Secondary treatment of printed circuits

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CPC
H05K3/22

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/22Secondary treatment of printed circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Build-up film with low dielectric loss, preparation method therefor...
- Patent number 12,098,230
- Issue date Sep 24, 2024
- Wuhan Choice Technology Co, Ltd
- De Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered device for pressure treatment and method
- Patent number 12,089,344
- Issue date Sep 10, 2024
- Canatu Oy
- Ilkka Varjos
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Buried lines and related fabrication techniques
- Patent number 12,087,758
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for assigning a material value score to a wast...
- Patent number 12,030,087
- Issue date Jul 9, 2024
- Fraunhofer-Geselleshaft zur Foerderung der angewandten Forschung e.V.
- Markus Firsching
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Controlled wetting and spreading of metals on substrates using poro...
- Patent number 12,022,610
- Issue date Jun 25, 2024
- Board of Trustees of Michigan State University
- Jason Dale Nicholas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Short or near short etch rework
- Patent number 12,004,307
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Colin Edward Masterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for coating a substrate
- Patent number 12,004,303
- Issue date Jun 4, 2024
- Nordson Corporation
- Michel Van De Vijver
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Automated pressure control system and method for a cleaner
- Patent number 11,975,343
- Issue date May 7, 2024
- Illinois Tool Works Inc.
- Eric Wayne Becker
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 11,974,403
- Issue date Apr 30, 2024
- Innolux Corporation
- Yu-Chia Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Panel device and manufacturing method of panel device
- Patent number 11,963,300
- Issue date Apr 16, 2024
- Au Optronics Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuits using thick metals and machined bu...
- Patent number 11,950,373
- Issue date Apr 2, 2024
- Lockheed Martin Corporation
- Marc T. Angelucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly electrically conductive silver ink composition and wiring ob...
- Patent number 11,939,482
- Issue date Mar 26, 2024
- DIC Corporation
- Saori Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fold flex circuit for LNOP
- Patent number 11,903,140
- Issue date Feb 13, 2024
- Masimo Corporation
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, apparatus and system for processing a composite waste source
- Patent number 11,884,992
- Issue date Jan 30, 2024
- Newsouth Innovations Pty Limited
- Veena Sahajwalla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Laned belt for cleaner
- Patent number 11,872,600
- Issue date Jan 16, 2024
- Illinois Tool Works Inc.
- John Neiderman
- B08 - CLEANING
Information Patent Grant
Substrate, maintenance method and display device
- Patent number 11,864,326
- Issue date Jan 2, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hongda Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrates comprising a network comprising core shell liquid metal...
- Patent number 11,856,690
- Issue date Dec 26, 2023
- United States of America as represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma ashing for coated devices
- Patent number 11,849,543
- Issue date Dec 19, 2023
- Sean Clancy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically bridged SMD interconnects for electronic devices
- Patent number 11,744,020
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Kyle Brent Norell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit film, display device, and method of fabricating pri...
- Patent number 11,737,215
- Issue date Aug 22, 2023
- Samsung Display Co., Ltd.
- Dong Hyun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electronics assemblies and methods of manufacturing electronics ass...
- Patent number 11,710,676
- Issue date Jul 25, 2023
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit unloading system
- Patent number 11,706,875
- Issue date Jul 18, 2023
- Rokko Systems Pte Ltd.
- Yun Suk Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic trimming of a PCB-based LC circuit
- Patent number 11,696,406
- Issue date Jul 4, 2023
- Microchip Technology Incorporated
- Ajay Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for removing a conformal coating from a circui...
- Patent number 11,673,230
- Issue date Jun 13, 2023
- Ebrahim Ghanbari
- B24 - GRINDING POLISHING
Information Patent Grant
Automatized mechanical opening/closing device of oven
- Patent number 11,661,780
- Issue date May 30, 2023
- Weisun Industrial Co., Ltd.
- Ko-Chien Ho
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Compliant pin surface mount technology pad for rework
- Patent number 11,647,591
- Issue date May 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive microstructures within a heat shrinkable subst...
- Patent number 11,638,348
- Issue date Apr 25, 2023
- Raytheon Company
- Kyle L. Grosse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...
- Publication number 20240422904
- Publication date Dec 19, 2024
- Chongqing BOE Electronic Technology Co., Ltd.
- Jie ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD
- Publication number 20240408701
- Publication date Dec 12, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Wei Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240365475
- Publication date Oct 31, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHATRONIC CURTAIN FOR A PROCESS CHAMBER FOR CARRYING OUT THERMAL...
- Publication number 20240318915
- Publication date Sep 26, 2024
- REHM THERMAL SYSTEMS GMBH
- Paul WILD
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR CI...
- Publication number 20240306289
- Publication date Sep 12, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...
- Publication number 20240284602
- Publication date Aug 22, 2024
- ASTEC IRIE CO., LTD.
- Taichi YOSHIMURA
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
- Publication number 20240268018
- Publication date Aug 8, 2024
- Rohm Co., Ltd.
- Goro Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS AND SYSTEM FOR PROCESSING A COMPOSITE WASTE SOURCE
- Publication number 20240247335
- Publication date Jul 25, 2024
- NewSouth Innovations Pty Limited
- Veena Sahajwalla
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20240251509
- Publication date Jul 25, 2024
- InnoLux Corporation
- Yu-Chia HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240244745
- Publication date Jul 18, 2024
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei REN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Opening Method and Opening Device
- Publication number 20240237225
- Publication date Jul 11, 2024
- SHENZHEN HAN'S CNC TECHNOLOGY CO., LTD.
- Guodong Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20240224430
- Publication date Jul 4, 2024
- Prashant Patil
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186261
- Publication date Jun 6, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP FILM WITH LOW DIELECTRIC LOSS, PREPARATION METHOD THEREFOR...
- Publication number 20240182619
- Publication date Jun 6, 2024
- Wuhan Choice Technology Co, Ltd
- De WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A PACKAGE SUBSTRATE
- Publication number 20240188222
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...
- Publication number 20240179851
- Publication date May 30, 2024
- Atotech Deutschland GmbH & Co. KG
- Valentina BELOVA-MAGRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...
- Publication number 20240164009
- Publication date May 16, 2024
- WISOL CO., LTD.
- Jung Min KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRO-OPTICAL APPARATUS
- Publication number 20240152008
- Publication date May 9, 2024
- Trivale Technologies
- Takahiro UENO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
AUTOMATED PRESSURE CONTROL SYSTEM AND METHOD FOR A CLEANER
- Publication number 20240139764
- Publication date May 2, 2024
- Illinois Tool Works Inc.
- Eric Wayne Becker
- B08 - CLEANING
Information Patent Application
CHEMICAL LIBERATION OF WASTE PRINTED CIRCUIT BOARDS
- Publication number 20240123480
- Publication date Apr 18, 2024
- INTEGRATED RECYCLING TECHNOLOGIES CORPORATION
- Benjamin Turner Suslavich
- B03 - SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES O...
Information Patent Application
REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME
- Publication number 20240074065
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Do Jae YOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORK PATCH FOR AN ELECTRONIC CIRCUIT
- Publication number 20240040706
- Publication date Feb 1, 2024
- Jabil Inc.
- Muhammad Irsyad Bin Suhaimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE TRACE INTERCONNECTION TAPE
- Publication number 20240015886
- Publication date Jan 11, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Stephen McGarry Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006285
- Publication date Jan 4, 2024
- The Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20230422403
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FOLD FLEX CIRCUIT FOR LNOP
- Publication number 20230403798
- Publication date Dec 14, 2023
- MASIMO CORPORATION
- Benjamin C. Triman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...
- Publication number 20230397323
- Publication date Dec 7, 2023
- Intel Corporation
- Min Suet LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE
- Publication number 20230380073
- Publication date Nov 23, 2023
- Teradyne, Inc.
- Eric Boiselle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Secondary treatment of printed circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring circuit board, producing method thereof, and wiring circuit...

Build-up film with low dielectric loss, preparation method therefor...

Layered device for pressure treatment and method

Buried lines and related fabrication techniques

Devices and methods related to metallization of ceramic substrates...

Apparatus and method for assigning a material value score to a wast...

Controlled wetting and spreading of metals on substrates using poro...

Short or near short etch rework

Systems for coating a substrate

Flexible laminated board and multilayer circuit board

Automated pressure control system and method for a cleaner

Method for manufacturing an electronic device

Panel device and manufacturing method of panel device

Method of manufacturing circuits using thick metals and machined bu...

Highly electrically conductive silver ink composition and wiring ob...

Fold flex circuit for LNOP

Method, apparatus and system for processing a composite waste source

Laned belt for cleaner

Substrate, maintenance method and display device

Substrates comprising a network comprising core shell liquid metal...

Plasma ashing for coated devices

Mechanically bridged SMD interconnects for electronic devices

Printed circuit film, display device, and method of fabricating pri...

Electronics assemblies and methods of manufacturing electronics ass...

Unit unloading system

Automatic trimming of a PCB-based LC circuit

Method and apparatus for removing a conformal coating from a circui...

Automatized mechanical opening/closing device of oven

Compliant pin surface mount technology pad for rework

Patterned conductive microstructures within a heat shrinkable subst...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APP...

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

MECHATRONIC CURTAIN FOR A PROCESS CHAMBER FOR CARRYING OUT THERMAL...

CIRCUIT BOARD, ELECTRONIC APPARATUS AND MANUFACTURING METHOD FOR CI...

APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...

INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...

METHOD, APPARATUS AND SYSTEM FOR PROCESSING A COMPOSITE WASTE SOURCE

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Opening Method and Opening Device

SYSTEMS AND METHODS FOR MANUFACTURING PRINTED CIRCUIT BOARDS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

BUILD-UP FILM WITH LOW DIELECTRIC LOSS, PREPARATION METHOD THEREFOR...

METHOD OF FORMING A PACKAGE SUBSTRATE

MODIFIED COPPER SURFACE, HETEROAROMATIC SILANE COMPOUNDS AND THEIR...

ELECTROMAGNETIC WAVE SHIELDING SHEET, FLEXIBLE PRINTED CIRCUIT BOAR...

ELECTRO-OPTICAL APPARATUS

AUTOMATED PRESSURE CONTROL SYSTEM AND METHOD FOR A CLEANER

CHEMICAL LIBERATION OF WASTE PRINTED CIRCUIT BOARDS

REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME

REWORK PATCH FOR AN ELECTRONIC CIRCUIT

CONDUCTIVE TRACE INTERCONNECTION TAPE

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

FOLD FLEX CIRCUIT FOR LNOP

PACKAGE BOTTOM SIDE THERMAL SOLUTION WITH DISCRETE HAT-SHAPED COPPE...

FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE