Resistance and impedance

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CPC
H05K2201/0776

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0776Resistance and impedance

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for medical device and medical device
- Patent number 11,751,325
- Issue date Sep 5, 2023
- Sony Olympus Medical Solutions Inc.
- Kiyotaka Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and circuit for controlling quality of metallization of a mu...
- Patent number 11,678,434
- Issue date Jun 13, 2023
- Continental Automotive France
- Daniel Guerra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive composition and wiring board using the same
- Patent number 11,479,686
- Issue date Oct 25, 2022
- Yazaki Corporation
- Rie Katsumata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic apparatus having package base substrate
- Patent number 11,064,603
- Issue date Jul 13, 2021
- Samsung Electronics Co., Ltd.
- Ji-woon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for circuit interconnects
- Patent number 10,999,923
- Issue date May 4, 2021
- Juniper Networks, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Population of metal oxide nanosheets, preparation method thereof, a...
- Patent number 10,993,320
- Issue date Apr 27, 2021
- Samsung Electronics Co., Ltd.
- Doh Won Jung
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Spread weave induced skew minimization
- Patent number 10,973,115
- Issue date Apr 6, 2021
- Ciena Corporation
- Robert Bisson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via impedance matching
- Patent number 10,952,313
- Issue date Mar 16, 2021
- Arista Networks, Inc.
- Theophilus Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for medical device and medical device
- Patent number 10,749,244
- Issue date Aug 18, 2020
- Sony Olympus Medical Solutions Inc.
- Kiyotaka Kanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, solder resist film using said pho...
- Patent number 10,627,716
- Issue date Apr 21, 2020
- Arisawa Mfg. Co., Ltd.
- Takashi Gondaira
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 10,617,002
- Issue date Apr 7, 2020
- FANUC CORPORATION
- Norihiro Saido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for via connection with reduced via currents
- Patent number 10,383,298
- Issue date Aug 20, 2019
- Micron Technology, Inc.
- Atsushi Morishima
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Filter
- Patent number 10,312,564
- Issue date Jun 4, 2019
- Ambit Microsystems (Shanghai) Ltd.
- Ming-Hsien Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for via connection with reduced via currents
- Patent number 10,165,683
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Atsushi Morishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact pad for electrically contacting a connector
- Patent number 10,128,597
- Issue date Nov 13, 2018
- TE Connectivity Corporation
- Graham Harry Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual printed circuit board assembly, printed circuit board and modu...
- Patent number 10,123,417
- Issue date Nov 6, 2018
- Wistron NeWeb Corp.
- Cheng-Hsien Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Population of metal oxide nanosheets, preparation method thereof, a...
- Patent number 10,070,522
- Issue date Sep 4, 2018
- Samsung Electronics Co., Ltd.
- Doh Won Jung
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Systems and methods for controlled effective series resistance comp...
- Patent number 9,992,871
- Issue date Jun 5, 2018
- Intel Corporation
- William J. Lambert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for via connection with reduced via currents
- Patent number 9,888,574
- Issue date Feb 6, 2018
- Micron Technology, Inc.
- Atsushi Morishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive transparent substrate manufacturing method, and conducti...
- Patent number 9,788,418
- Issue date Oct 10, 2017
- INKTEC CO., LTD.
- Kwang-Choon Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer wiring board with enclosed Ur-variant dual conductive layer
- Patent number 9,622,344
- Issue date Apr 11, 2017
- Kabushiki Kaisha Nihon Micronics
- Tatsuo Inoue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing wiring substrate
- Patent number 9,572,252
- Issue date Feb 14, 2017
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME
- Publication number 20250106999
- Publication date Mar 27, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Xuejun Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250062061
- Publication date Feb 20, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE INCLUDING A REFERENCE VOLTAGE LAYER HAVING AN IMPEDANCE C...
- Publication number 20240196515
- Publication date Jun 13, 2024
- SK HYNIX INC.
- Jae Hoon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND ELECTRONIC DEVICE
- Publication number 20240179831
- Publication date May 30, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD
- Publication number 20240074054
- Publication date Feb 29, 2024
- The Phoenix Company of Chicago, Inc.
- Salvatore J. Gullotta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20230345622
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CIRCUIT FOR CONTROLLING QUALITY OF METALLIZATION OF A MU...
- Publication number 20220240377
- Publication date Jul 28, 2022
- Daniel Guerra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR CIRCUIT INTERCONNECTS
- Publication number 20210227685
- Publication date Jul 22, 2021
- Juniper Networks, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board
- Publication number 20210084751
- Publication date Mar 18, 2021
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yuusuke HARUNA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE COMPOSITION AND WIRING BOARD USING THE SAME
- Publication number 20200190350
- Publication date Jun 18, 2020
- YAZAKI CORPORATION
- Rie KATSUMATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST FILM USING SAID PHO...
- Publication number 20200026186
- Publication date Jan 23, 2020
- ARISAWA MFG. CO., LTD.
- Takashi GONDAIRA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Spread weave induced skew minimization
- Publication number 20200029424
- Publication date Jan 23, 2020
- CIENA CORPORATION
- Robert Bisson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Wiring Board
- Publication number 20190373716
- Publication date Dec 5, 2019
- Tatsuta Electric Wire & Cable Co., Ltd.
- Yuusuke HARUNA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS HAVING PACKAGE BASE SUBSTRATE
- Publication number 20190357351
- Publication date Nov 21, 2019
- Samsung Electronics Co., Ltd.
- Ji-woon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CIRCUIT INTERCONNECTS
- Publication number 20190335579
- Publication date Oct 31, 2019
- Juniper Networks, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20190274215
- Publication date Sep 5, 2019
- FANUC CORPORATION
- Norihiro SAIDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POPULATION OF METAL OXIDE NANOSHEETS, PREPARATION METHOD THEREOF, A...
- Publication number 20180359854
- Publication date Dec 13, 2018
- Samsung Electronics Co., Ltd.
- Doh Won JUNG
- B82 - NANO-TECHNOLOGY
Information Patent Application
FILTER
- Publication number 20180302056
- Publication date Oct 18, 2018
- AMBIT MICROSYSTEMS (SHANGHAI) LTD.
- MING-HSIEN HSU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
APPARATUS AND METHODS FOR VIA CONNECTION WITH REDUCED VIA CURRENTS
- Publication number 20180192517
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Atsushi Morishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONTACT PAD FOR ELECTRICALLY CONTACTING A CONNECTOR
- Publication number 20170358881
- Publication date Dec 14, 2017
- TE Connectivity Corporation
- Graham Harry Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL PRINTED CIRCUIT BOARD ASSEMBLY, PRINTED CIRCUIT BOARD AND MODU...
- Publication number 20170245366
- Publication date Aug 24, 2017
- WISTRON NEWEB CORP.
- Cheng-Hsien Hsu
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...
- Publication number 20170135211
- Publication date May 11, 2017
- Intel Corporation
- William J. Lambert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POPULATION OF METAL OXIDE NANOSHEETS, PREPARATION METHOD THEREOF, A...
- Publication number 20170135208
- Publication date May 11, 2017
- Samsung Electronics Co., Ltd.
- Doh Won JUNG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive Transparent Substrate Manufacturing Method, and Conducti...
- Publication number 20160192477
- Publication date Jun 30, 2016
- INKTEC CO., LTD.
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20150313005
- Publication date Oct 29, 2015
- Hitachi, Ltd.
- Masashi TAKABATAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB FOR REDUCING ELECTROMAGNETIC INTERFERENCE OF ELECTRIC VEHICLE
- Publication number 20150263694
- Publication date Sep 17, 2015
- LSIS CO., LTD
- Jong In SUN
- B60 - VEHICLES IN GENERAL

Resistance and impedance

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure for circuit interconnects

Package component and forming method thereof

Substrate for medical device and medical device

Method and circuit for controlling quality of metallization of a mu...

Conductive composition and wiring board using the same

Electronic apparatus having package base substrate

Structure for circuit interconnects

Population of metal oxide nanosheets, preparation method thereof, a...

Spread weave induced skew minimization

Via impedance matching

Substrate for medical device and medical device

Photosensitive resin composition, solder resist film using said pho...

Circuit board and manufacturing method thereof

Apparatus and methods for via connection with reduced via currents

Filter

Apparatus and methods for via connection with reduced via currents

Electrical contact pad for electrically contacting a connector

Dual printed circuit board assembly, printed circuit board and modu...

Population of metal oxide nanosheets, preparation method thereof, a...

Systems and methods for controlled effective series resistance comp...

Apparatus and methods for via connection with reduced via currents

Conductive transparent substrate manufacturing method, and conducti...

Multilayer wiring board with enclosed Ur-variant dual conductive layer

Wiring substrate and method of manufacturing wiring substrate

Patents Applicationslast 30 patents

WIRING BOARD AND SEMICONDUCTOR DEVICE

ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME

COIL DEVICE AND PRINTED WIRING BOARD

CERAMIC WIRING MEMBER

CERAMIC WIRING MEMBER

PACKAGE COMPONENT

SUBSTRATE INCLUDING A REFERENCE VOLTAGE LAYER HAVING AN IMPEDANCE C...

ELECTRONIC MODULE AND ELECTRONIC DEVICE

IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD

PACKAGE COMPONENT AND FORMING METHOD THEREOF

METHOD AND CIRCUIT FOR CONTROLLING QUALITY OF METALLIZATION OF A MU...

STRUCTURE FOR CIRCUIT INTERCONNECTS

Printed Wiring Board

CONDUCTIVE COMPOSITION AND WIRING BOARD USING THE SAME

PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST FILM USING SAID PHO...

Spread weave induced skew minimization

Printed Wiring Board

ELECTRONIC APPARATUS HAVING PACKAGE BASE SUBSTRATE

STRUCTURE FOR CIRCUIT INTERCONNECTS

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

POPULATION OF METAL OXIDE NANOSHEETS, PREPARATION METHOD THEREOF, A...

FILTER

APPARATUS AND METHODS FOR VIA CONNECTION WITH REDUCED VIA CURRENTS

ELECTRICAL CONTACT PAD FOR ELECTRICALLY CONTACTING A CONNECTOR

DUAL PRINTED CIRCUIT BOARD ASSEMBLY, PRINTED CIRCUIT BOARD AND MODU...

SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...

POPULATION OF METAL OXIDE NANOSHEETS, PREPARATION METHOD THEREOF, A...

Conductive Transparent Substrate Manufacturing Method, and Conducti...

PRINTED CIRCUIT BOARD

PCB FOR REDUCING ELECTROMAGNETIC INTERFERENCE OF ELECTRIC VEHICLE