Recesses or grooves in insulating substrate

Industry

CPC
H05K2201/09036

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09036Recesses or grooves in insulating substrate

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Card substrate for carrying chip module and smart card thereof
- Patent number 12,336,101
- Issue date Jun 17, 2025
- PARLEX (SHANGHAI) ELECTRONICS CO., LTD.
- Ngai Man Poon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making metal patterns on flexible substrate
- Patent number 12,309,939
- Issue date May 20, 2025
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board and wiring circuit board assembly
- Patent number 12,289,830
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with plurality of condctor patterns and vias
- Patent number 12,279,364
- Issue date Apr 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support assembly, unit, and light module for a motor vehicle lighti...
- Patent number 12,267,944
- Issue date Apr 1, 2025
- HELLA GMBH & CO. KGAA
- Sebastian Bartscher
- F21 - LIGHTING
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,262,472
- Issue date Mar 25, 2025
- Hyundai Motor Company
- Nam Sik Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,238,857
- Issue date Feb 25, 2025
- Denso Corporation
- Tsuyoshi Tashima
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor storage device
- Patent number 12,232,265
- Issue date Feb 18, 2025
- Kioxia Corporation
- Koji Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board dielectric molding, machining and electrolyti...
- Patent number 12,219,698
- Issue date Feb 4, 2025
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Forming trench in IC chip through multiple trench formation and dep...
- Patent number 12,219,709
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible display device
- Patent number 12,210,388
- Issue date Jan 28, 2025
- Samsung Display Co., Ltd.
- Jun Namkung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring boards, printed wiring board assemblies, and electro...
- Patent number 12,207,411
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having embedded component
- Patent number 12,185,478
- Issue date Dec 31, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and method for manufacturing the same
- Patent number 12,171,064
- Issue date Dec 17, 2024
- Raytheon Company
- Brandon W. Pillans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skin care device providing micro current to a mask for promoting pr...
- Patent number 12,161,866
- Issue date Dec 10, 2024
- N&B LAB CO., LTD.
- Kwang Suk Hwang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Printed circuit board
- Patent number 12,167,540
- Issue date Dec 10, 2024
- LG Innotek Co., Ltd
- Eui Yeol Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module
- Patent number 12,156,339
- Issue date Nov 26, 2024
- LG Innotek Co., Ltd
- Suk Ho Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module having a soldering portion coupling a driving device...
- Patent number 12,149,811
- Issue date Nov 19, 2024
- LG Innotek Co., Ltd
- Jong Ho Chung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board PCB assembly and electronic device
- Patent number 12,127,347
- Issue date Oct 22, 2024
- HONOR DEVICE CO., LTD.
- Zhijie Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sock for monitoring human lower limb and foot performance
- Patent number 12,115,000
- Issue date Oct 15, 2024
- Sportscientia Pte. Ltd.
- Panayiotis Lazou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,114,428
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,089,325
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Jae Hwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,089,337
- Issue date Sep 10, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun Oh Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of constructing a circuitry assembly for heat dispersal usin...
- Patent number 12,068,223
- Issue date Aug 20, 2024
- Elta Systems Ltd.
- Michael Kedem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,035,485
- Issue date Jul 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Guh Hwan Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE
- Publication number 20250240891
- Publication date Jul 24, 2025
- Hyundai Motor Company
- Nam Sik Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE MEMBER
- Publication number 20250234453
- Publication date Jul 17, 2025
- Hitachi, Ltd
- Daigo KOMESU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...
- Publication number 20250220823
- Publication date Jul 3, 2025
- Hitron Technologies Inc.
- KUO-HAO PAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE DISPLAY DEVICE
- Publication number 20250199349
- Publication date Jun 19, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jun Namkung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-DOCK PRINTED CIRCUIT BOARD
- Publication number 20250203778
- Publication date Jun 19, 2025
- Weathered Security, LLC
- Dale Robert Wooden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY DEVICE AND LEAD HOLDING STRUCTURE
- Publication number 20250192337
- Publication date Jun 12, 2025
- Panasonic Energy Co.,Ltd.
- YUSUKE MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER
- Publication number 20250194018
- Publication date Jun 12, 2025
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Daniel SCHLICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES
- Publication number 20250194016
- Publication date Jun 12, 2025
- Western Digital Technologies, Inc.
- Dibin Gangadharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TRENCH IN IC CHIP THROUGH MULTIPLE TRENCH FORMATION AND DEP...
- Publication number 20250185171
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250168978
- Publication date May 22, 2025
- Murata Manufacturing Co., Ltd.
- Yosuke MATSUSHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250159802
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Yangje Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
- Publication number 20250159813
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250159797
- Publication date May 15, 2025
- CHICONY ELECTRONICS CO., LTD.
- CHIH-HUNG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250159803
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250159811
- Publication date May 15, 2025
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20250150523
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Kyonghwan CHO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION
- Publication number 20250133654
- Publication date Apr 24, 2025
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250133653
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Tsung-Lung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20250133655
- Publication date Apr 24, 2025
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- CHI SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250126705
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Eun Su KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GUIDED PAD STRUCTURES FORMED IN CIRCUIT BOARD
- Publication number 20250126713
- Publication date Apr 17, 2025
- Dell Products L.P.
- James L. PETIVAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250106985
- Publication date Mar 27, 2025
- Innolux Corporation
- Ju-Li Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT
- Publication number 20250098068
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kiyohito NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE...
- Publication number 20250071890
- Publication date Feb 27, 2025
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHAO WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...
- Publication number 20250056726
- Publication date Feb 13, 2025
- KYOCERA CORPORATION
- Yoshiki Kawazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20250039529
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- JONG HO CHUNG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Electronic Component Mounting Board
- Publication number 20250031311
- Publication date Jan 23, 2025
- ROHM CO., LTD.
- KAORU MURAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Recesses or grooves in insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component embedded substrate

Card substrate for carrying chip module and smart card thereof

Methods of making metal patterns on flexible substrate

Wiring circuit board and wiring circuit board assembly

Printed circuit board with plurality of condctor patterns and vias

Support assembly, unit, and light module for a motor vehicle lighti...

Capacitor-wire-embedded wiring board

Power module

Electronic control device

Semiconductor storage device

Printed circuit board dielectric molding, machining and electrolyti...

Forming trench in IC chip through multiple trench formation and dep...

Flexible display device

Printed wiring boards, printed wiring board assemblies, and electro...

Printed circuit board having embedded component

Component carrier and method of manufacturing a component carrier

Interconnect and method for manufacturing the same

Skin care device providing micro current to a mask for promoting pr...

Printed circuit board

Camera module

Camera module having a soldering portion coupling a driving device...

Printed circuit board PCB assembly and electronic device

Sock for monitoring human lower limb and foot performance

Electronic component embedded substrate

Printed circuit board

Circuit board

Method of constructing a circuitry assembly for heat dispersal usin...

Electronic device and method of manufacturing the same

Electronic module and method for producing an electronic module

Printed circuit board and method for manufacturing the same

Patents Applicationslast 30 patents

POWER MODULE

COMPOSITE MEMBER

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...

FLEXIBLE DISPLAY DEVICE

MULTI-DOCK PRINTED CIRCUIT BOARD

POWER SUPPLY DEVICE AND LEAD HOLDING STRUCTURE

COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER

EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES

FORMING TRENCH IN IC CHIP THROUGH MULTIPLE TRENCH FORMATION AND DEP...

ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS

MEMBRANE CIRCUIT BOARD

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

SEMICONDUCTOR STORAGE DEVICE

DISPLAY AND ELECTRONIC DEVICE COMPRISING SAME

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

GUIDED PAD STRUCTURES FORMED IN CIRCUIT BOARD

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT

CIRCUIT BOARD

STRETCHABLE CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE...

WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE USING WIRING BO...

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

CAMERA MODULE

Electronic Component Mounting Board