Sealing devices

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CPC
C25D17/004

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating

Current Industry

C25D17/004Sealing devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 12,157,950
- Issue date Dec 3, 2024
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wetting method for substrate and plating apparatus
- Patent number 12,152,311
- Issue date Nov 26, 2024
- Ebara Corporation
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for an inert anode plating cell
- Patent number 12,134,831
- Issue date Nov 5, 2024
- Lam Research Corporation
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus having conductive liquid and plating method
- Patent number 12,104,266
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Jaewon Choi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holding and locking system for chemical and/or electrolyt...
- Patent number 11,965,263
- Issue date Apr 23, 2024
- SEMSYSCO GMBH
- Herbert Ötzlinger
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device manufacturing jig and method for manufacturing...
- Patent number 11,891,713
- Issue date Feb 6, 2024
- Kabushiki Kaisha Toshiba
- Takeyuki Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for plate-up detection
- Patent number 11,781,238
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Matthew Heller
- B08 - CLEANING
Information Patent Grant
Substrate holder
- Patent number 11,697,886
- Issue date Jul 11, 2023
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leak check method, leak check apparatus, plating method, and platin...
- Patent number 11,686,647
- Issue date Jun 27, 2023
- Ebara Corporation
- Kiyoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Contact structure, substrate holder, apparatus for plating, and met...
- Patent number 11,668,018
- Issue date Jun 6, 2023
- Ebara Corporation
- Matsutaro Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flow assisted dynamic seal for high-convection, continuous-rotation...
- Patent number 11,655,556
- Issue date May 23, 2023
- Lam Research Corporation
- Aaron Berke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for electrochemically processing semiconductor substrates
- Patent number 11,643,744
- Issue date May 9, 2023
- SPTS Technologies Limited
- John Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plating
- Patent number 11,598,017
- Issue date Mar 7, 2023
- Ebara Corporation
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate locking system, device and procedure for chemical and/or...
- Patent number 11,566,337
- Issue date Jan 31, 2023
- Semsysco GmbH
- Andreas Gleissner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for an inert anode plating cell
- Patent number 11,560,642
- Issue date Jan 24, 2023
- Lam Research Corporation
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plasma electrolytic oxidation apparatus and method of plasma electr...
- Patent number 11,555,253
- Issue date Jan 17, 2023
- Korea Institute of Science and Technology
- Hun-su Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Assemblies and methods for anodizing a workpiece selectively using...
- Patent number 11,535,948
- Issue date Dec 27, 2022
- Michael Fuschetti
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electro-plating and apparatus for performing the same
- Patent number 11,535,950
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yuan Kao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 11,512,408
- Issue date Nov 29, 2022
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,434,580
- Issue date Sep 6, 2022
- Ebara Corporation
- Tomonori Hirao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Leak check method, leak check apparatus, plating method, and platin...
- Patent number 11,385,125
- Issue date Jul 12, 2022
- Ebara Corporation
- Kiyoshi Suzuki
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for processing a substrate
- Patent number 11,371,155
- Issue date Jun 28, 2022
- Ebara Corporation
- Takahisa Okuzono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating apparatus
- Patent number 11,365,487
- Issue date Jun 21, 2022
- Nippon Steel Corporation
- Masanari Kimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus
- Patent number 11,339,496
- Issue date May 24, 2022
- Ebara Corporation
- Tomonori Hirao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Seal apparatus for an electroplating system
- Patent number 11,274,377
- Issue date Mar 15, 2022
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus with substrate holder
- Patent number 11,248,308
- Issue date Feb 15, 2022
- Ebara Corporation
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cleaning components and methods in a plating system
- Patent number 11,241,718
- Issue date Feb 8, 2022
- Applied Materials, Inc.
- Joseph Antony Jonathan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for processing a substrate
- Patent number 11,236,433
- Issue date Feb 1, 2022
- SPTS Technologies Limited
- Martin Ayres
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of removing liquid from seal of a substrate holder
- Patent number 11,230,789
- Issue date Jan 25, 2022
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Seal used for substrate holder
- Patent number 11,214,888
- Issue date Jan 4, 2022
- Ebara Corporation
