Remote solder depot on the PCB, the solder flowing to the connections from this depot

Industry

CPC
H05K2203/042

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/042Remote solder depot on the PCB, the solder flowing to the connections from this depot

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic substrate manufacturing method
- Patent number 12,108,540
- Issue date Oct 1, 2024
- AMOSENSE CO., LTD.
- Kyung Whan Woo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding member and bonding method
- Patent number 11,819,915
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Seitaro Washizuka
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Device having a substrate configured to be thermoformed coupled to...
- Patent number 11,019,729
- Issue date May 25, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Mohammed Benwadih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for void reduction in solder joints
- Patent number 10,843,284
- Issue date Nov 24, 2020
- ZKW GROUP GMBH
- Erik Edlinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, solder paste, and method for forming solder bump
- Patent number 10,836,000
- Issue date Nov 17, 2020
- Tamura Corporation
- Masanori Shibasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-phase alloy, product using said two-phase alloy, and method for...
- Patent number 10,718,038
- Issue date Jul 21, 2020
- Hitachi, Ltd.
- Masafumi Noujima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Self-heating solder flux material
- Patent number 10,610,980
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film, manufacturing method thereof, and conn...
- Patent number 10,575,410
- Issue date Feb 25, 2020
- Dexerials Corporation
- Kenichi Haga
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrically conductive adhesives
- Patent number 10,524,364
- Issue date Dec 31, 2019
- Henkel AG & Co. KGaA
- Anja Henckens
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 10,504,864
- Issue date Dec 10, 2019
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Self-heating solder flux material
- Patent number 10,328,535
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing a printed circuit board
- Patent number 10,327,325
- Issue date Jun 18, 2019
- ZK W Group GmbH
- Erik Edlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for soldering electrical or electronic components
- Patent number 10,081,069
- Issue date Sep 25, 2018
- ERSA GmbH
- Stefan Völker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern-forming method for forming a conductive circuit pattern
- Patent number 9,980,393
- Issue date May 22, 2018
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming functional part in minute space
- Patent number 9,950,925
- Issue date Apr 24, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrode joining method, production method of electrode joined str...
- Patent number 9,839,143
- Issue date Dec 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder precoating method and workpiece for electronic equipment
- Patent number 9,821,397
- Issue date Nov 21, 2017
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball mounting method and working machine for board
- Patent number 9,763,335
- Issue date Sep 12, 2017
- Fuji Machine Mfg. Co., Ltd.
- Hiromitsu Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive adhesive agent, and method for connecting e...
- Patent number 9,752,058
- Issue date Sep 5, 2017
- Dexerials Corporation
- Daisuke Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a circuitized substrate
- Patent number 9,756,724
- Issue date Sep 5, 2017
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, bonding material, and method for producing elect...
- Patent number 9,572,255
- Issue date Feb 14, 2017
- MURATA MANUFACTURING CO., LTD.
- Akihiro Nomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, printed circuit board, and method for manufac...
- Patent number 9,474,166
- Issue date Oct 18, 2016
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for solder bump formation, solder bump formation...
- Patent number 9,415,469
- Issue date Aug 16, 2016
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board
- Patent number 9,420,706
- Issue date Aug 16, 2016
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material, conductive paste, circuit board, and semicondu...
- Patent number 9,402,313
- Issue date Jul 26, 2016
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, electronic-component-mounted substrate and se...
- Patent number 9,247,652
- Issue date Jan 26, 2016
- Hitachi Chemical Company, Ltd.
- Kaoru Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder transfer substrate, manufacturing method of solder transfer...
- Patent number 9,238,278
- Issue date Jan 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked type semiconductor device and printed circuit board
- Patent number 9,111,791
- Issue date Aug 18, 2015
- Canon Kabushiki Kaisha
- Yoshitomo Fujisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20220071021
- Publication date Mar 3, 2022
- Koji SHIGETA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-HEATING SOLDER FLUX MATERIAL
- Publication number 20190232439
- Publication date Aug 1, 2019
- International Business Machines Corporation
- Eric J. Campbell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX, SOLDER PASTE, AND METHOD FOR FORMING SOLDER BUMP
- Publication number 20190084097
- Publication date Mar 21, 2019
- TAMURA CORPORATION
- Masanori SHIBASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-HEATING SOLDER FLUX MATERIAL
- Publication number 20180126497
- Publication date May 10, 2018
- International Business Machines Corporation
- ERIC J. CAMPBELL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE
- Publication number 20170305743
- Publication date Oct 26, 2017
- NAPRA CO., LTD.
- Shigenobu Sekine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLDER TRANSFER SHEET
- Publication number 20160250719
- Publication date Sep 1, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Kaichi Tsuruta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device For Soldering Electrical Or Electronic Components
- Publication number 20160184914
- Publication date Jun 30, 2016
- ERSA GMBH
- Stefan Völker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND ELECTRONIC PART
- Publication number 20160066421
- Publication date Mar 3, 2016
- FUJITSU LIMITED
- Kazuhiro Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME
- Publication number 20150237739
- Publication date Aug 20, 2015
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL MOUNTING METHOD AND WORKING MACHINE FOR BOARD
- Publication number 20150060529
- Publication date Mar 5, 2015
- FUJI MACHINE MFG. CO., LTD.
- Hiromitsu Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, AND METHOD FOR CONNECTING E...
- Publication number 20140318709
- Publication date Oct 30, 2014
- Daisuke Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STACKED TYPE SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD
- Publication number 20140231996
- Publication date Aug 21, 2014
- Canon Kabushiki Kaisha
- Yoshitomo Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECT...
- Publication number 20140218886
- Publication date Aug 7, 2014
- Murata Manufacturing Co., Ltd.
- Akihiro Nomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...
- Publication number 20140174795
- Publication date Jun 26, 2014
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS
- Publication number 20140170411
- Publication date Jun 19, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- LARRY ALAN BIDWELL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140138126
- Publication date May 22, 2014
- Tatsuta Electric Wire & Cable Co., Ltd.
- Norihiro YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...
- Publication number 20140140030
- Publication date May 22, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140110153
- Publication date Apr 24, 2014
- PANASONIC CORPORATION
- Takafumi Kashiwagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS
- Publication number 20140099499
- Publication date Apr 10, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- LARRY Alan BIDWELL
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUG...
- Publication number 20140023777
- Publication date Jan 23, 2014
- NAPRA CO., LTD.
- Shigenobu Sekine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AN...
- Publication number 20140010991
- Publication date Jan 9, 2014
- PANASONIC CORPORATION
- Daisuke Sakurai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF
- Publication number 20130277092
- Publication date Oct 24, 2013
- Nitto Denko Corporation
- Hirofumi EBE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL...
- Publication number 20130265735
- Publication date Oct 10, 2013
- Isao Nakatani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...
- Publication number 20130181041
- Publication date Jul 18, 2013
- PANASONIC CORPORATION
- Daisuke Sakurai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME
- Publication number 20130146342
- Publication date Jun 13, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE
- Publication number 20130136645
- Publication date May 30, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130068513
- Publication date Mar 21, 2013
- KYOTO ELEX CO., LTD.
- Shogo Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME
- Publication number 20130062107
- Publication date Mar 14, 2013
- PANASONIC CORPORATION
- Takayuki Higuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130008698
- Publication date Jan 10, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING CARBON/TIN MIXTURES TO METAL OR ALLOY LAYERS
- Publication number 20130004752
- Publication date Jan 3, 2013
- Udo Adler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Remote solder depot on the PCB, the solder flowing to the connections from this depot

