Second PCB mounted on first PCB by inserting in window or holes of the first PCB

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CPC
H05K2201/048

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/048Second PCB mounted on first PCB by inserting in window or holes of the first PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device including thermosetting bonding sheet
- Patent number 12,144,115
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and information processing device
- Patent number 12,003,047
- Issue date Jun 4, 2024
- Hitachi, Ltd.
- Norio Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 12,002,793
- Issue date Jun 4, 2024
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nose cone comprising electronic circuit boards arranged radially
- Patent number 11,493,313
- Issue date Nov 8, 2022
- BAE Systems plc
- Gary Roy Moore
- F42 - AMMUNITION BLASTING
Information Patent Grant
Printed circuit board
- Patent number 11,445,609
- Issue date Sep 13, 2022
- Mitsubishi Electric Corporation
- Yoshiko Fujima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply module used in a smart terminal and power supply modul...
- Patent number 11,419,214
- Issue date Aug 16, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic foil
- Patent number 11,388,815
- Issue date Jul 12, 2022
- Teknologian tutkimuskeskus VTT Oy
- Vesa Pentikäinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device in which maximum number of mountable printed circ...
- Patent number 11,369,030
- Issue date Jun 21, 2022
- FANUC CORPORATION
- Yoshinari Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly
- Patent number 11,277,914
- Issue date Mar 15, 2022
- Mitsubishi Electric Corporation
- Shusaku Nakase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket assembly, light emitter module, and lighting system
- Patent number 11,129,276
- Issue date Sep 21, 2021
- TE Connectivity Nederland B.V.
- Jeroen Iedema
- F21 - LIGHTING
Information Patent Grant
Printed wiring board
- Patent number 11,122,687
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Kohei Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrating system in package (SiP) with input/output (IO) board fo...
- Patent number 11,114,421
- Issue date Sep 7, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expansion card interface for high-frequency signals
- Patent number 10,986,743
- Issue date Apr 20, 2021
- Quanta Computer Inc.
- Cheng-Hsien Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power distribution assembly
- Patent number 10,912,196
- Issue date Feb 2, 2021
- GE Aviation Systems Limited
- Alexander James Rainbow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a partially uncured component carrier body for manufacturing...
- Patent number 10,905,016
- Issue date Jan 26, 2021
- AT & Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board composite and method for producing same
- Patent number 10,893,615
- Issue date Jan 12, 2021
- CPT Zwei GmbH
- Juergen Rietsch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply module used in a smart terminal and power supply modul...
- Patent number 10,856,417
- Issue date Dec 1, 2020
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Interconnection system with hybrid transmission
- Patent number 10,795,102
- Issue date Oct 6, 2020
- FUDING PRECISION COMPONENTS (SHENZHEN) CO., LTD.
- Shih-Wei Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting assembly for an electrically-powered device
- Patent number 10,797,455
- Issue date Oct 6, 2020
- Amazon Technologies, Inc.
- James Siminoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Galvanic isolation for isolation transformer
- Patent number 10,743,406
- Issue date Aug 11, 2020
- ABB Power Grids Switzerland AG
- Andrija Djurdjic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 10,672,713
- Issue date Jun 2, 2020
- Intel Corporation
- Mihir K. Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer structure and related method of manufacture for electronics
- Patent number 10,667,401
- Issue date May 26, 2020
- TACTOTEK OY
- Mikko Heikkinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,616,992
- Issue date Apr 7, 2020
- Unimicron Technology Corp.
- Yin-Ju Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate structure for LED lighting
- Patent number 10,520,140
- Issue date Dec 31, 2019
- MERLOT LABORATORIES INC.
- Young-Hun Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card assemblies for a communication system
- Patent number 10,522,925
- Issue date Dec 31, 2019
- TE Connectivity Corporation
- Matthew Jeffrey Sypolt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card assemblies for a communication system
- Patent number 10,461,470
- Issue date Oct 29, 2019
- TE Connectivity Corporation
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit card assemblies for a communication system
- Patent number 10,411,378
- Issue date Sep 10, 2019
- TE Connectivity Corporation
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connector with mounting surface
- Patent number 10,404,015
- Issue date Sep 3, 2019
- Tyco Electronics Componentes Electromecanicos Lda.
- Herlander M. Francisco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating system in package (SIP) with input/output (IO) board fo...
- Patent number 10,388,636
- Issue date Aug 20, 2019
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...
- Publication number 20240397624
- Publication date Nov 28, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE
- Publication number 20240365470
- Publication date Oct 31, 2024
- CTCELLS, INC.
- Seung Hoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD DEVICE AND METHOD FOR COMPACT ARRANGEMENT OF ELECTRONIC ASSEM...
- Publication number 20240237212
- Publication date Jul 11, 2024
- Vega Grieshaber KG
- Thomas ILG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIELD DEVICE AND METHOD FOR COMPACT ARRANGEMENT OF ELECTRONIC ASSEM...
- Publication number 20240138067
- Publication date Apr 25, 2024
- Vega Grieshaber KG
- Thomas ILG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY ASSEMBLY FOR ELECTRONIC VAPORIZATION DEVICE AND ELECTRONIC...
- Publication number 20230371613
- Publication date Nov 23, 2023
- Hainan Moore Brothers Technology Co., Ltd.
- Deke XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET
- Publication number 20230119170
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL
- Publication number 20220295634
- Publication date Sep 15, 2022
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Yuanyuan CAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Information Processing Device
- Publication number 20220013937
- Publication date Jan 13, 2022
- Hitachi, Ltd
- Norio CHUJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20210366883
- Publication date Nov 25, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210267060
- Publication date Aug 26, 2021
- Mitsubishi Electric Corporation
- Yoshiko FUJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20210195744
- Publication date Jun 24, 2021
- Mitsubishi Electric Corporation
- Kohei SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANSION CARD INTERFACE FOR HIGH-FREQUENCY SIGNALS
- Publication number 20200275566
- Publication date Aug 27, 2020
- QUANTA COMPUTER INC.
- Cheng-Hsien LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20200260583
- Publication date Aug 13, 2020
- Mitsubishi Electric Corporation
- Shusaku NAKASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC FOIL
- Publication number 20200260567
- Publication date Aug 13, 2020
- Teknologian Tutkimuskeskus VTT Oy
- Vesa PENTIKÄINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200253075
- Publication date Aug 6, 2020
- FANUC CORPORATION
- Yoshinari HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Composite And Method For Producing Same
- Publication number 20200077525
- Publication date Mar 5, 2020
- CPT ZWEI GMBH
- JUERGEN RIETSCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20190378828
- Publication date Dec 12, 2019
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARD ASSEMBLIES FOR A COMMUNICATION SYSTEM
- Publication number 20190252826
- Publication date Aug 15, 2019
- TE Connectivity Corporation
- John Joseph Consoli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTION SYSTEM WITH HYBRID TRANSMISSION
- Publication number 20190235188
- Publication date Aug 1, 2019
- FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.
- SHIH-WEI HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION ASSEMBLY
- Publication number 20190215961
- Publication date Jul 11, 2019
- Alexander James Rainbow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARD ASSEMBLIES FOR A COMMUNICATION SYSTEM
- Publication number 20190103691
- Publication date Apr 4, 2019
- TE Connectivity Corporation
- Matthew Jeffrey Sypolt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR FOR A CIRCUIT CARD ASSEMBLY OF A COMMUNICATION...
- Publication number 20190103692
- Publication date Apr 4, 2019
- TE Connectivity Corporation
- John Joseph Consoli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE CONNECTOR BLOCK ASSEMBLIES FOR BASE STATION ANTENNAS
- Publication number 20190044258
- Publication date Feb 7, 2019
- CommScope Technologies LLC
- Paul D. Everest
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Solder Joints
- Publication number 20190006777
- Publication date Jan 3, 2019
- Lutron Electronics Co., Inc.
- Matthew Knauss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS
- Publication number 20180359860
- Publication date Dec 13, 2018
- TactoTek Oy
- Mikko HEIKKINEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20180331081
- Publication date Nov 15, 2018
- Intel Corporation
- Eng Huat Goh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING ASSEMBLY FOR AN ELECTRICALLY-POWERED DEVICE
- Publication number 20180301859
- Publication date Oct 18, 2018
- Ring Inc.
- James Siminoff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180116056
- Publication date Apr 26, 2018
- Unimicron Technology Corp.
- Yin-Ju CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20180054893
- Publication date Feb 22, 2018
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Yi-Hsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Second PCB mounted on first PCB by inserting in window or holes of the first PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device including thermosetting bonding sheet

High density organic bridge device and method

Wiring substrate and information processing device

Integrating system in package (SiP) with input/output (IO) board fo...

Nose cone comprising electronic circuit boards arranged radially

Printed circuit board

Power supply module used in a smart terminal and power supply modul...

Electronic foil

Electronic device in which maximum number of mountable printed circ...

Printed circuit board assembly

Socket assembly, light emitter module, and lighting system

Printed wiring board

Integrating system in package (SiP) with input/output (IO) board fo...

Expansion card interface for high-frequency signals

Power distribution assembly

Using a partially uncured component carrier body for manufacturing...

Printed circuit board composite and method for producing same

Power supply module used in a smart terminal and power supply modul...

Interconnection system with hybrid transmission

Mounting assembly for an electrically-powered device

Galvanic isolation for isolation transformer

High density organic bridge device and method

Multilayer structure and related method of manufacture for electronics

Circuit board and method for manufacturing the same

Substrate structure for LED lighting

Circuit card assemblies for a communication system

Circuit card assemblies for a communication system

Circuit card assemblies for a communication system

Electric connector with mounting surface

Integrating system in package (SIP) with input/output (IO) board fo...

Patents Applicationslast 30 patents

ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNE...

TARGET MATERIAL SEPARATION CONTROL DEVICE USING LASER DIODE

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

FIELD DEVICE AND METHOD FOR COMPACT ARRANGEMENT OF ELECTRONIC ASSEM...

FIELD DEVICE AND METHOD FOR COMPACT ARRANGEMENT OF ELECTRONIC ASSEM...

BATTERY ASSEMBLY FOR ELECTRONIC VAPORIZATION DEVICE AND ELECTRONIC...

ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL

Wiring Substrate and Information Processing Device

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

EXPANSION CARD INTERFACE FOR HIGH-FREQUENCY SIGNALS

PRINTED CIRCUIT BOARD ASSEMBLY

ELECTRONIC FOIL

ELECTRONIC DEVICE

Printed Circuit Board Composite And Method For Producing Same

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

CIRCUIT CARD ASSEMBLIES FOR A COMMUNICATION SYSTEM

INTERCONNECTION SYSTEM WITH HYBRID TRANSMISSION

POWER DISTRIBUTION ASSEMBLY

CIRCUIT CARD ASSEMBLIES FOR A COMMUNICATION SYSTEM

ELECTRICAL CONNECTOR FOR A CIRCUIT CARD ASSEMBLY OF A COMMUNICATION...

CABLE CONNECTOR BLOCK ASSEMBLIES FOR BASE STATION ANTENNAS

Printed Circuit Board Solder Joints

MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

MOUNTING ASSEMBLY FOR AN ELECTRICALLY-POWERED DEVICE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD STRUCTURE