- Matsutaro Miyamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Workpiece Holding Jig
- Publication number 20240401222
- Publication date Dec 5, 2024
- C. Uyemura & Co., Ltd.
- Kazuyoshi NISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Workpiece Holding Jig
- Publication number 20240401221
- Publication date Dec 5, 2024
- C. Uyemura & Co., Ltd.
- Kazuyoshi NISHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SEAL WITH IMPROVED SURFACE
- Publication number 20240337040
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF REDUCING OR ELIMINATING DEPOSITS IN AN ELECTROPLATING SY...
- Publication number 20240287702
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Adam Marc Mcclure
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FILM FORMING METHOD FOR METAL FILM
- Publication number 20240263336
- Publication date Aug 8, 2024
- Toyota Jidosha Kabushiki Kaisha
- Koji INAGAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND SUBSTRATE CLEANING METHOD
- Publication number 20240209538
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Kentaro YAMAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES
- Publication number 20240150923
- Publication date May 9, 2024
- MTI GmbH
- Markus HACKSTEINER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD
- Publication number 20230183881
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Jaewon CHOI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS
- Publication number 20230167572
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Shao Hua Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEAL EDGE EXCLUSION ENGINEERING TO MAINTAIN MATERIAL INTEGRITY A...
- Publication number 20230167571
- Publication date Jun 1, 2023
- LAM RESEARCH CORPORATION
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20230084072
- Publication date Mar 16, 2023
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...
- Publication number 20230076493
- Publication date Mar 9, 2023
- Novellus Systems, Inc.
- Jingbin FENG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYT...
- Publication number 20230053226
- Publication date Feb 16, 2023
- Semsysco GmbH
- Herbert ÖTZLINGER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT
- Publication number 20220396894
- Publication date Dec 15, 2022
- LAM RESEARCH CORPORATION
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAK CHECK METHOD, LEAK CHECK APPARATUS, PLATING METHOD, AND PLATIN...
- Publication number 20220307938
- Publication date Sep 29, 2022
- EBARA CORPORATION
- Kiyoshi Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANODIZING DEVICE
- Publication number 20220220625
- Publication date Jul 14, 2022
- MANDO CORPORATION
- Hyunsoo CHANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND OPERATION METHOD THEREOF
- Publication number 20220178044
- Publication date Jun 9, 2022
- PYXIS CF PTE. LTD.
- Amlan SEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION
- Publication number 20220145485
- Publication date May 12, 2022
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTACT STRUCTURE, SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND MET...
- Publication number 20220098749
- Publication date Mar 31, 2022
- EBARA CORPORATION
- Matsutaro MIYAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20210340687
- Publication date Nov 4, 2021
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ELECTROCHEMICALLY PROCESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20210317592
- Publication date Oct 14, 2021
- SPTS TECHNOLOGIES LIMITED
- JOHN MACNEIL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PLATING
- Publication number 20210246567
- Publication date Aug 12, 2021
- EBARA CORPORATION
- Shoichiro Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...
- Publication number 20210198800
- Publication date Jul 1, 2021
- EBARA CORPORATION
- Shoichiro OGATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE LOCKING SYSTEM, DEVICE AND PROCEDURE FOR CHEMICAL AND/OR...
- Publication number 20210017662
- Publication date Jan 21, 2021
- Semsysco GmbH
- Andreas Gleissner
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PLATING APPARATUS
- Publication number 20200392641
- Publication date Dec 17, 2020
- EBARA CORPORATION
- Tomonori Hirao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FACILITY AND METHOD FOR LOCALIZED SURFACE TREATMENT FOR INDUSTRIAL...
- Publication number 20200392638
- Publication date Dec 17, 2020
- COCKERILL MAINTENANCE & INGENIERIE SA
- Luc VANHEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR PLATE-UP DETECTION
- Publication number 20200370198
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Matthew Heller
- B08 - CLEANING
Information Patent Application
Apparatus and Method for Processing a Substrate
- Publication number 20200325588
- Publication date Oct 15, 2020
- SPTS TECHNOLOGIES LIMITED
- Martin Ayres
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating Apparatus
- Publication number 20200318250
- Publication date Oct 8, 2020
- NIPPON STEEL CORPORATION
- Masanari Kimoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20200277709
- Publication date Sep 3, 2020
- EBARA CORPORATION
- Tomonori Hirao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Sealing devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lipseals and contact elements for semiconductor electroplating appa...

Wetting method for substrate and plating apparatus

Apparatus for an inert anode plating cell

Plating apparatus having conductive liquid and plating method

Substrate holding and locking system for chemical and/or electrolyt...

Semiconductor device manufacturing jig and method for manufacturing...

Systems and methods for plate-up detection

Substrate holder

Leak check method, leak check apparatus, plating method, and platin...

Contact structure, substrate holder, apparatus for plating, and met...

Flow assisted dynamic seal for high-convection, continuous-rotation...

Apparatus for electrochemically processing semiconductor substrates

Method of plating

Substrate locking system, device and procedure for chemical and/or...

Apparatus for an inert anode plating cell

Plasma electrolytic oxidation apparatus and method of plasma electr...

Assemblies and methods for anodizing a workpiece selectively using...

Electro-plating and apparatus for performing the same

Lipseals and contact elements for semiconductor electroplating appa...

Plating apparatus

Leak check method, leak check apparatus, plating method, and platin...

Method and apparatus for processing a substrate

Electroplating apparatus

Plating apparatus

Seal apparatus for an electroplating system

Substrate holder and plating apparatus with substrate holder

Cleaning components and methods in a plating system

Apparatus and method for processing a substrate

Method of removing liquid from seal of a substrate holder

Seal used for substrate holder

Patents Applicationslast 30 patents

Workpiece Holding Jig

Workpiece Holding Jig

PLATING SEAL WITH IMPROVED SURFACE

METHODS OF REDUCING OR ELIMINATING DEPOSITS IN AN ELECTROPLATING SY...

FILM FORMING METHOD FOR METAL FILM

PLATING APPARATUS AND SUBSTRATE CLEANING METHOD

METHOD, HOLDER AND ADAPTER FOR TREATING MICROCHIP SUBSTRATES

PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD

WETTING METHOD FOR SUBSTRATE AND PLATING APPARATUS

LIPSEAL EDGE EXCLUSION ENGINEERING TO MAINTAIN MATERIAL INTEGRITY A...

APPARATUS FOR AN INERT ANODE PLATING CELL

LIPSEALS AND CONTACT ELEMENTS FOR SEMICONDUCTOR ELECTROPLATING APPA...

SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYT...

WAFER SHIELDING FOR PREVENTION OF LIPSEAL PLATE-OUT

LEAK CHECK METHOD, LEAK CHECK APPARATUS, PLATING METHOD, AND PLATIN...

ANODIZING DEVICE

PLATING APPARATUS AND OPERATION METHOD THEREOF

MECHANICALLY-DRIVEN OSCILLATING FLOW AGITATION

CONTACT STRUCTURE, SUBSTRATE HOLDER, APPARATUS FOR PLATING, AND MET...

APPARATUS FOR AN INERT ANODE PLATING CELL

APPARATUS FOR ELECTROCHEMICALLY PROCESSING SEMICONDUCTOR SUBSTRATES

METHOD OF PLATING

LEAK CHECKING METHOD, LEAK CHECKING APPARATUS, ELECTROPLATING METHO...

SUBSTRATE LOCKING SYSTEM, DEVICE AND PROCEDURE FOR CHEMICAL AND/OR...

PLATING APPARATUS

FACILITY AND METHOD FOR LOCALIZED SURFACE TREATMENT FOR INDUSTRIAL...

SYSTEMS AND METHODS FOR PLATE-UP DETECTION

Apparatus and Method for Processing a Substrate

Electroplating Apparatus

PLATING APPARATUS