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CPC
H05K5/065

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K5/00Casings, cabinets or drawers for electric apparatus

Current Industry

H05K5/065sealed by encapsulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wearable device
- Patent number 12,186,094
- Issue date Jan 7, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module for a hearing device
- Patent number 12,167,207
- Issue date Dec 10, 2024
- Oticon A/S
- Troels Holm Pedersen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic encapsulation through stencil printing
- Patent number 12,156,356
- Issue date Nov 26, 2024
- Flex Ltd.
- Weifeng Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated electronic device with flexible and stretchable substrate
- Patent number 12,096,553
- Issue date Sep 17, 2024
- Carnegie Mellon University
- Gary K. Fedder
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly having retainer with liquid coupling body engag...
- Patent number 12,063,760
- Issue date Aug 13, 2024
- Eagle Technology, LLC
- Voi Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dishwasher
- Patent number 12,016,510
- Issue date Jun 25, 2024
- LG Electronics Inc.
- Sangwoo Woo
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Waterproof electronic device
- Patent number 11,997,813
- Issue date May 28, 2024
- Pegatron Corporation
- Hsin-Min Tien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Corona prevention in high power circulators
- Patent number 11,961,635
- Issue date Apr 16, 2024
- Lockheed Martin Corporation
- Kevin L. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator module
- Patent number 11,923,773
- Issue date Mar 5, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Control of electric field effects in a printed circuit board assemb...
- Patent number 11,877,413
- Issue date Jan 16, 2024
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics module for a transmission control unit, and transmissio...
- Patent number 11,832,399
- Issue date Nov 28, 2023
- ZF Friedrichshafen AG
- Josef Loibl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module for a hearing device
- Patent number 11,825,274
- Issue date Nov 21, 2023
- Oticon A/S
- Troels Holm Pedersen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit module
- Patent number 11,812,542
- Issue date Nov 7, 2023
- TDK Corporation
- Shuichi Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel-molded electronic assemblies
- Patent number 11,751,338
- Issue date Sep 5, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-component composition for producing an aqueous coating mass
- Patent number 11,746,052
- Issue date Sep 5, 2023
- Heraeus Deutschland GmbH & Co. KG
- Markus Scheibel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,744,024
- Issue date Aug 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure bulkhead structure with integrated selective electronic sw...
- Patent number 11,733,016
- Issue date Aug 22, 2023
- DynaEnergetics Europe GmbH
- Christian Eitschberger
- F42 - AMMUNITION BLASTING
Information Patent Grant
Method and tool for molding an electronic module, and molded electr...
- Patent number 11,697,230
- Issue date Jul 11, 2023
- ZF Friedrichshafen AG
- Marco Knier
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Encapsulated printed circuit board assembly
- Patent number 11,683,880
- Issue date Jun 20, 2023
- 3M Innovative Properties Company
- Gunther A. J. Stollwerck
- G01 - MEASURING TESTING
Information Patent Grant
Terminal-equipped case member and manufacturing method thereof
- Patent number 11,664,551
- Issue date May 30, 2023
- OHKITA SEISAKUSYO
- Masaya Hamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection for a catheter
- Patent number 11,617,542
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Heikki Kuisma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit module
- Patent number 11,606,888
- Issue date Mar 14, 2023
- TDK Corporation
- Shuichi Takizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable organopolysiloxane composition and a protectant or adhesive...
- Patent number 11,555,118
- Issue date Jan 17, 2023
- Dow Toray Co., Ltd.
- Toyohiko Fujisawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ceramic substrate and electronic component-embedded module
- Patent number 11,553,592
- Issue date Jan 10, 2023
- Murata Manufacturing Co., Ltd.
- Ryota Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor component, pre-assembly arrangement for a sensor component,...
- Patent number 11,536,594
- Issue date Dec 27, 2022
- Vitesco Technologies Germany GmbH
- Jürgen Rietsch
- G01 - MEASURING TESTING
Information Patent Grant
Electronic control module and method for producing an electronic co...
- Patent number 11,528,816
- Issue date Dec 13, 2022
- Robert Bosch GmbH
- Matthias Kraus
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Control of electric field effects in a printed circuit board assemb...
- Patent number 11,477,903
- Issue date Oct 18, 2022
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin card medium and manufacturing method therefor
- Patent number 11,445,627
- Issue date Sep 13, 2022
- SHOEI PRINTING CO., LTD.
- Tomohiro Nakata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic module for a hearing device
- Patent number 11,438,718
- Issue date Sep 6, 2022
- Oticon A/S
- Troels Holm Pedersen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE FOR A HEARING DEVICE
