Replicating the surface structure of a sacrificial layer

Industry

CPC
H05K2203/1152

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1152Replicating the surface structure of a sacrificial layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,004,304
- Issue date Jun 4, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Stacking structure applicable to manufacturing circuit board
- Patent number 11,322,377
- Issue date May 3, 2022
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board and stacking structure appli...
- Patent number 10,804,126
- Issue date Oct 13, 2020
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,674,610
- Issue date Jun 2, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,602,616
- Issue date Mar 24, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 10,368,445
- Issue date Jul 30, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of dielectric with smooth surface
- Patent number 10,070,537
- Issue date Sep 4, 2018
- Intel Corporation
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 9,955,583
- Issue date Apr 24, 2018
- JX Nippon Mining & Metals Corporation
- Masafumi Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a circuitized substrate
- Patent number 9,756,724
- Issue date Sep 5, 2017
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 9,743,529
- Issue date Aug 22, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for circuit board used in electronic devices and method f...
- Patent number 9,485,877
- Issue date Nov 1, 2016
- KYOCERA Corporation
- Katsura Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing structure with metal film, mother die for use...
- Patent number 9,332,651
- Issue date May 3, 2016
- Tokyo University of Science Foundation
- Jun Taniguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit substrate, laminated board and laminated sheet
- Patent number 8,975,537
- Issue date Mar 10, 2015
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing transfer structure and matrix for use therein
- Patent number 8,865,049
- Issue date Oct 21, 2014
- Tokyo University of Science Educational Foundation Administrative Org.
- Jun Taniguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board, semiconductor apparatus and method of manufacturing them
- Patent number 8,779,602
- Issue date Jul 15, 2014
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor p...
- Patent number 8,673,744
- Issue date Mar 18, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing multilayer printed wiring board
- Patent number 8,584,352
- Issue date Nov 19, 2013
- Ajinomoto Co., Inc.
- Hirohisa Narahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer rigid flexible printed circuit board and method for manu...
- Patent number 8,558,116
- Issue date Oct 15, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, manufacturing method thereof, and semiconductor p...
- Patent number 8,525,356
- Issue date Sep 3, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor apparatus and method of manufacturing them
- Patent number 8,502,398
- Issue date Aug 6, 2013
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate, laminated board and laminated sheet
- Patent number 8,461,462
- Issue date Jun 11, 2013
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body, method of manufacturing substrate, substrate, and s...
- Patent number 8,455,765
- Issue date Jun 4, 2013
- Sumitomo Bakelite Company, Ltd.
- Junpei Morimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing methods of multilayer printed circuit board having st...
- Patent number 8,453,322
- Issue date Jun 4, 2013
- DDI Global Corp.
- Raj Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-clad laminate
- Patent number 8,382,996
- Issue date Feb 26, 2013
- Ajinomoto Co., Inc.
- Hirohisa Narahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer board incorporating electronic component and method for...
- Patent number 8,314,343
- Issue date Nov 20, 2012
- Taiyo Yuden Co., Ltd.
- Yusuke Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating process of circuit substrate
- Patent number 8,261,436
- Issue date Sep 11, 2012
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device, method of manufacturing the circuit device, device...
- Patent number 8,258,620
- Issue date Sep 4, 2012
- Sanyo Electric Co., LTD
- Mayumi Nakasato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and circuit device
- Patent number 8,258,409
- Issue date Sep 4, 2012
- Sanyo Electric Co., Ltd.
- Yasuhiro Kohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure of printed wiring board and method for manufacturi...
- Patent number 8,227,710
- Issue date Jul 24, 2012
- TDK Corporation
- Kenji Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 8,215,010
- Issue date Jul 10, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Sung-II Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME
- Publication number 20240260175
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- In Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220192029
- Publication date Jun 16, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori SHIMIZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STACKING STRUCTURE APPLICABLE TO MANUFACTURING CIRCUIT BOARD
- Publication number 20200411349
- Publication date Dec 31, 2020
- Unimicron Technology Corp.
- Po-Hsuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20180279482
- Publication date Sep 27, 2018
- JX NIPPON MINING & METALS CORPORATION
- Masafumi ISHII
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FORMATION OF DIELECTRIC WITH SMOOTH SURFACE
- Publication number 20140353019
- Publication date Dec 4, 2014
- Deepak Arora
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...
- Publication number 20140021164
- Publication date Jan 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...
- Publication number 20140008107
- Publication date Jan 9, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...
- Publication number 20130269185
- Publication date Oct 17, 2013
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET
- Publication number 20130256018
- Publication date Oct 3, 2013
- Katsura HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20120267155
- Publication date Oct 25, 2012
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICON...
- Publication number 20120211269
- Publication date Aug 23, 2012
- Sanyo Electric Co., Ltd.
- Kouichi SAITOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120189826
- Publication date Jul 26, 2012
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METH...
- Publication number 20120160550
- Publication date Jun 28, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Sung JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM
- Publication number 20120155048
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120125667
- Publication date May 24, 2012
- Samsung Electro-Mechanics CO., LTD.
- Hyung Mi JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming a plating layer and method for manufacturing a c...
- Publication number 20120031550
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jeong-Ho Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY IN...
- Publication number 20120017437
- Publication date Jan 26, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing PCB having electronic components embedded t...
- Publication number 20120017435
- Publication date Jan 26, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Hyun Sohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing multilayered printed circuit board
- Publication number 20120005894
- Publication date Jan 12, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Jee Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT COVERFILM ADHESION ENHANCEMENT
- Publication number 20110284268
- Publication date Nov 24, 2011
- 3M Innovative Properties Company
- RAVI PALANISWAMY
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...
- Publication number 20110169164
- Publication date Jul 14, 2011
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING TRANSFER STRUCTURE AND MATRIX FOR USE THEREIN
- Publication number 20110159245
- Publication date Jun 30, 2011
- Jun Taniguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, A...
- Publication number 20110135883
- Publication date Jun 9, 2011
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS COPPER PLATING METHOD, PRINTED WIRING BOARD, METHOD FOR...
- Publication number 20110120760
- Publication date May 26, 2011
- Ryoichi Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT SUBSTRATE AND FABRICATING PROCESS THEREOF
- Publication number 20110108313
- Publication date May 12, 2011
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT STRUCTURE
- Publication number 20110100543
- Publication date May 5, 2011
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer rigid flexible printed circuit board and method for manu...
- Publication number 20110094776
- Publication date Apr 28, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET
- Publication number 20110073358
- Publication date Mar 31, 2011
- Kyocera Corporation
- Katsura Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
- Publication number 20110036625
- Publication date Feb 17, 2011
- AJINOMOTO CO., INC.
- HIROHISA NARAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Producing Structure with Metal Film, Mother Die for Use...
- Publication number 20100308204
- Publication date Dec 9, 2010
- TOKYO UNIVERSITY OF SCIENCE EDUCATIONAL FOUNDATION ADMINISTRATIVE ORGANIZATION
- Jun Taniguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Replicating the surface structure of a sacrificial layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing printed wiring board

Stacking structure applicable to manufacturing circuit board

Method for manufacturing circuit board and stacking structure appli...

Multilayer rigid flexible printed circuit board and method for manu...

Multilayer rigid flexible printed circuit board and method for manu...

Multilayer rigid flexible printed circuit board and method for manu...

Formation of dielectric with smooth surface

Surface-treated copper foil, copper foil with carrier, substrate, r...

Method of making a circuitized substrate

Multilayer rigid flexible printed circuit board and method for manu...

Structure for circuit board used in electronic devices and method f...

Process for producing structure with metal film, mother die for use...

Circuit substrate, laminated board and laminated sheet

Method for producing transfer structure and matrix for use therein

Wiring board, semiconductor apparatus and method of manufacturing them

Wiring substrate, manufacturing method thereof, and semiconductor p...

Process for producing multilayer printed wiring board

Multilayer rigid flexible printed circuit board and method for manu...

Wiring substrate, manufacturing method thereof, and semiconductor p...

Wiring board, semiconductor apparatus and method of manufacturing them

Circuit substrate, laminated board and laminated sheet

Laminated body, method of manufacturing substrate, substrate, and s...

Manufacturing methods of multilayer printed circuit board having st...

Metal-clad laminate

Multi-layer board incorporating electronic component and method for...

Fabricating process of circuit substrate

Circuit device, method of manufacturing the circuit device, device...

Circuit board and circuit device

Wiring structure of printed wiring board and method for manufacturi...

Method of manufacturing a printed circuit board

Patents Applicationslast 30 patents

CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

STACKING STRUCTURE APPLICABLE TO MANUFACTURING CIRCUIT BOARD

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

FORMATION OF DIELECTRIC WITH SMOOTH SURFACE

METHOD FOR MANUFACTURING A MULTILAYER RIGID FLEXIBLE PRINTED CIRCUI...

MULTILAYER RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANU...

WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...

CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET

CIRCUIT SUBSTRATE

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICON...

STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METH...

WIRING BOARD, SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THEM

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method for forming a plating layer and method for manufacturing a c...

CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY IN...

Method of manufacturing PCB having electronic components embedded t...

Method of manufacturing multilayered printed circuit board

FLEXIBLE CIRCUIT COVERFILM ADHESION ENHANCEMENT

WIRING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR P...

METHOD FOR PRODUCING TRANSFER STRUCTURE AND MATRIX FOR USE THEREIN

METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, A...

ELECTROLESS COPPER PLATING METHOD, PRINTED WIRING BOARD, METHOD FOR...

CIRCUIT SUBSTRATE AND FABRICATING PROCESS THEREOF

MANUFACTURING METHOD OF CIRCUIT STRUCTURE

Multilayer rigid flexible printed circuit board and method for manu...

CIRCUIT SUBSTRATE, LAMINATED BOARD AND LAMINATED SHEET

PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

Process for Producing Structure with Metal Film, Mother Die for Use...