Right-up bonding

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H01L2021/60037

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

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H01L2021/60037Right-up bonding

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Patents Grantslast 30 patents

Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,973,062
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,587,912
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pillar interconnect conversion with stack to substrate...
- Patent number 11,088,114
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20240282755
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20230197689
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20210351163
- Publication date Nov 11, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE...
- Publication number 20210134759
- Publication date May 6, 2021
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS