CABLE ASSEMBLIES

STACKED TRANSCEIVER ARCHITECTURE

Dense Hybrid Package Integration Of Optically Programmable Chip

COMPUTING DEVICE

FIBER-OPTICALLY POWERED ANTENNA

COMPONENT BRIDGE FOR INCREASING MOUNTING SURFACE AREA ON FEEDTHROUG...

METHOD AND SYSTEM FOR LARGE SILICON PHOTONIC INTERPOSERS BY STITCHING

Light emitting assembly and optical module

MULTIBAND PHOTONIC INTEGRATED CIRCUIT (PIC) I AND Q DEMODULATOR

PRINTED CIRCUIT BOARD, OPTICAL MODULE, AND OPTICAL TRANSMISSION EQU...

SYSTEMS AND METHODS FOR ANTENNA PACKAGING FOR A WIRELESS ACCESS POINT

SYSTEMS AND METHODS FOR COMMUNICATING HIGH SPEED SIGNALS IN A COMMU...