Rigid-flexible multilayer circuits comprising rigid and flexible layers

Industry

CPC
H05K3/4691

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4691Rigid-flexible multilayer circuits comprising rigid and flexible layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 12,150,248
- Issue date Nov 19, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate unit and substrate assembly, and camera module using same
- Patent number 11,937,382
- Issue date Mar 19, 2024
- LG Innotek Co., Ltd
- Hyun Woo Ryou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible inlay and manufacturing method thereof
- Patent number 11,895,777
- Issue date Feb 6, 2024
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-sided inductive charging coil
- Patent number 11,728,687
- Issue date Aug 15, 2023
- Microsoft Technology Licensing, LLC
- Casey Sean Callan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic assembly having circuit carrier and manufacturing method...
- Patent number 11,665,834
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flexible component carrier with stepped layer structure
- Patent number 11,589,462
- Issue date Feb 21, 2023
- AT&S(China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate unit and substrate assembly, and camera module using same
- Patent number 11,582,873
- Issue date Feb 14, 2023
- LG Innotek Co., Ltd
- Hyun Woo Ryou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vibration-damped circuit arrangement, converter, and aircraft havin...
- Patent number 11,564,310
- Issue date Jan 24, 2023
- Rolls-Royce Deutschland Ltd & Co KG
- Rene Blank
- G11 - INFORMATION STORAGE
Information Patent Grant
Rigid-flexible printed circuit board and electronic device includin...
- Patent number 11,564,311
- Issue date Jan 24, 2023
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hearing device with embedded integrated circuit chips
- Patent number 11,553,288
- Issue date Jan 10, 2023
- GN HEARING A/S
- Sinasi Özden
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,516,926
- Issue date Nov 29, 2022
- Innolux Corporation
- Pai-Chi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light source support for automotive vehicle
- Patent number 11,503,705
- Issue date Nov 15, 2022
- Valeo North America, Inc.
- Mauricio Velazquez Sanchez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing non-planar arrays with a single flex-hybri...
- Patent number 11,497,118
- Issue date Nov 8, 2022
- Raytheon Company
- Channing Paige Favreau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and connecting structure of the same
- Patent number 11,470,728
- Issue date Oct 11, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 11,439,023
- Issue date Sep 6, 2022
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF devices and methods thereof involving a vertical switched filter...
- Patent number 11,437,696
- Issue date Sep 6, 2022
- Knowles Cazenovia, Inc.
- David Bates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with embedded component carrier
- Patent number 11,410,965
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical switched filter bank
- Patent number 11,355,829
- Issue date Jun 7, 2022
- Knowles Cazenovia, Inc.
- David Bates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically robust component carrier with rigid and flexible portions
- Patent number 11,324,126
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna array and method for manufacturing thereof
- Patent number 11,309,618
- Issue date Apr 19, 2022
- Teknologian tutkimuskeskus VTT Oy
- Jussi Säily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 11,291,119
- Issue date Mar 29, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hearing device with embedded integrated circuit chips
- Patent number 11,252,519
- Issue date Feb 15, 2022
- GN HEARING A/S
- Sinasi Özden
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board
- Patent number 11,229,118
- Issue date Jan 18, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang-Hwa Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for manufacturing flexible laminated circuit boards
- Patent number 11,229,126
- Issue date Jan 18, 2022
- Duetto Integrated Systems, Inc.
- Anthony Faraci
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible and conformal electronics using rigid substrates
- Patent number 11,224,124
- Issue date Jan 11, 2022
- Brigham Young University
- Bryce Parker DeFigueiredo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of printed board
- Patent number 11,212,913
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...
- Publication number 20240365478
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Guoteng LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE JOINING STRUCTURE
- Publication number 20240314943
- Publication date Sep 19, 2024
- Mitsubishi Electric Corporation
- Hiromitsu Itamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CARRIER ARRANGEMENT
- Publication number 20240224417
- Publication date Jul 4, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFLEXIBLE VOLTAGE REFERENCE CIRCUIT CARD, AND METHOD FOR MANUFACTU...
- Publication number 20240215166
- Publication date Jun 27, 2024
- Beamex OY AB
- Hannu KETONEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME
- Publication number 20240188229
- Publication date Jun 6, 2024
- LG Innotek Co., Ltd.
- HYUN WOO RYOU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...
- Publication number 20240121885
- Publication date Apr 11, 2024
- Canon Kabushiki Kaisha
- Yu Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMI-FLEX PRINTED CIRCUIT BOARD WITH COVER-OPENING OPENING
- Publication number 20240049401
- Publication date Feb 8, 2024
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- Cheng Ming LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335466
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-SIDED INDUCTIVE CHARGING COIL
- Publication number 20230336033
- Publication date Oct 19, 2023
- Microsoft Technology Licensing, LLC
- Casey Sean CALLAN
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC ASSEMBLY HAVING CIRCUIT CARRIER
- Publication number 20230254984
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING PROCESS OF RIGID-FLEX BOARD
- Publication number 20230232546
- Publication date Jul 20, 2023
- Guangdong ZECHENG Technology Co., LTD
- CHIA-MING LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA PACKAGE AND IMAGE DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230231294
- Publication date Jul 20, 2023
- DONGWOO FINE-CHEM CO., LTD.
- Young Ju KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME
- Publication number 20230171899
- Publication date Jun 1, 2023
- LG Innotek Co., Ltd.
- HYUN WOO RYOU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230164928
- Publication date May 25, 2023
- Unimicron Technology Corp.
- Cheng-Ta Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT
- Publication number 20230156929
- Publication date May 18, 2023
- SAFRAN VENTILATION SYSTEMS
- Jacques VINCENT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20230101831
- Publication date Mar 30, 2023
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...
- Publication number 20230072115
- Publication date Mar 9, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- JONATHAN DOUGLAS HATCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SWITCHED FILTER BANK
- Publication number 20220416396
- Publication date Dec 29, 2022
- Knowles Cazenovia, Inc.
- David Bates
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE TRANSPARENT COPPER CIRCUIT, PREPARATION METHOD THEREFOR, A...
- Publication number 20220272830
- Publication date Aug 25, 2022
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Liang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING NON-PLANAR ARRAYS WITH A SINGLE FLEX-HYBRI...
- Publication number 20220264745
- Publication date Aug 18, 2022
- Raytheon Company
- Channing Paige Favreau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT SOURCE SUPPORT FOR AUTOMOTIVE VEHICLE
- Publication number 20220192003
- Publication date Jun 16, 2022
- VALEO NORTH AMERICA, INC.
- Mauricio VELAZQUEZ SANCHEZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEARING DEVICE WITH EMBEDDED INTEGRATED CIRCUIT CHIPS
- Publication number 20220141602
- Publication date May 5, 2022
- GN Hearing A/S
- Sinasi ÖZDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER ARRANGEMENT AND METHOD FOR PRODUCING A CARRIER ARRANGEMENT
- Publication number 20220095450
- Publication date Mar 24, 2022
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED BOARD
- Publication number 20220087011
- Publication date Mar 17, 2022
- MURATA MANUFACTURING CO., LTD.
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flexible Component Carrier With Stepped Layer Structure
- Publication number 20220039259
- Publication date Feb 3, 2022
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE WIRING BOARD
- Publication number 20210410280
- Publication date Dec 30, 2021
- DAI NIPPON PRINTING CO., LTD.
- Naoko OKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME
- Publication number 20210410298
- Publication date Dec 30, 2021
- LG Innotek Co., Ltd.
- HYUN WOO RYOU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Printed Circuit Board and Vehicle Having the Same
- Publication number 20210360798
- Publication date Nov 18, 2021
- Hyundai Motor Company
- SeungWoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Rigid-flexible multilayer circuits comprising rigid and flexible layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System for providing dynamic feedback for selective adhesion PCB pr...

Bent laminated printed circuit board

Laminated component carrier with a thermoplastic structure

Laminated circuit board

Substrate unit and substrate assembly, and camera module using same

Flexible inlay and manufacturing method thereof

Two-sided inductive charging coil

Electronic assembly having circuit carrier and manufacturing method...

Semi-flexible component carrier with stepped layer structure

Substrate unit and substrate assembly, and camera module using same

Vibration-damped circuit arrangement, converter, and aircraft havin...

Rigid-flexible printed circuit board and electronic device includin...

Hearing device with embedded integrated circuit chips

Method for manufacturing flexible circuit board

Light source support for automotive vehicle

Method for manufacturing non-planar arrays with a single flex-hybri...

Laminated component carrier with a thermoplastic structure

Multilayer board and connecting structure of the same

System for providing dynamic feedback for selective adhesion PCB pr...

RF devices and methods thereof involving a vertical switched filter...

Electronic device with embedded component carrier

Vertical switched filter bank

Mechanically robust component carrier with rigid and flexible portions

Antenna array and method for manufacturing thereof

Semi-flex component carrier with dielectric material surrounding an...

Hearing device with embedded integrated circuit chips

Printed circuit board

System and method for manufacturing flexible laminated circuit boards

Flexible and conformal electronics using rigid substrates

Manufacturing method of printed board

Patents Applicationslast 30 patents

CIRCUIT BOARD, DISPLAY APPARATUS, AND MANUFACTURING METHOD FOR CIRC...

SUBSTRATE JOINING STRUCTURE

METHOD FOR PRODUCING A CARRIER ARRANGEMENT

INFLEXIBLE VOLTAGE REFERENCE CIRCUIT CARD, AND METHOD FOR MANUFACTU...

SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME

WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...

SEMI-FLEX PRINTED CIRCUIT BOARD WITH COVER-OPENING OPENING

ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

TWO-SIDED INDUCTIVE CHARGING COIL

ELECTRONIC ASSEMBLY HAVING CIRCUIT CARRIER

MANUFACTURING PROCESS OF RIGID-FLEX BOARD

ANTENNA PACKAGE AND IMAGE DISPLAY DEVICE INCLUDING THE SAME

Component Carrier

SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME

FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC CIRCUIT

FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF

SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...

Laminated Component Carrier With a Thermoplastic Structure

VERTICAL SWITCHED FILTER BANK

FLEXIBLE TRANSPARENT COPPER CIRCUIT, PREPARATION METHOD THEREFOR, A...

METHOD FOR MANUFACTURING NON-PLANAR ARRAYS WITH A SINGLE FLEX-HYBRI...

LIGHT SOURCE SUPPORT FOR AUTOMOTIVE VEHICLE

HEARING DEVICE WITH EMBEDDED INTEGRATED CIRCUIT CHIPS

CARRIER ARRANGEMENT AND METHOD FOR PRODUCING A CARRIER ARRANGEMENT

MANUFACTURING METHOD OF PRINTED BOARD

Semi-Flexible Component Carrier With Stepped Layer Structure

WIRING BOARD AND METHOD FOR MANUFACTURING THE WIRING BOARD

SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME

Printed Circuit Board and Vehicle Having the Same