related to vias or transitions between vias and transmission lines

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H05K1/0251

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 12,207,395
- Issue date Jan 21, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...
- Patent number 12,193,169
- Issue date Jan 7, 2025
- RadWave Technologies Inc.
- Lev Koyrakh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Branch coupler having U-shaped and L-shaped microstrip lines
- Patent number 12,069,799
- Issue date Aug 20, 2024
- Nanning FuLian FuGui Precision Industrial Co., Ltd.
- Yu-Chih Chueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and electronic device
- Patent number 12,028,968
- Issue date Jul 2, 2024
- Sony Group Corporation
- Takahiro Shinojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including connector
- Patent number 11,955,706
- Issue date Apr 9, 2024
- LG Electronics Inc.
- Seungwoo Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband routing techniques for PCB layout
- Patent number 11,937,373
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit signal enhancement method of circuit board and structure th...
- Patent number 11,937,366
- Issue date Mar 19, 2024
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reconfigurable circuit devices
- Patent number 11,924,966
- Issue date Mar 5, 2024
- Innovium, Inc.
- Vittal Balasubramanian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate, electronic circuit, antenna apparatus, electronic appara...
- Patent number 11,924,967
- Issue date Mar 5, 2024
- Kabushiki Kaisha Toshiba
- Makoto Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board devices with reconfigurable connections
- Patent number 11,916,325
- Issue date Feb 27, 2024
- Innovium, Inc.
- Vittal Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide band printed circuit board through connector
- Patent number 11,903,124
- Issue date Feb 13, 2024
- Rockwell Collins, Inc.
- Daniel S. Shaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground terminal and electronic device
- Patent number 11,881,333
- Issue date Jan 23, 2024
- Shenzhen Johan Material Technology Co., Ltd.
- Mujiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 11,871,524
- Issue date Jan 9, 2024
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having complementary signal conducting patterns
- Patent number 11,871,510
- Issue date Jan 9, 2024
- Hong Fu Jin Precision Industry (WuHan) Co., Ltd.
- Hou-Yuan Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-data throughput reconfigurable computing platform
- Patent number 11,860,815
- Issue date Jan 2, 2024
- Brookhaven Science Associates, LLC
- Shaochun Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Trace embedded probe device
- Patent number 11,839,020
- Issue date Dec 5, 2023
- MPI Corporation
- Yu-Shan Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shared vias for differential pair trace routing
- Patent number 11,832,383
- Issue date Nov 28, 2023
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having commoned ground plane
- Patent number 11,824,294
- Issue date Nov 21, 2023
- Samtec, Inc.
- Jonathan E. Buck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for break out of interconnections for high-dens...
- Patent number 11,778,731
- Issue date Oct 3, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole via and circuit board
- Patent number 11,778,742
- Issue date Oct 3, 2023
- NEC Corporation
- Takuya Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grounding structure for a printed circuit board of an information h...
- Patent number 11,758,642
- Issue date Sep 12, 2023
- Dell Products L.P.
- Fong-An Kan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD
- Publication number 20250031300
- Publication date Jan 23, 2025
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE TUNING OF MICROSTRIP TRACES
- Publication number 20250024589
- Publication date Jan 16, 2025
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...
- Publication number 20240389223
- Publication date Nov 21, 2024
- Dell Products L.P.
- SANDOR TIBOR FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD
- Publication number 20240324097
- Publication date Sep 26, 2024
- The Phoenix Company of Chicago, Inc.
- Sri Satya Parthiva Sumanam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stripline Wafer for Wafer Based Connector System
- Publication number 20240313480
- Publication date Sep 19, 2024
- TE Connectivity Solutions GMBH
- Bruce Allen CHAMPION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20240292520
- Publication date Aug 29, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE
- Publication number 20240098891
- Publication date Mar 21, 2024
- AGC Inc.
- Takeyuki KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240090140
- Publication date Mar 14, 2024
- FUJIKURA LTD.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20240074038
- Publication date Feb 29, 2024
- Murata Manufacturing Co., Ltd.
- Kentarou KAWABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240008169
- Publication date Jan 4, 2024
- ASUSTEK COMPUTER INC.
- Meng-Feng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Layout of signal traces
- Publication number 20230403786
- Publication date Dec 14, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- YUNG-CHUNG CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...
- Publication number 20230380052
- Publication date Nov 23, 2023
- Kyocera Corporation
- Yoshiki KAWAZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUOROSCOPIC IMAGING-COMPATIBLE AND X-RAY DOSE REDUCING ELECTROMAGN...
- Publication number 20230284395
- Publication date Sep 7, 2023
- RadWave Technologies Inc.
- Lev Koyrakh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230284375
- Publication date Sep 7, 2023
- ZTE Corporation
- Changgang YIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRANCH COUPLER
- Publication number 20230262881
- Publication date Aug 17, 2023
- NANNING FULIAN FUGUI PRECISION INDUSTRIAL CO., LTD.
- YU-CHIH CHUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...
- Publication number 20230239997
- Publication date Jul 27, 2023
- Unimicron Technology Corp.
- Tzu Hsuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING COMPLEMENTARY SIGNAL CONDUCTING PATTERNS
- Publication number 20230164909
- Publication date May 25, 2023
- HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
- HOU-YUAN CHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT MODULE
- Publication number 20230135728
- Publication date May 4, 2023
- Sumitomo Electric Industries, Ltd.
- Mikoto NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH
- Publication number 20230121347
- Publication date Apr 20, 2023
- Raytheon Company
- Andrew R. Southworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20230113153
- Publication date Apr 13, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BAND PRINTED CIRCUIT BOARD THROUGH CONNECTOR
- Publication number 20230053195
- Publication date Feb 16, 2023
- Daniel S. Shaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF PASSIVE MICROWAVE STOP-BAND FILTER INTO A RADIO FREQ...
- Publication number 20230046697
- Publication date Feb 16, 2023
- Lumentum Operations LLC
- Nikolai MOROZOV
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VIA STRUCTURE, METHOD FOR PREPARING SAME AND METHOD FOR REGULATING...
- Publication number 20230028527
- Publication date Jan 26, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yade FANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY FILTER
- Publication number 20220407489
- Publication date Dec 22, 2022
- Mitsubishi Electric Corporation
- Motomi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20220361320
- Publication date Nov 10, 2022
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS

related to vias or transitions between vias and transmission lines

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backplane footprint for high speed, high density electrical connectors

Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...

Capacitive compensation for vertical interconnect accesses

High powered RF part for improved manufacturability

High frequency filter

Branch coupler having U-shaped and L-shaped microstrip lines

Substrate and electronic device

Resonant-coupled transmission line

Electronic device including connector

Mating backplane for high speed, high density electrical connector

Wideband routing techniques for PCB layout

Circuit signal enhancement method of circuit board and structure th...

Structure for circuit interconnects

Package component and forming method thereof

Reconfigurable circuit devices

Substrate, electronic circuit, antenna apparatus, electronic appara...

Circuit board devices with reconfigurable connections

Wide band printed circuit board through connector

Ground terminal and electronic device

Component-incorporated substrate and method for manufacturing same

Circuit board having complementary signal conducting patterns

High-data throughput reconfigurable computing platform

Trace embedded probe device

Shared vias for differential pair trace routing

Printed circuit board having commoned ground plane

Backplane footprint for high speed, high density electrical connectors

Systems and methods for break out of interconnections for high-dens...

Through-hole via and circuit board

Backplane footprint for high speed, high density electrical connectors

Grounding structure for a printed circuit board of an information h...

Patents Applicationslast 30 patents

VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD

IMPEDANCE TUNING OF MICROSTRIP TRACES

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...

IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD

Stripline Wafer for Wafer Based Connector System

MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

PACKAGE COMPONENT

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

CIRCUIT BOARD FOR HIGH FREQUENCY DEVICES, AND HIGH FREQUENCY DEVICE

COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

MULTILAYER SUBSTRATE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

ELECTRONIC DEVICE

Layout of signal traces

HIGH-FREQUENCY BOARD, HIGH-FREQUENCY PACKAGE, AND HIGH-FREQUENCY MO...

PACKAGE COMPONENT AND FORMING METHOD THEREOF

FLUOROSCOPIC IMAGING-COMPATIBLE AND X-RAY DOSE REDUCING ELECTROMAGN...

PRINTED CIRCUIT BOARD

BRANCH COUPLER

CIRCUIT SIGNAL ENHANCEMENT METHOD OF CIRCUIT BOARD AND STRUCTURE TH...

CIRCUIT BOARD HAVING COMPLEMENTARY SIGNAL CONDUCTING PATTERNS

HIGH-FREQUENCY CIRCUIT MODULE

ADDITIVE MANUFACTURING TECHNOLOGY MICROWAVE VERTICAL LAUNCH

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

WIDE BAND PRINTED CIRCUIT BOARD THROUGH CONNECTOR

INTEGRATION OF PASSIVE MICROWAVE STOP-BAND FILTER INTO A RADIO FREQ...

VIA STRUCTURE, METHOD FOR PREPARING SAME AND METHOD FOR REGULATING...

HIGH FREQUENCY FILTER

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS