Sealing or impregnating

Industry

CPC
H05K2203/1147

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1147Sealing or impregnating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Module, terminal assembly, and method for producing module
- Patent number 11,895,769
- Issue date Feb 6, 2024
- Murata Manufacturing Co., Ltd.
- Kazuya Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for shielding a printed circuit board from electromagnetic i...
- Patent number 11,729,899
- Issue date Aug 15, 2023
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,710,645
- Issue date Jul 25, 2023
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,375,611
- Issue date Jun 28, 2022
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and system for providing dynamic personalized recommendation...
- Patent number 11,354,372
- Issue date Jun 7, 2022
- Google LLC
- Jignashu Parikh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of mounting structure
- Patent number 11,315,804
- Issue date Apr 26, 2022
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor system, sensor arrangement, and assembly method using solder...
- Patent number 11,146,893
- Issue date Oct 12, 2021
- TE CONNECTIVITY SOLUTIONS GmbH
- Predrag Drljaca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multilayer ceramic substrate and method of manufacturing multilayer...
- Patent number 11,140,778
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for producing an electronic component
- Patent number 11,058,005
- Issue date Jul 6, 2021
- VITESCO TECHNOLOGIES GERMANY GMBH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture for shielding a printed circuit board from electromagnetic...
- Patent number 11,051,397
- Issue date Jun 29, 2021
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- G01 - MEASURING TESTING
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,952,332
- Issue date Mar 16, 2021
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic module having circuit boards and a plastic sealing ring...
- Patent number 10,721,819
- Issue date Jul 21, 2020
- Robert Bosch GmbH
- Uwe Liskow
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,390,441
- Issue date Aug 20, 2019
- Second Sight Medical Products, Inc.
- Jerry Ok
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
LED module and method of sealing
- Patent number 10,352,551
- Issue date Jul 16, 2019
- SIGNIFY HOLDING B.V.
- Robert Van Asselt
- F21 - LIGHTING
Information Patent Grant
Device and method for protecting a connector assembly
- Patent number 10,312,630
- Issue date Jun 4, 2019
- Yazaki North America, Inc.
- Alexander Advey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible electronic substrate
- Patent number 10,299,374
- Issue date May 21, 2019
- CAMBRIDGE NANOTHERM LIMITED
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Connection substrate
- Patent number 10,278,286
- Issue date Apr 30, 2019
- NGK Insulators, Ltd.
- Akiyoshi Ide
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flame retardant resins comprising phosphorus containing flame retar...
- Patent number 10,053,555
- Issue date Aug 21, 2018
- Larry D. Timberlake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical vacuum-compatible feedthrough structure and detector ass...
- Patent number 10,056,239
- Issue date Aug 21, 2018
- PARTICLE PHYSICS INSIDE PRODUCTS B.V.
- Dirk-Jan Spaanderdam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flame retardant resins comprising phosphorous containing flame reta...
- Patent number 9,994,696
- Issue date Jun 12, 2018
- LANXESS Solutions US Inc.
- Larry D. Timberlake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flame retartdant epoxy resins comprising phosphorus containing flam...
- Patent number 9,988,520
- Issue date Jun 5, 2018
- LANXESS Solutions US Inc.
- Larry D. Timberlake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate containing low-Dk-core glass fibers having low dielectric...
- Patent number 9,986,637
- Issue date May 29, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Circuit board and method for fabricating the same
- Patent number 9,974,171
- Issue date May 15, 2018
- BYD Company Limited
- Qiang Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board (PCB), PCB assembly, and washing machine incl...
- Patent number 9,961,790
- Issue date May 1, 2018
- Samsung Electronics Co., Ltd.
- Kyu Sik Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and associated methods
- Patent number 9,934,913
- Issue date Apr 3, 2018
- Nokia Technologies Oy
- Pritesh Hiralal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a biocompatible hermetic housing including hermet...
- Patent number 9,936,590
- Issue date Apr 3, 2018
- Second Sight Medical Products, Inc.
- Jerry Ok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a biocompatible hermetic housing including hermet...
- Patent number 9,717,150
- Issue date Jul 25, 2017
- Second Sight Medical Products, Inc.
- Jerry Ok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-metallic coating and method of its production
- Patent number 9,677,187
- Issue date Jun 13, 2017
- Cambridge Nanolitic Limited
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electronic package mounting
- Patent number 9,622,356
- Issue date Apr 11, 2017
- Lockheed Martin Corporation
- Tom Rovere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated metal substrate
- Patent number 9,551,082
- Issue date Jan 24, 2017
- CAMBRIDGE NANOTHERM LIMITED
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Device
- Publication number 20240244754
- Publication date Jul 18, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Yoshimichi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...
- Publication number 20240090122
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Cesar Verdugo Muñoz
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE COMPRISING SEALING MEMBER
- Publication number 20230413427
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Seongki JEONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230013032
- Publication date Jan 19, 2023
- Murata Manufacturing Co., Ltd.
- Minoru HATASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING DEVICE AND ETCHING METHOD USING THE SAME
- Publication number 20220223436
- Publication date Jul 14, 2022
- SAMSUNG DISPLAY CO., LTD.
- WONJE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE, TERMINAL ASSEMBLY, AND METHOD FOR PRODUCING MODULE
- Publication number 20220007499
- Publication date Jan 6, 2022
- MURATA MANUFACTURING CO., LTD.
- Kazuya OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-SEALED IN-VEHICLE ELECTRONIC CONTROL DEVICE
- Publication number 20210195758
- Publication date Jun 24, 2021
- Hitachi Automotive Systems, Ltd.
- Kazuhiro SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...
- Publication number 20210120666
- Publication date Apr 22, 2021
- SKYWORKS SOLUTIONS, INC.
- Cesar Verdugo Muñoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT UNIT, ELECTRICAL JUNCTION BOX, AND PRODUCTION METHOD OF CIR...
- Publication number 20210092828
- Publication date Mar 25, 2021
- SUMITOMO WIRING SYSTEMS, LTD.
- Yoshikazu Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR
- Publication number 20210084775
- Publication date Mar 18, 2021
- Nagase Chemtex Corporation
- Eiichi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20200396834
- Publication date Dec 17, 2020
- MURATA MANUFACTURING CO., LTD.
- Issei Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXTURE FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC...
- Publication number 20200329554
- Publication date Oct 15, 2020
- SKYWORKS SOLUTIONS, INC.
- Cesar Verdugo Muñoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
- Publication number 20200100364
- Publication date Mar 26, 2020
- Vitesco Technologies Germany GmbH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20190394874
- Publication date Dec 26, 2019
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor System, Sensor Arrangement, And Assembly Method Using Solder...
- Publication number 20190090065
- Publication date Mar 21, 2019
- MEAS Switzerland S.a.r.l.
- Predrag Drljaca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR A PACKAGE SECURING SYSTEM
- Publication number 20170181263
- Publication date Jun 22, 2017
- Intel Corporation
- Emad Al-Momani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLAME RETARDANT RESINS COMPRISING PHOSPHORUS CONTAINING FLAME RETAR...
- Publication number 20170073503
- Publication date Mar 16, 2017
- Chemtura Corporation
- Larry D. Timberlake
- B32 - LAYERED PRODUCTS
Information Patent Application
SMART CONNECTOR HOUSING
- Publication number 20160316584
- Publication date Oct 27, 2016
- IDEAL Industries, Inc.
- Timothy B. Tunnel
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METAL SUBSTRATE WITH INSULATED VIAS
- Publication number 20160286644
- Publication date Sep 29, 2016
- Cambridge Nanotherm Limited
- Pavel SHASHKOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC MODULE, MANUFACTURING METHOD THERE...
- Publication number 20160135301
- Publication date May 12, 2016
- Canon Kabushiki Kaisha
- Takashi Miyake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION...
- Publication number 20160073503
- Publication date Mar 10, 2016
- AliphCom
- Chris Singleton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIRE RESISTANT ELECTRICAL PANEL
- Publication number 20150342022
- Publication date Nov 26, 2015
- Rolls-Royce plc
- Michael Christopher WILLMOT
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Application
ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE...
- Publication number 20140362590
- Publication date Dec 11, 2014
- OSRAM GMBH
- Peng Chen
- F21 - LIGHTING
Information Patent Application
INSULATED METAL SUBSTRATE
- Publication number 20140293554
- Publication date Oct 2, 2014
- CAMBRIDGE NANOTHERM LIMITED
- Pavel Shashkov
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic Package Mounting
- Publication number 20140268605
- Publication date Sep 18, 2014
- Tom Rovere
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20140204541
- Publication date Jul 24, 2014
- SEIKO INSTRUMENTS INC.
- Atsushi KOZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20140174794
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok KANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Making a Biocompatible Hermetic Housing Including Hermet...
- Publication number 20140076844
- Publication date Mar 20, 2014
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Application
Printed Circuit Solder Connections
- Publication number 20140048310
- Publication date Feb 20, 2014
- Apple Inc.
- Anthony S. Montevirgen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sealing or impregnating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module, terminal assembly, and method for producing module

Method for shielding a printed circuit board from electromagnetic i...

Manufacturing method of mounting structure, and sheet therefor

Multilayer substrate

Method and system for providing dynamic personalized recommendation...

Manufacturing method of mounting structure

Sensor system, sensor arrangement, and assembly method using solder...

Multilayer ceramic substrate and method of manufacturing multilayer...

Electronic component and method for producing an electronic component

Fixture for shielding a printed circuit board from electromagnetic...

Method for providing hermetic electrical feedthrough

Electronic module having circuit boards and a plastic sealing ring...

Method for providing hermetic electrical feedthrough

LED module and method of sealing

Device and method for protecting a connector assembly

Flexible electronic substrate

Connection substrate

Flame retardant resins comprising phosphorus containing flame retar...

Electrical vacuum-compatible feedthrough structure and detector ass...

Flame retardant resins comprising phosphorous containing flame reta...

Flame retartdant epoxy resins comprising phosphorus containing flam...

Substrate containing low-Dk-core glass fibers having low dielectric...

Circuit board and method for fabricating the same

Printed circuit board (PCB), PCB assembly, and washing machine incl...

Apparatus and associated methods

Method for making a biocompatible hermetic housing including hermet...

Method for making a biocompatible hermetic housing including hermet...

Non-metallic coating and method of its production

Electronic package mounting

Insulated metal substrate

Patents Applicationslast 30 patents

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

Circuit Device

METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...

ELECTRONIC DEVICE COMPRISING SEALING MEMBER

MODULE AND METHOD FOR MANUFACTURING SAME

ETCHING DEVICE AND ETCHING METHOD USING THE SAME

MODULE, TERMINAL ASSEMBLY, AND METHOD FOR PRODUCING MODULE

RESIN-SEALED IN-VEHICLE ELECTRONIC CONTROL DEVICE

METHOD FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC I...

CIRCUIT UNIT, ELECTRICAL JUNCTION BOX, AND PRODUCTION METHOD OF CIR...

MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR

MULTILAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER...

FIXTURE FOR SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC...

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

MULTILAYER SUBSTRATE

Sensor System, Sensor Arrangement, And Assembly Method Using Solder...

SYSTEMS, METHODS AND DEVICES FOR A PACKAGE SECURING SYSTEM

FLAME RETARDANT RESINS COMPRISING PHOSPHORUS CONTAINING FLAME RETAR...

SMART CONNECTOR HOUSING

METAL SUBSTRATE WITH INSULATED VIAS

ELECTRONIC COMPONENT, ELECTRONIC MODULE, MANUFACTURING METHOD THERE...

STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION...

FIRE RESISTANT ELECTRICAL PANEL

ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE...

INSULATED METAL SUBSTRATE

Electronic Package Mounting

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF

Method for Making a Biocompatible Hermetic Housing Including Hermet...

Printed Circuit Solder Connections