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H05K1/0366

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0366reinforced

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, cured product, prepreg, metal foil-clad laminate...
- Patent number 12,325,770
- Issue date Jun 10, 2025
- Mitsubishi Gas Chemical Company, Inc.
- Yuji Nakashima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Preparation method for copper clad laminate having low dielectric c...
- Patent number 12,311,646
- Issue date May 27, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg, resin-equipped film, resin- equipped me...
- Patent number 12,286,500
- Issue date Apr 29, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taichi Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trim element comprising a functional layer made of carbon material
- Patent number 12,263,795
- Issue date Apr 1, 2025
- Faurecia Interieur Industrie
- Godefroy Beau
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 12,267,954
- Issue date Apr 1, 2025
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable compositions
- Patent number 12,258,445
- Issue date Mar 25, 2025
- AGC Multi Material America, Inc.
- Laibao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable device and display panel and sensor and electronic device
- Patent number 12,245,368
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongjun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board dielectric molding, machining and electrolyti...
- Patent number 12,219,698
- Issue date Feb 4, 2025
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board
- Patent number 12,219,700
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, sheet of metal foil wi...
- Patent number 12,209,160
- Issue date Jan 28, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,193,155
- Issue date Jan 7, 2025
- Asahi Kasei Kabushiki Kaisha
- Hiroyuki Honma
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Curable resin, curable resin composition, and cured product
- Patent number 12,157,793
- Issue date Dec 3, 2024
- DIC Corporation
- Ryuichi Matsuoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board
- Patent number 12,160,955
- Issue date Dec 3, 2024
- LG Innotek Co., Ltd
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sock for monitoring human lower limb and foot performance
- Patent number 12,115,000
- Issue date Oct 15, 2024
- Sportscientia Pte. Ltd.
- Panayiotis Lazou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated glass cloth, prepreg, and printed wiring board
- Patent number 12,041,727
- Issue date Jul 16, 2024
- Nitto Boseki Co., LTD
- Kazutaka Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, metal foil with resin,...
- Patent number 12,024,590
- Issue date Jul 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mikio Sato
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of printed circuit board dielectric molding and electrolytic...
- Patent number 12,004,306
- Issue date Jun 4, 2024
- INFINITUM ELECTRIC INC.
- Edward C. Carignan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thermosetting resin composition, prepreg containing same, metal foi...
- Patent number 11,975,507
- Issue date May 7, 2024
- Shengyi Technology Co., Ltd.
- Zhenwen Chen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin composition, prepreg for printed circuit and metal-coated lam...
- Patent number 11,970,591
- Issue date Apr 30, 2024
- Shengyi Technology Co., Ltd.
- Yundong Meng
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluororesin composition, fluororesin sheet, laminate and substrate...
- Patent number 11,963,297
- Issue date Apr 16, 2024
- Daikin Industries, Ltd.
- Hirokazu Komori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting composition, prepreg, metal foil-clad laminate, resin...
- Patent number 11,939,447
- Issue date Mar 26, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yoshihiro Nakazumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Fluoride-based resin prepreg and circuit substrate using the same
- Patent number 11,903,127
- Issue date Feb 13, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board substrate comprising a coated boron nitride
- Patent number 11,895,768
- Issue date Feb 6, 2024
- ROGERS CORPORATION
- Eui Kyoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF EMBEDDING AN EMBEDDABLE OBJECT INTO A STACKED SUBSTRATE A...
- Publication number 20250240890
- Publication date Jul 24, 2025
- INFINEON TECHNOLOGIES AG
- Thomas GEBHARD
- B32 - LAYERED PRODUCTS
Information Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20250234457
- Publication date Jul 17, 2025
- Asahi Kasei Kabushiki Kaisha
- Amane HIROSE
- D03 - WEAVING
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250223423
- Publication date Jul 10, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Akito HASHIMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
Wearable Device for Sports Headwear
- Publication number 20250227839
- Publication date Jul 10, 2025
- HEAD IMPACT TRAUMA LIMITED
- David Euan Murray BOWEN
- A42 - HEADWEAR
Information Patent Application
Laminate for a Printed Circuit Board
- Publication number 20250212325
- Publication date Jun 26, 2025
- Ticona LLC
- Xiaowei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20250188262
- Publication date Jun 12, 2025
- Elite Electronic Material (kunShan) Co., Ltd.
- Jun DU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AIR-PERMEABLE STRETCHABLE CIRCUIT WHICH CAN BE ACTIVATED BY STAMPIN...
- Publication number 20250176110
- Publication date May 29, 2025
- SOOCHOW UNIVERSITY
- Feng YAN
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Application
ALTERNATIVE FOR FR-4 MATERIAL
- Publication number 20250168976
- Publication date May 22, 2025
- Papershell AB
- Anders BREITHOLTZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...
- Publication number 20250168975
- Publication date May 22, 2025
- Resonac Corporation
- Masataka NISHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION...
- Publication number 20250163200
- Publication date May 22, 2025
- Nippon Soda Co., Ltd.
- Taiki YAMATE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND USES OF THE SAME
- Publication number 20250163269
- Publication date May 22, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- TSUNG-HSIEN LIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250159803
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...
- Publication number 20250151193
- Publication date May 8, 2025
- SANDISK TECHNOLOGIES, INC.
- Vigneshwarram Kumaresan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND PRODUCT THEREOF
- Publication number 20250136804
- Publication date May 1, 2025
- Elite Electronic Material (Zhongshan) Co., Ltd.
- Zhilong HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION
- Publication number 20250133654
- Publication date Apr 24, 2025
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...
- Publication number 20250115751
- Publication date Apr 10, 2025
- Isola USA Corp.
- Teck Kai Wong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20250084205
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLAME-RETARDANT COMPOSITION
- Publication number 20250051645
- Publication date Feb 13, 2025
- Chang Chun Plastics Co., Ltd.
- An-Pang TU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043043
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20250048549
- Publication date Feb 6, 2025
- Dell Products L.P.
- Sanjay Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...
- Publication number 20250043050
- Publication date Feb 6, 2025
- AGC Inc.
- Kazumi HASHIMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND DISPLAY MODULE
- Publication number 20250024607
- Publication date Jan 16, 2025
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Rong GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIODEGRADABLE COMPOSITE MATERIAL
- Publication number 20250019505
- Publication date Jan 16, 2025
- CTK RESEARCH AND DEVELOPMENT CANADA LTD.
- Jitendra Panda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008651
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...
- Publication number 20240405427
- Publication date Dec 5, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...
- Publication number 20240376243
- Publication date Nov 14, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yuji NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...
- Publication number 20240368323
- Publication date Nov 7, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Hirosuke SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS
- Publication number 20240373551
- Publication date Nov 7, 2024
- CYTEC INDUSTRIES INC.
- Nan Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS
- Publication number 20240341032
- Publication date Oct 10, 2024
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...
- Publication number 20240334595
- Publication date Oct 3, 2024
- INFINITUM ELECTRIC INC.
- Edward C. CARIGNAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Resin composition, cured product, prepreg, metal foil-clad laminate...

Preparation method for copper clad laminate having low dielectric c...

Resin composition, prepreg, resin-equipped film, resin- equipped me...

Trim element comprising a functional layer made of carbon material

Fluororesin composition, fluororesin sheet, laminate and substrate...

Curable compositions

Stretchable device and display panel and sensor and electronic device

Printed circuit board dielectric molding, machining and electrolyti...

Circuit board

Resin composition, prepreg, film with resin, sheet of metal foil wi...

Glass cloth, prepreg, and printed wiring board

Curable resin, curable resin composition, and cured product

Circuit board

Resin composition, resin sheet, multilayer printed wiring board, an...

Sock for monitoring human lower limb and foot performance

Multi-dielectric printed circuit board

Circuit board

Surface-treated glass cloth, prepreg, and printed wiring board

Resin composition, prepreg, film with resin, metal foil with resin,...

Method of printed circuit board dielectric molding and electrolytic...

Thermosetting resin composition, prepreg containing same, metal foi...

Resin composition, prepreg for printed circuit and metal-coated lam...

Method to manufacture conductive anodic filament-resistant microvias

Fluororesin composition, fluororesin sheet, laminate and substrate...

Copper-clad laminate

Thermosetting composition, prepreg, metal foil-clad laminate, resin...

Fluoride-based resin prepreg and circuit substrate using the same

Structure for embedding and packaging multiple devices by layer and...

Printed circuit board substrate comprising a coated boron nitride

Patents Applicationslast 30 patents

METHOD OF EMBEDDING AN EMBEDDABLE OBJECT INTO A STACKED SUBSTRATE A...

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

Wearable Device for Sports Headwear

Laminate for a Printed Circuit Board

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

AIR-PERMEABLE STRETCHABLE CIRCUIT WHICH CAN BE ACTIVATED BY STAMPIN...

ALTERNATIVE FOR FR-4 MATERIAL

CORE SUBSTRATE FOR WIRING BOARDS AND METHOD FOR PRODUCING SAME, AND...

DIPHENYL(METH)ACRYLAMIDE-CONTAINING THERMOSETTING RESIN COMPOSITION...

RESIN COMPOSITION AND USES OF THE SAME

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

ECO-FRIENDLY PRINTED CIRCUIT BOARD FOR HIGH TEMPERATURE AND LOW TEM...

RESIN COMPOSITION AND PRODUCT THEREOF

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING, MACHINING AND WIRE INSERTION

THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LA...

RESIN COMPOSITION

FLAME-RETARDANT COMPOSITION

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE

CURABLE POLYMER, CURABLE COMPOSITION, PREPREG, MULTILAYER BODY, MET...

CIRCUIT BOARD AND DISPLAY MODULE

BIODEGRADABLE COMPOSITE MATERIAL

PRINTED WIRING BOARD

METHOD OF IMPROVED POWER INTEGRITY FOR MMWAVE PHASED ARRAY ANTENNAS...

RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE...

RESIN COMPOSITION, PREPREG USING SAME, FILM WITH RESIN, METAL FOIL...

COMPOSITE FILMS FOR MOBILE ELECTRONIC DEVICE COMPONENTS

USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD DIELECTRIC MOLDING OR MACHINING AND ELECTROLY...