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic substrate manufacturing method

Bonding member and bonding method

Device having a substrate configured to be thermoformed coupled to...

Method for void reduction in solder joints

Flux, solder paste, and method for forming solder bump

Two-phase alloy, product using said two-phase alloy, and method for...

Self-heating solder flux material

Anisotropic conductive film, manufacturing method thereof, and conn...

Electrically conductive adhesives

Adhesive composition, electronic-component-mounted substrate and se...

Self-heating solder flux material

Printed circuit board and method for producing a printed circuit board

Device for soldering electrical or electronic components

Pattern-forming method for forming a conductive circuit pattern

Method for forming functional part in minute space

Electrode joining method, production method of electrode joined str...

Solder precoating method and workpiece for electronic equipment

Ball mounting method and working machine for board

Component-mounted structure

Electrically conductive adhesive agent, and method for connecting e...

Method of making a circuitized substrate

Electronic device, bonding material, and method for producing elect...

Electroconductive microparticles, anisotropic electroconductive mat...

Printed wiring board, printed circuit board, and method for manufac...

Resin composition for solder bump formation, solder bump formation...

Multilayer wiring board

Conductive material, conductive paste, circuit board, and semicondu...

Adhesive composition, electronic-component-mounted substrate and se...

Solder transfer substrate, manufacturing method of solder transfer...

Stacked type semiconductor device and printed circuit board

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND ELECTRONIC DEVICE

SELF-HEATING SOLDER FLUX MATERIAL

FLUX, SOLDER PASTE, AND METHOD FOR FORMING SOLDER BUMP

SELF-HEATING SOLDER FLUX MATERIAL

METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE

SOLDER TRANSFER SHEET

Device For Soldering Electrical Or Electronic Components

SOLDER PASTE AND ELECTRONIC PART

PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME

BALL MOUNTING METHOD AND WORKING MACHINE FOR BOARD

ELECTRICALLY CONDUCTIVE ADHESIVE AGENT, AND METHOD FOR CONNECTING E...

STACKED TYPE SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD

ELECTRONIC DEVICE, BONDING MATERIAL, AND METHOD FOR PRODUCING ELECT...

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...

LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS

METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILA...

CONDUCTIVE MATERIAL, CONDUCTIVE PASTE, CIRCUIT BOARD, AND SEMICONDU...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

LAMINATION OF POLYMER THICK FILM CONDUCTOR COMPOSITIONS

METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUG...

SOLDER TRANSFER BASE, METHOD FOR PRODUCING SOLDER TRANSFER BASE, AN...

JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF

METAL NANOPARTICLE PASTE, ELECTRONIC COMPONENT ASSEMBLY USING METAL...

MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATIN...

PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME

METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE

WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

MULTILAYER WIRING BOARD AND PRODUCTION METHOD OF THE SAME

MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

METHOD FOR APPLYING CARBON/TIN MIXTURES TO METAL OR ALLOY LAYERS