reinforced

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CPC
H05K1/0366

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0366reinforced

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Curable resin, curable resin composition, and cured product
- Patent number 12,157,793
- Issue date Dec 3, 2024
- DIC Corporation
- Ryuichi Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board
- Patent number 12,160,955
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sock for monitoring human lower limb and foot performance
- Patent number 12,115,000
- Issue date Oct 15, 2024
- Sportscientia Pte. Ltd.
- Panayiotis Lazou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated glass cloth, prepreg, and printed wiring board
- Patent number 12,041,727
- Issue date Jul 16, 2024
- Nitto Boseki Co., LTD
- Kazutaka Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,024,590
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mikio Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of printed circuit board dielectric molding and electrolytic...
- Patent number 12,004,306
- Issue date Jun 4, 2024
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thermosetting resin composition, prepreg containing same, metal foi...
- Patent number 11,975,507
- Issue date May 7, 2024
- Shengyi Technology Co., Ltd.
- Zhenwen Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg for printed circuit and metal-coated lam...
- Patent number 11,970,591
- Issue date Apr 30, 2024
- Shengyi Technology Co., Ltd.
- Yundong Meng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 11,963,297
- Issue date Apr 16, 2024
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting composition, prepreg, metal foil-clad laminate, resin...
- Patent number 11,939,447
- Issue date Mar 26, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yoshihiro Nakazumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluoride-based resin prepreg and circuit substrate using the same
- Patent number 11,903,127
- Issue date Feb 13, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board substrate comprising a coated boron nitride
- Patent number 11,895,768
- Issue date Feb 6, 2024
- ROGERS CORPORATION
- Eui Kyoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal-clad laminate, printed circuit board, and method of manufactu...
- Patent number 11,889,623
- Issue date Jan 30, 2024
- Kaneka Corporation
- Shusuke Yoshihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite and copper clad laminate made therefrom
- Patent number 11,839,024
- Issue date Dec 5, 2023
- DUPONT ELECTRONICS, INC.
- Yu-Cheng Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 11,820,105
- Issue date Nov 21, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mikio Sato
- B32 - LAYERED PRODUCTS
Information Patent Grant
Package substrate manufacturing method
- Patent number 11,825,607
- Issue date Nov 21, 2023
- Montage Technology (Kunshan) Co., Ltd.
- Meng Mei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overlapping printed circuit boards and electronic device including...
- Patent number 11,812,555
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Jinyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluororesin composition, and resin sheet, laminate and printed circ...
- Patent number 11,802,198
- Issue date Oct 31, 2023
- Taiwan Union Technology Corporation
- Shur-Fen Liu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board dielectric molding and electrolytic metalliza...
- Patent number 11,800,640
- Issue date Oct 24, 2023
- Infinitum Electric, Inc.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Composite panel comprising an integrated electrical circuit and man...
- Patent number 11,800,641
- Issue date Oct 24, 2023
- HUTCHINSON AERONAUTIQUE & INDUSTRIE LTÉE.
- Martin Levesque
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interconnect substrate
- Patent number 11,792,927
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Rie Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite materials including filled hollow glass filaments
- Patent number 11,765,825
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,758,655
- Issue date Sep 12, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and substrate including electronic component...
- Patent number 11,744,012
- Issue date Aug 29, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jung Byun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...
- Publication number 20240405427
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...
- Publication number 20240376243
- Publication date Nov 14, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yuji NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...
- Publication number 20240368323
- Publication date Nov 7, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hirosuke SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS
- Publication number 20240341032
- Publication date Oct 10, 2024
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...
- Publication number 20240334595
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND ELECTROLYTI...
- Publication number 20240334594
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC, INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CURABLE RESIN COMPOSITION AND CURED PRODUCT
- Publication number 20240317916
- Publication date Sep 26, 2024
- DIC CORPORATION
- Ryuichi Matsuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME,...
- Publication number 20240309138
- Publication date Sep 19, 2024
- Nippon Soda Co., Ltd.
- Taiki YAMATE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION AND USES THEREOF
- Publication number 20240301189
- Publication date Sep 12, 2024
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jen-Chi CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYISOCYANURATE-PREPREGS AND FIBER COMPOSITE COMPONENTS PRODUCED T...
- Publication number 20240301154
- Publication date Sep 12, 2024
- COVESTRO DEUTSCHLAND AG
- Xingchen Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240306293
- Publication date Sep 12, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Andrew Edward PAGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND APPLICATION THEREOF
- Publication number 20240287282
- Publication date Aug 29, 2024
- Shengyi Technology Co., Ltd.
- Naidong SHE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...
- Publication number 20240287360
- Publication date Aug 29, 2024
- AJINOMOTO CO., INC.
- Kenji KAWAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITIONS CONTAINING POLYORGANOSILOXANES HAVING POLYPHENYLENE ET...
- Publication number 20240279402
- Publication date Aug 22, 2024
- Wacker Chemie AG
- Frank SANDMEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS
- Publication number 20240276637
- Publication date Aug 15, 2024
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRIN...
- Publication number 20240247120
- Publication date Jul 25, 2024
- Shunsuke TONOUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Functional Circuit Board Core Material
- Publication number 20240237220
- Publication date Jul 11, 2024
- KEMET Electronics Corporation
- Brandon Summey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUORORESIN COMPOSITION, FLUORORESIN SHEET, LAMINATE AND SUBSTRATE...
- Publication number 20240215161
- Publication date Jun 27, 2024
- DAIKIN INDUSTRIES, LTD.
- Hirokazu KOMORI
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240182657
- Publication date Jun 6, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Akira IRIFUNE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Curable Compositions
- Publication number 20240174803
- Publication date May 30, 2024
- AGC Multi Material America, Inc.
- Laibao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTINUOUS SILICA FIBER REINFORCED COMPOSITES FOR HIGH-FREQUENCY PR...
- Publication number 20240179837
- Publication date May 30, 2024
- Corning Incorporated
- Joseph Edward McCarthy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND USES THEREOF
- Publication number 20240150567
- Publication date May 9, 2024
- TAIWAN UNION TECHNOLOGY CORPORATION
- JEN-CHI CHIANG
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240155764
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Glass Cloth and Method of Manufacture
- Publication number 20240140863
- Publication date May 2, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hajime ITOKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR
- Publication number 20240147605
- Publication date May 2, 2024
- HIROSE ELECTRIC CO., LTD.
- Xingyu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL
- Publication number 20240147633
- Publication date May 2, 2024
- DAIWA CO., LTD.
- Eiji YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND...
- Publication number 20240125050
- Publication date Apr 18, 2024
- DUPONT SAFETY & CONSTRUCTION, INC.
- Yuhei Nishimori
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
GLASS FABRIC, PREPREG, AND PRINTED CIRCUIT BOARD
- Publication number 20240121894
- Publication date Apr 11, 2024
- Asahi Kasei Kabushiki Kaisha
- Amane HIROSE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Curable resin, curable resin composition, and cured product

Circuit board

Resin composition, resin sheet, multilayer printed wiring board, an...

Sock for monitoring human lower limb and foot performance

Multi-dielectric printed circuit board

Circuit board

Surface-treated glass cloth, prepreg, and printed wiring board

Resin composition, prepreg, film with resin, metal foil with resin,...

Method of printed circuit board dielectric molding and electrolytic...

Thermosetting resin composition, prepreg containing same, metal foi...

Resin composition, prepreg for printed circuit and metal-coated lam...

Method to manufacture conductive anodic filament-resistant microvias

Fluororesin composition, fluororesin sheet, laminate and substrate...

Copper-clad laminate

Thermosetting composition, prepreg, metal foil-clad laminate, resin...

Fluoride-based resin prepreg and circuit substrate using the same

Structure for embedding and packaging multiple devices by layer and...

Printed circuit board substrate comprising a coated boron nitride

Metal-clad laminate, printed circuit board, and method of manufactu...

Composite and copper clad laminate made therefrom

Prepreg, metal-clad laminate, and wiring board

Package substrate manufacturing method

Overlapping printed circuit boards and electronic device including...

Fluororesin composition, and resin sheet, laminate and printed circ...

Printed circuit board dielectric molding and electrolytic metalliza...

Composite panel comprising an integrated electrical circuit and man...

Interconnect substrate

Composite materials including filled hollow glass filaments

Printed circuit board

Printed circuit board and substrate including electronic component...

Patents Applicationslast 30 patents

METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...

RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND ELECTROLYTI...

CURABLE RESIN COMPOSITION AND CURED PRODUCT

NOVEL (METH)ACRYLAMIDE POLYMER, RESIN COMPOSITION CONTAINING SAME,...

RESIN COMPOSITION AND USES THEREOF

POLYISOCYANURATE-PREPREGS AND FIBER COMPOSITE COMPONENTS PRODUCED T...

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

PRINTED CIRCUIT BOARD

RESIN COMPOSITION AND APPLICATION THEREOF

RESIN COMPOSITION, CURED PRODUCT, SHEET-LIKE LAMINATE MATERIAL, RES...

COMPOSITIONS CONTAINING POLYORGANOSILOXANES HAVING POLYPHENYLENE ET...

PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS

PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRIN...

Electrically Functional Circuit Board Core Material

FLUORORESIN COMPOSITION, FLUORORESIN SHEET, LAMINATE AND SUBSTRATE...

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

Curable Compositions

CONTINUOUS SILICA FIBER REINFORCED COMPOSITES FOR HIGH-FREQUENCY PR...

RESIN COMPOSITION AND USES THEREOF

PRINTED CIRCUIT BOARD

Glass Cloth and Method of Manufacture

INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR

METHOD FOR MANUFACTURING WIRING BOARD OR WIRING BOARD MATERIAL

CIRCUIT BOARD UNWOVEN FABRIC, CIRCUIT BOARD PREPREG USING SAME AND...

GLASS FABRIC, PREPREG, AND PRINTED CIRCUIT BOARD