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Related components mounted on both sides of the PCB

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  • CPC
  • H05K2201/10545
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10545Related components mounted on both sides of the PCB
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
    • Publication number 20240422949
    • Publication date Dec 19, 2024
    • Delta Electronics, Inc.
    • Po-Chen WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC CONTROL DEVICE
    • Publication number 20240389228
    • Publication date Nov 21, 2024
    • Hitachi Astemo, Ltd.
    • Akira ISHII
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
    • Publication number 20240389244
    • Publication date Nov 21, 2024
    • Darwin Precisions Corporation
    • Keng-Kuei Liang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    KEY MODULE AND KEYBOARD
    • Publication number 20240355557
    • Publication date Oct 24, 2024
    • WISTRON CORP.
    • SHIH TING TING
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH CAPACITANCE MODULE
    • Publication number 20240357746
    • Publication date Oct 24, 2024
    • INNODISK CORPORATION
    • CHIH-CHIEH KAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL MANAGEMENT IN DATA STORAGE DEVICE
    • Publication number 20240324136
    • Publication date Sep 26, 2024
    • Western Digital Technologies, Inc.
    • Tew Wei Hong
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
    • Publication number 20240292541
    • Publication date Aug 29, 2024
    • Black & Decker Inc.
    • Joshua M. Lewis
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Circuit Board Assembly and Electronic Device
    • Publication number 20240292581
    • Publication date Aug 29, 2024
    • Honor Device Co., Ltd.
    • Jianqiang Guo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Battery Connector
    • Publication number 20240283179
    • Publication date Aug 22, 2024
    • Google LLC
    • David Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMBEDDED DUAL IN-LINE MEMORY MODULE
    • Publication number 20240260195
    • Publication date Aug 1, 2024
    • Walton Advanced Engineering, Inc
    • HONG-CHI YU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DECOUPLING CAPACITOR BOOSTER MODULE
    • Publication number 20240260193
    • Publication date Aug 1, 2024
    • Intel Corporation
    • Herh Nan Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHT-EMITTING MODULE WITH COMPACT CONVERTER CIRCUIT
    • Publication number 20240255132
    • Publication date Aug 1, 2024
    • Valeo Vision
    • Alexandre VAL
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    STACKED POWER DESIGN IN A CARD-BASED COMPUTING DEVICE
    • Publication number 20240260191
    • Publication date Aug 1, 2024
    • NVIDIA Corporation
    • Sien CHEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD AND APPARATUS FOR SURFACE MOUNT CONNECTIONS
    • Publication number 20240243496
    • Publication date Jul 18, 2024
    • CIENA CORPORATION
    • Russell Mays
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240237188
    • Publication date Jul 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240235071
    • Publication date Jul 11, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20240188218
    • Publication date Jun 6, 2024
    • Samsung Electronics Co., Ltd.
    • Yonglak CHO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic Device
    • Publication number 20240162637
    • Publication date May 16, 2024
    • SEIKO EPSON CORPORATION
    • Hitoshi UENO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240136739
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT MODULE
    • Publication number 20240138052
    • Publication date Apr 25, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshihito OTSUBO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240121889
    • Publication date Apr 11, 2024
    • Innolux Corporation
    • Chi-Liang Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE FOR MEASURING POWER IN ELECTRICAL PROTECTION PANELS IN BUILD...
    • Publication number 20240110958
    • Publication date Apr 4, 2024
    • STEMY ENERGY, S.L.
    • Alvaro SANCHEZ MIRALLES
    • G01 - MEASURING TESTING
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240080972
    • Publication date Mar 7, 2024
    • Canon Kabushiki Kaisha
    • Yasuhiro Kozuka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
    • Publication number 20240040689
    • Publication date Feb 1, 2024
    • INFINEON TECHNOLOGIES AG
    • Ramdas Rangnath Ugale
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
    • Publication number 20240030096
    • Publication date Jan 25, 2024
    • Qorvo US, Inc.
    • Ke Zhu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR BANK ASSEMBLY
    • Publication number 20240032198
    • Publication date Jan 25, 2024
    • Martin J. Jennings
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRETCHABLE SUBSTRATE, AND METHOD FOR MANUFACTURING STRETCHABLE SUB...
    • Publication number 20240008173
    • Publication date Jan 4, 2024
    • KOREA PHOTONICS TECHNOLOGY INSTITUTE
    • Gi Dong SA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STAGGERED DUAL-SIDE MULTI-CHIP INTERCONNECT
    • Publication number 20230411365
    • Publication date Dec 21, 2023
    • NVIDIA Corp.
    • Shuo Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    NANOSECOND PULSED POWER SOURCES HAVING MULTI-CORE TRANSFORMERS
    • Publication number 20230381514
    • Publication date Nov 30, 2023
    • Pulse Biosciences, Inc.
    • Chaofeng HUANG
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    GAS SENSOR
    • Publication number 20230375723
    • Publication date Nov 23, 2023
    • Airthings ASA
    • Bjørn Magne SUNDAL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR