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Related components mounted on both sides of the PCB

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  • CPC
  • H05K2201/10545
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10545Related components mounted on both sides of the PCB
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240136739
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240138052
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240121889
    • Publication date Apr 11, 2024
    • Innolux Corporation
    • Chi-Liang Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE FOR MEASURING POWER IN ELECTRICAL PROTECTION PANELS IN BUILD...
    • Publication number 20240110958
    • Publication date Apr 4, 2024
    • STEMY ENERGY, S.L.
    • Alvaro SANCHEZ MIRALLES
    • G01 - MEASURING TESTING
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240080972
    • Publication date Mar 7, 2024
    • Canon Kabushiki Kaisha
    • Yasuhiro Kozuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
    • Publication number 20240040689
    • Publication date Feb 1, 2024
    • INFINEON TECHNOLOGIES AG
    • Ramdas Rangnath Ugale
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
    • Publication number 20240030096
    • Publication date Jan 25, 2024
    • Qorvo US, Inc.
    • Ke Zhu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR BANK ASSEMBLY
    • Publication number 20240032198
    • Publication date Jan 25, 2024
    • Martin J. Jennings
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRETCHABLE SUBSTRATE, AND METHOD FOR MANUFACTURING STRETCHABLE SUB...
    • Publication number 20240008173
    • Publication date Jan 4, 2024
    • KOREA PHOTONICS TECHNOLOGY INSTITUTE
    • Gi Dong SA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STAGGERED DUAL-SIDE MULTI-CHIP INTERCONNECT
    • Publication number 20230411365
    • Publication date Dec 21, 2023
    • NVIDIA Corp.
    • Shuo Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NANOSECOND PULSED POWER SOURCES HAVING MULTI-CORE TRANSFORMERS
    • Publication number 20230381514
    • Publication date Nov 30, 2023
    • Pulse Biosciences, Inc.
    • Chaofeng HUANG
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    GAS SENSOR
    • Publication number 20230375723
    • Publication date Nov 23, 2023
    • Airthings ASA
    • Bjørn Magne SUNDAL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SENSOR
    • Publication number 20230375724
    • Publication date Nov 23, 2023
    • Airthings ASA
    • Bjørn Magne SUNDAL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT FOR SURFACE SOLDERING INSTALLATION ON A CIRCUIT BOARD, AS...
    • Publication number 20230354519
    • Publication date Nov 2, 2023
    • Preh GmbH
    • Thilo SCHULTHEIS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
    • Publication number 20230328877
    • Publication date Oct 12, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Yukiya YAMAGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPACITOR-WIRE-EMBEDDED WIRING BOARD
    • Publication number 20230319998
    • Publication date Oct 5, 2023
    • Samsung Electronics Co., Ltd.
    • SOOJAE PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MIRROR-CORE MOUNTING MULTIPLE COMPUTER PROCESSOR MODULES FOR MINIMI...
    • Publication number 20230309226
    • Publication date Sep 28, 2023
    • Intel Corporation
    • Carl WILLIAMS
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTEGRATED SHOWERHEAD
    • Publication number 20230298862
    • Publication date Sep 21, 2023
    • Applied Materials, Inc.
    • Alexander BERGER
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    Semiconductor Chip Module
    • Publication number 20230269876
    • Publication date Aug 24, 2023
    • Samsung Electronics Co., Ltd.
    • Jong-Hyun SEOK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC ASSEMBLY
    • Publication number 20230240011
    • Publication date Jul 27, 2023
    • Analog Devices, Inc.
    • Hien Minh Pham
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE HAVING SUBMERSION DETECTION CIRCUIT, OPERATING ME...
    • Publication number 20230240006
    • Publication date Jul 27, 2023
    • HL MANDO CORPORATION
    • Su Min LEE
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    BATTERY PACK
    • Publication number 20230223639
    • Publication date Jul 13, 2023
    • ZHEJIANG LERA NEW ENERGY POWER TECHNOLOGY CO., LTD.
    • Hengzhao KE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE SUBSTRATE
    • Publication number 20230217593
    • Publication date Jul 6, 2023
    • LG Innotek Co., Ltd.
    • Il Sik NAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-MODE AND/OR MULTI-SPEED NON-VOLATILE MEMORY (NVM) EXPRESS (NV...
    • Publication number 20230198182
    • Publication date Jun 22, 2023
    • Samsung Electronics Co., Ltd.
    • Sompong Paul Olarig
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Staggered Dual-Side Multi-Chip Interconnect
    • Publication number 20230197696
    • Publication date Jun 22, 2023
    • NVIDIA Corp.
    • Shuo Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Platform Supports the Shortest Electrical Connection between Two QS...
    • Publication number 20230199950
    • Publication date Jun 22, 2023
    • Shuang Jin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MODULE
    • Publication number 20230189429
    • Publication date Jun 15, 2023
    • Murata Manufacturing Co., Ltd.
    • Tadashi NOMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Switched Capacitor Converter Package Structure and Method
    • Publication number 20230126760
    • Publication date Apr 27, 2023
    • Halo Microelectronics International
    • Rui Liu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER ADAPTER
    • Publication number 20230108785
    • Publication date Apr 6, 2023
    • FSP TECHNOLOGY INC.
    • Che-Min Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULE
    • Publication number 20230105635
    • Publication date Apr 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR