Selection of materials

Industry

CPC
H01G4/008

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/008Selection of materials

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multilayer capacitor and board having the same mounted thereon
- Patent number 12,224,121
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- A Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,128
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyo Sung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,124
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Joon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,224,119
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,224,120
- Issue date Feb 11, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,224,123
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ho In Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,218,185
- Issue date Feb 4, 2025
- TDK Corporation
- Daiki Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,217,913
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,218,182
- Issue date Feb 4, 2025
- SK Hynix Inc.
- Kwan Woo Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbonaceous material, method for producing same, electrode active...
- Patent number 12,218,353
- Issue date Feb 4, 2025
- Kuraray Co., Ltd.
- Hiroyuki Nishinami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and manufacturing method of the same
- Patent number 12,211,651
- Issue date Jan 28, 2025
- Taiyo Yuden Co., Ltd.
- Yoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,211,650
- Issue date Jan 28, 2025
- Murata Manufacturing Co., Ltd.
- Tomochika Miyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor component
- Patent number 12,211,652
- Issue date Jan 28, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Suji Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic device and manufacturing method of the same
- Patent number 12,211,653
- Issue date Jan 28, 2025
- Taiyo Yuden Co., Ltd.
- Hidetoshi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,205,769
- Issue date Jan 21, 2025
- Taiyo Yuden Co., Ltd.
- Yoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and method for manufacturing multilaye...
- Patent number 12,205,770
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi Muramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for patterning valve metals
- Patent number 12,198,855
- Issue date Jan 14, 2025
- The Florida International University Board of Trustees
- Markondeyaraj Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,198,858
- Issue date Jan 14, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Og Soon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,198,864
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Keita Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,198,862
- Issue date Jan 14, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeong Lim Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and mounting structure of multilayer c...
- Patent number 12,198,857
- Issue date Jan 14, 2025
- Murata Manufacturing Co., Ltd.
- Akitaka Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,191,081
- Issue date Jan 7, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 12,191,085
- Issue date Jan 7, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hwi Dae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-terminal multilayer ceramic capacitor
- Patent number 12,183,516
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Yuichiro Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,176,148
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Togo Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,176,154
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Hiroyuki Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided copper-clad laminate
- Patent number 12,176,150
- Issue date Dec 24, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Ryuji Ishizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,176,153
- Issue date Dec 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ha Jeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 12,176,151
- Issue date Dec 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Wook Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,170,170
- Issue date Dec 17, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun Hyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARBONIZED CELLULOSE FIBER ELECTRODES FOR HIGH-FREQUENCY ELECTROCHE...
- Publication number 20250054691
- Publication date Feb 13, 2025
- Arizona Board of Regents on behalf of Arizona State University
- Zhaoyang FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250054698
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Yasuhiro MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250054700
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hwi Dae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF M...
- Publication number 20250054704
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori USUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED ELECTRONIC COMPONENT
- Publication number 20250054702
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Byung Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR
- Publication number 20250054703
- Publication date Feb 13, 2025
- Murata Manufacturing Co., Ltd.
- Takashi SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250046518
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Joon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED COPPER CLAD LAMINATE, CAPACITOR ELEMENT AND PRINTED WI...
- Publication number 20250046520
- Publication date Feb 6, 2025
- Mitsui Mining and Smelting Co., Ltd.
- Ryuji ISHIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20250037934
- Publication date Jan 30, 2025
- TDK Corporation
- Hikaru HIRABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250037937
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250037939
- Publication date Jan 30, 2025
- Murata Manufacturing Co., Ltd.
- Akito MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250037935
- Publication date Jan 30, 2025
- KYOCERA CORPORATION
- Nobuyoshi FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250029789
- Publication date Jan 23, 2025
- Murata Manufacturing Co., Ltd.
- Kazuhiro NISHIBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250029790
- Publication date Jan 23, 2025
- Murata Manufacturing Co., Ltd.
- Haruki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE
- Publication number 20250029788
- Publication date Jan 23, 2025
- TDK Corporation
- Shinya ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED CERAMIC ELECTRONIC COMPONENT
- Publication number 20250022657
- Publication date Jan 16, 2025
- Kyocera Corporation
- Takao SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014819
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Takaaki BABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD
- Publication number 20250014832
- Publication date Jan 9, 2025
- Taiyo Yuden Co., Ltd.
- Tomoki SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014818
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Hironori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014820
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Hironori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014828
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Hironori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014829
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Hironori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014830
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Hironori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014831
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Hironori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250006429
- Publication date Jan 2, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi MIYAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREMELY HIGH DENSITY SILICON CAPACITOR
- Publication number 20250006780
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Joshua M. Rubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING LAMINATED C...
- Publication number 20250006431
- Publication date Jan 2, 2025
- Taiyo Yuden Co., Ltd.
- Ayumi MATSUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20250006778
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Haeryong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING LAMINATED C...
- Publication number 20250002416
- Publication date Jan 2, 2025
- Taiyo Yuden Co., Ltd.
- Kotaro MIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for preparing sintered anode aluminum foil and sintered anod...
- Publication number 20240424556
- Publication date Dec 26, 2024
- Chongqing University
- Jian Peng
- B22 - CASTING POWDER METALLURGY

Selection of materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer capacitor and board having the same mounted thereon

Multilayer electronic component

Multilayer electronic component

Electronic component

Electronic component

Multilayer electronic component

Thin film capacitor and electronic circuit substrate having the same

Chip parts

Semiconductor device and method for fabricating the same

Carbonaceous material, method for producing same, electrode active...

Ceramic electronic component and manufacturing method of the same

Multilayer ceramic capacitor

Capacitor component

Ceramic electronic device and manufacturing method of the same

Multilayer ceramic capacitor

Multilayer ceramic capacitor and method for manufacturing multilaye...

Systems and methods for patterning valve metals

Multilayer electronic component

Multilayer ceramic capacitor

Multilayer electronic component

Multilayer ceramic capacitor and mounting structure of multilayer c...

Multilayer electronic component

Multilayer capacitor

Three-terminal multilayer ceramic capacitor

Electronic component

Multilayer ceramic capacitor

Double-sided copper-clad laminate

Multilayer electronic component

Multilayer capacitor

Multilayer electronic component

Patents Applicationslast 30 patents

CARBONIZED CELLULOSE FIBER ELECTRODES FOR HIGH-FREQUENCY ELECTROCHE...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF M...

MULTILAYERED ELECTRONIC COMPONENT

THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR

MULTILAYER ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME

DOUBLE-SIDED COPPER CLAD LAMINATE, CAPACITOR ELEMENT AND PRINTED WI...

MULTILAYER CAPACITOR

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE

LAMINATED CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, AND CIRCUIT BOARD

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC ELECTRONIC COMPONENT

EXTREMELY HIGH DENSITY SILICON CAPACITOR

LAMINATED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING LAMINATED C...

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

LAMINATED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING LAMINATED C...

Method for preparing sintered anode aluminum foil and sintered anod...