Resin coated copper [RCC]

Industry

CPC
H05K2201/0358

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0358Resin coated copper [RCC]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 12,016,128
- Issue date Jun 18, 2024
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Highly heat-dissipating flexible printed circuit board (GFPCB), man...
- Patent number 11,937,364
- Issue date Mar 19, 2024
- SOLUETA
- Seong Hwan Jung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable resin composition, dry film, resin-clad copper foil, cured...
- Patent number 11,891,474
- Issue date Feb 6, 2024
- TAIYO HOLDINGS CO., LTD.
- Kazuhisa Yamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 11,805,600
- Issue date Oct 31, 2023
- Saint-Gobain Performance Plastics Corporation
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, and copper-clad laminate and circuit b...
- Patent number 11,680,332
- Issue date Jun 20, 2023
- Furukawa Electric Co., Ltd.
- Takahiro Tsuruta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Long laminate, method for its production and printed wiring board
- Patent number 11,632,859
- Issue date Apr 18, 2023
- AGC Inc.
- Wataru Kasai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 11,596,064
- Issue date Feb 28, 2023
- Saint-Gobain Performance Plastics Corporation
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shield film, printed wiring board using same,...
- Patent number 11,497,152
- Issue date Nov 8, 2022
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Masahiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, metal foil provided with resin layer, metal clad...
- Patent number 11,419,210
- Issue date Aug 16, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,343,916
- Issue date May 24, 2022
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shield film, printed wiring board using same,...
- Patent number 11,317,548
- Issue date Apr 26, 2022
- Tatsuta Electric Wire & Cable Co., Ltd.
- Masahiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method for manufacturing the same, and backlight
- Patent number 11,310,920
- Issue date Apr 19, 2022
- Hong Heng Sheng Electronical Technology (HuaiAn) Co., Ltd
- Zu-Ai Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards for power supplies
- Patent number 11,277,900
- Issue date Mar 15, 2022
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-clad copper foil, copper-clad laminated plate, and printed wi...
- Patent number 11,166,383
- Issue date Nov 2, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 11,122,679
- Issue date Sep 14, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hiroki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded by laminate sheet
- Patent number 11,116,083
- Issue date Sep 7, 2021
- AT&S (China) Co. Ltd.
- Annie Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper clad laminates and method for manufacturing a printed circui...
- Patent number 10,952,329
- Issue date Mar 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Youn-Gyu Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin film, substrate for printed wiring board, and printed wiring...
- Patent number 10,889,086
- Issue date Jan 12, 2021
- Sumitomo Electric Industries, Ltd.
- Kayo Hashizume
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,888,003
- Issue date Jan 5, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit boards for power supplies
- Patent number 10,827,602
- Issue date Nov 3, 2020
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shield film, printed wiring board using same,...
- Patent number 10,757,849
- Issue date Aug 25, 2020
- Tatsuta Electric Wire & Cable Co., Ltd.
- Masahiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and camera module
- Patent number 10,674,601
- Issue date Jun 2, 2020
- Taiyo Yuden Co., Ltd.
- Yuichi Sugiyama
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring board
- Patent number 10,602,622
- Issue date Mar 24, 2020
- KYOCERA Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,492,308
- Issue date Nov 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper heat dissipation material, carrier-attached copper foil, con...
- Patent number 10,464,291
- Issue date Nov 5, 2019
- JX Nippon Mining & Metals Corporation
- Hajime Momoi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of producing a connection support, connection support and op...
- Patent number 10,468,569
- Issue date Nov 5, 2019
- Osram Opto Semiconductor GmbH
- Jörg Erich Sorg
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240298410
- Publication date Sep 5, 2024
- LG Innotek Co., Ltd.
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240237233
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240138077
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD
- Publication number 20240101858
- Publication date Mar 28, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Kazuhiro OOSAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD
- Publication number 20240049395
- Publication date Feb 8, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20240023242
- Publication date Jan 18, 2024
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20230164914
- Publication date May 25, 2023
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With a Magnetic Element and a Manufacturing Method
- Publication number 20220377896
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan SALKOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...
- Publication number 20220220272
- Publication date Jul 14, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki KITAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLUORINE-CONTAINING POLYMER FOR METAL-CLAD LAMINATED SHEET, COMPOSI...
- Publication number 20220153890
- Publication date May 19, 2022
- DAIKIN INDUSTRIES, LTD.
- Takuji ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20220141965
- Publication date May 5, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED BISMALEIMIDE RESIN, METHOD FOR PREPARING THE SAME, PREPREG...
- Publication number 20220081514
- Publication date Mar 17, 2022
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220071016
- Publication date Mar 3, 2022
- LG INNOTEK CO., LTD
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...
- Publication number 20220071025
- Publication date Mar 3, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Yune KUMAZAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOSS-DISSIPATION FLEXIBLE COPPER CLAD LAMINATE, MANUFACTURING METHO...
- Publication number 20220056213
- Publication date Feb 24, 2022
- NATIONAL CHUNGHSING UNIVERSITY
- Ching-Hsuan LIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, DRY FILM, RESIN-CLAD COPPER FOIL, CURED...
- Publication number 20220049048
- Publication date Feb 17, 2022
- Taiyo Ink MFG. Co., Ltd.
- Kazuhisa YAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20220039254
- Publication date Feb 3, 2022
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20220033617
- Publication date Feb 3, 2022
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER-CLAD LAMINATE AND METHOD OF FORMING THE SAME
- Publication number 20220039256
- Publication date Feb 3, 2022
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND BACKLIGHT
- Publication number 20210410294
- Publication date Dec 30, 2021
- Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd.
- Zu-Ai Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL AND COPPER-CLAD LAMINATE
- Publication number 20210371997
- Publication date Dec 2, 2021
- Circuit Foil Luxembourg, Sarl
- Thomas DEVAHIF
- B32 - LAYERED PRODUCTS
Information Patent Application
HIGHLY HEAT-DISSIPATING FLEXIBLE PRINTED CIRCUIT BOARD (GFPCB), MAN...
- Publication number 20210321509
- Publication date Oct 14, 2021
- SOLUETA
- Seong Hwan Jung
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARDS FOR POWER SUPPLIES
- Publication number 20210274636
- Publication date Sep 2, 2021
- ABB POWER ELECTRONICS INC.
- Robert Joseph Roessler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CATALYZED METAL FOIL AND USES THEREOF
- Publication number 20210259115
- Publication date Aug 19, 2021
- Averatek Corporation
- Shinichi IKETANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210212198
- Publication date Jul 8, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Hiroki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT B...
- Publication number 20210212204
- Publication date Jul 8, 2021
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro TSURUTA
- B32 - LAYERED PRODUCTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210185816
- Publication date Jun 17, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...
- Publication number 20200376810
- Publication date Dec 3, 2020
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- B32 - LAYERED PRODUCTS

Resin coated copper [RCC]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, resin sheet, multilayer printed wiring board, an...

Circuit board and method of manufacturing the same

Highly heat-dissipating flexible printed circuit board (GFPCB), man...

Curable resin composition, dry film, resin-clad copper foil, cured...

Catalyzed metal foil and uses thereof

Dielectric substrate and method of forming the same

Surface-treated copper foil, and copper-clad laminate and circuit b...

Long laminate, method for its production and printed wiring board

Circuit board and method for manufacturing the same

Dielectric substrate and method of forming the same

Electromagnetic wave shield film, printed wiring board using same,...

Resin composition, metal foil provided with resin layer, metal clad...

Component carrier and method of manufacturing the same

Electromagnetic wave shield film, printed wiring board using same,...

Circuit board, method for manufacturing the same, and backlight

Printed circuit boards for power supplies

Resin-clad copper foil, copper-clad laminated plate, and printed wi...

Printed circuit board

Electronic component embedded by laminate sheet

Copper clad laminates and method for manufacturing a printed circui...

Surface treated copper foil, surface treated copper foil with resin...

Resin film, substrate for printed wiring board, and printed wiring...

Copper foil with carrier, coreless support with wiring layer, and m...

Printed circuit boards for power supplies

Electromagnetic wave shield film, printed wiring board using same,...

Printed wiring board and camera module

Wiring board

Copper foil with carrier, coreless support with wiring layer, and m...

Copper heat dissipation material, carrier-attached copper foil, con...

Method of producing a connection support, connection support and op...

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD

LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD

DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

CIRCUIT BOARD

DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

Component Carrier With a Magnetic Element and a Manufacturing Method

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...

FLUORINE-CONTAINING POLYMER FOR METAL-CLAD LAMINATED SHEET, COMPOSI...

MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE

MODIFIED BISMALEIMIDE RESIN, METHOD FOR PREPARING THE SAME, PREPREG...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AN...

LOSS-DISSIPATION FLEXIBLE COPPER CLAD LAMINATE, MANUFACTURING METHO...

CURABLE RESIN COMPOSITION, DRY FILM, RESIN-CLAD COPPER FOIL, CURED...

DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

COPPER-CLAD LAMINATE AND METHOD OF FORMING THE SAME

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND BACKLIGHT

SURFACE TREATED COPPER FOIL AND COPPER-CLAD LAMINATE

HIGHLY HEAT-DISSIPATING FLEXIBLE PRINTED CIRCUIT BOARD (GFPCB), MAN...

PRINTED CIRCUIT BOARDS FOR POWER SUPPLIES

CATALYZED METAL FOIL AND USES THEREOF

PRINTED CIRCUIT BOARD

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT B...

Component Carrier and Method of Manufacturing the Same

RESIN FILM, SUBSTRATE FOR PRINTED WIRING BOARD, AND PRINTED WIRING...