- Publication number 20250056172
- Publication date Feb 13, 2025
- OTICON A/S
- Troels Holm Pedersen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Data Pod Release System
- Publication number 20240326966
- Publication date Oct 3, 2024
- The United States of America as represented by the Secretary of the Navy
- Y. Meriah Arias-Thode
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY DEVICE AND PRODUCTION METHOD THEREOF
- Publication number 20240314958
- Publication date Sep 19, 2024
- Shimadzu Corporation
- Masafumi TSUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION
- Publication number 20240306310
- Publication date Sep 12, 2024
- Cardiac Pacemakers, Inc.
- Benjamin J. Haasl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATOR MODULE
- Publication number 20240171073
- Publication date May 23, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUSTOMIZABLE VACUUM TEST SYSTEMS AND METHODS
- Publication number 20240167908
- Publication date May 23, 2024
- Blue Origin, LLC
- Eric David Wetzel
- G01 - MEASURING TESTING
Information Patent Application
ZETTASCALE Supercomputer
- Publication number 20240164064
- Publication date May 16, 2024
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL APPARATUS HAVING ONE OR MORE SENSORS ON POWER-CONDUCTING...
- Publication number 20240130062
- Publication date Apr 18, 2024
- Dr. Ing. h.c.F. Porsche Aktiengesellschaft
- Sebastian WACHTER
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC ASSEMBLY HAVING RETAINER WITH LIQUID COUPLING BODY ENGAG...
- Publication number 20240098943
- Publication date Mar 21, 2024
- Eagle Technology, LLC
- Voi NGUYEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURGE SUPPRESSION DEVICE
- Publication number 20240072535
- Publication date Feb 29, 2024
- Proterial, Ltd.
- Tsukasa KONDO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTRONIC MODULE FOR A HEARING DEVICE
- Publication number 20240048924
- Publication date Feb 8, 2024
- OTICON A/S
- Troels Holm Pedersen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240008207
- Publication date Jan 4, 2024
- Hitachi Astemo, Ltd.
- Yusuke TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230413454
- Publication date Dec 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERPROOF ELECTRONIC DEVICE
- Publication number 20230345656
- Publication date Oct 26, 2023
- PEGATRON CORPORATION
- Hsin-Min Tien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY AND EXPANSION COMPONENT THEREOF
- Publication number 20230262896
- Publication date Aug 17, 2023
- Getac Technology Corporation
- Jui-Lin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBMERSIBLE CONTROL PANEL
- Publication number 20230240033
- Publication date Jul 27, 2023
- CUSTOM CONTROLS TECHNOLOGY INC.
- GERARDO GALLO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORONA PREVENTION IN HIGH POWER CIRCULATORS
- Publication number 20230223173
- Publication date Jul 13, 2023
- Lockheed Martin Corporation
- Kevin L. ROBINSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20230189491
- Publication date Jun 15, 2023
- TDK Corporation
- Shuichi TAKIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIRTIGHT-LEVEL SENSOR AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230175881
- Publication date Jun 8, 2023
- Alpha Networks Inc.
- TZU-CHIH LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE DEVICE
- Publication number 20230042984
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin YEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVERS FOR ELECTRONIC DEVICES WITH A HYDROPHOBIC COATING
- Publication number 20230034431
- Publication date Feb 2, 2023
- Hewlett-Packard Development Company, L.P.
- Kuan-Ting Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION DEVICE WITH IMPERMEABLE MATERIAL
- Publication number 20230030986
- Publication date Feb 2, 2023
- JTEKT EUROPE
- Clément DALL'ACQUA
- B60 - VEHICLES IN GENERAL
Information Patent Application
CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMB...
- Publication number 20230009440
- Publication date Jan 12, 2023
- Sparton DeLeon Springs, LLC
- Lendon L. Bendix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATION ASSEMBLY FOR GLASS, ENCAPSULATED GLASS AND MANUFACTUR...
- Publication number 20220408583
- Publication date Dec 22, 2022
- SAINT-GOBAIN GLASS FRANCE
- Siteng MA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC MODULE FOR A HEARING DEVICE
- Publication number 20220360920
- Publication date Nov 10, 2022
- OTICON A/S
- Troels Holm Pedersen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI-COMPONENT COMPOSITION FOR PRODUCING AN AQUEOUS COATING MASS
- Publication number 20220315491
- Publication date Oct 6, 2022
- Heraeus Deutschland GmbH & Co. KG
- Markus SCHEIBEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL-EQUIPPED CASE MEMBER AND MANUFACTURING METHOD THEREOF
- Publication number 20220278398
- Publication date Sep 1, 2022
- OHKITA SEISAKUSYO
- Masaya HAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220256722
- Publication date Aug 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Hao CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220141971
- Publication date May 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE
- Publication number 20220117084
- Publication date Apr 14, 2022
- MURATA MANUFACTURING CO., LTD.
- Ryota ASAI
- H01 - BASIC ELECTRIC ELEMENTS

sealed by encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wearable device

Electronic module for a hearing device

Electronic encapsulation through stencil printing

Integrated electronic device with flexible and stretchable substrate

Semiconductor device package and method of manufacturing the same

Electronic assembly having retainer with liquid coupling body engag...

Dishwasher

Waterproof electronic device

Corona prevention in high power circulators

Voltage regulator module

Control of electric field effects in a printed circuit board assemb...

Electronics module for a transmission control unit, and transmissio...

Electronic module for a hearing device

Circuit module

Panel-molded electronic assemblies

Multi-component composition for producing an aqueous coating mass

Semiconductor device package and method of manufacturing the same

Pressure bulkhead structure with integrated selective electronic sw...

Method and tool for molding an electronic module, and molded electr...

Encapsulated printed circuit board assembly

Terminal-equipped case member and manufacturing method thereof

Electrical interconnection for a catheter

Circuit module

Curable organopolysiloxane composition and a protectant or adhesive...

Ceramic substrate and electronic component-embedded module

Sensor component, pre-assembly arrangement for a sensor component,...

Electronic control module and method for producing an electronic co...

Control of electric field effects in a printed circuit board assemb...

Resin card medium and manufacturing method therefor

Electronic module for a hearing device

Patents Applicationslast 30 patents

ELECTRONIC MODULE FOR A HEARING DEVICE

Data Pod Release System

POWER SUPPLY DEVICE AND PRODUCTION METHOD THEREOF

IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION

VOLTAGE REGULATOR MODULE

CUSTOMIZABLE VACUUM TEST SYSTEMS AND METHODS

ZETTASCALE Supercomputer

ELECTRICAL APPARATUS HAVING ONE OR MORE SENSORS ON POWER-CONDUCTING...

ELECTRONIC ASSEMBLY HAVING RETAINER WITH LIQUID COUPLING BODY ENGAG...

SURGE SUPPRESSION DEVICE

ELECTRONIC MODULE FOR A HEARING DEVICE

ELECTRONIC CONTROL DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

WATERPROOF ELECTRONIC DEVICE

ELECTRONIC DEVICE ASSEMBLY AND EXPANSION COMPONENT THEREOF

SUBMERSIBLE CONTROL PANEL

CORONA PREVENTION IN HIGH POWER CIRCULATORS

CIRCUIT MODULE

AIRTIGHT-LEVEL SENSOR AND ELECTRONIC DEVICE INCLUDING THE SAME

WEARABLE DEVICE

COVERS FOR ELECTRONIC DEVICES WITH A HYDROPHOBIC COATING

ELECTRICAL CONNECTION DEVICE WITH IMPERMEABLE MATERIAL

CONTROL OF ELECTRIC FIELD EFFECTS IN A PRINTED CIRCUIT BOARD ASSEMB...

ENCAPSULATION ASSEMBLY FOR GLASS, ENCAPSULATED GLASS AND MANUFACTUR...

ELECTRONIC MODULE FOR A HEARING DEVICE

MULTI-COMPONENT COMPOSITION FOR PRODUCING AN AQUEOUS COATING MASS

TERMINAL-EQUIPPED CASE MEMBER AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

CERAMIC SUBSTRATE AND ELECTRONIC COMPONENT-EMBEDDED MODULE