Semiconductive ceramic capacitors

Industry

CPC
H01G4/1272

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/1272Semiconductive ceramic capacitors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,107,025
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bridge for die-to-die interconnects
- Patent number 12,002,747
- Issue date Jun 4, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,776,747
- Issue date Oct 3, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Berm Ha Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric ceramic composition and multilayer ceramic capacitor com...
- Patent number 11,735,361
- Issue date Aug 22, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Min Young Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,462,359
- Issue date Oct 4, 2022
- Murata Manufacturing Co., Ltd.
- Tomohiro Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,367,570
- Issue date Jun 21, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Berm Ha Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bridge for die-to-die interconnects
- Patent number 11,282,780
- Issue date Mar 22, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-layer capacitor and method of fabricating the same
- Patent number 11,276,530
- Issue date Mar 15, 2022
- Mitsubishi Electric Corporation
- Masahiro Totsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed semiconductor chip stack
- Patent number 11,257,762
- Issue date Feb 22, 2022
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric ceramic composition and multilayer ceramic capacitor com...
- Patent number 11,127,532
- Issue date Sep 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Min Young Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for production of multilayer electronic component
- Patent number 11,120,942
- Issue date Sep 14, 2021
- TDK Corporation
- Jun Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 10,903,006
- Issue date Jan 26, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Berm Ha Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric ceramic composition, method for the production and use t...
- Patent number 10,892,097
- Issue date Jan 12, 2021
- TDK ELECTRONICS AG
- Pavol Dudesek
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Multilayer capacitor
- Patent number 10,867,749
- Issue date Dec 15, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Sung Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of manufacturing the same
- Patent number 10,867,752
- Issue date Dec 15, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyun Ho Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic sintered body and passive component including the same
- Patent number 10,692,653
- Issue date Jun 23, 2020
- Yageo Corporation
- Masayuki Fujimoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
High energy density storage device
- Patent number 10,636,573
- Issue date Apr 28, 2020
- Martin A. Stuart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method of fabricating the same
- Patent number 10,600,568
- Issue date Mar 24, 2020
- United Microelectronics Corp.
- Po-Han Jen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed semiconductor chip stack
- Patent number 10,504,843
- Issue date Dec 10, 2019
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure with an extended dielectric layer and method of...
- Patent number 10,418,438
- Issue date Sep 17, 2019
- Microchip Technology Incorporated
- Randy Yach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Failure tolerant capacitor device
- Patent number 10,386,403
- Issue date Aug 20, 2019
- ABB Schweiz AG
- Uwe Drofenik
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Memory cell materials and semiconductor device structures
- Patent number 10,388,872
- Issue date Aug 20, 2019
- Micron Technology, Inc.
- Gurtej S. Sandhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface mount electronic component
- Patent number 10,366,830
- Issue date Jul 30, 2019
- Murata Manufacturing Co., Ltd.
- Masaki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount electronic component
- Patent number 10,332,679
- Issue date Jun 25, 2019
- Murata Manufacturing Co., Ltd.
- Takashi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method of housing an electronic co...
- Patent number 10,319,658
- Issue date Jun 11, 2019
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric composition and electronic component
- Patent number 10,262,796
- Issue date Apr 16, 2019
- TDK Corporation
- Tetsuhiro Takahashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Electronic component
- Patent number 10,263,590
- Issue date Apr 16, 2019
- Murata Manufacturing Co., Ltd.
- Ryo Okura
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Magnetically enhanced energy storage systems
- Patent number 10,176,928
- Issue date Jan 8, 2019
- E1023 CORPORATION
- Daniel Albert Gabig
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ultra compact micro capacitor and method for producing same
- Patent number 10,153,093
- Issue date Dec 11, 2018
- Leibniz-Institut fuer Festkoerper-und Werkstofforschung Dresden E.V.
- Daniel Grimm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High energy density storage device
- Patent number 10,026,555
- Issue date Jul 17, 2018
- Martin A. Stuart
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240274357
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hideyuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20240177937
- Publication date May 30, 2024
- Yageo Corporation
- Masayuki FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WITH ARRAY OF INTERCONNECTS FOR IMPROVED SELF-RESONANT FR...
- Publication number 20240105387
- Publication date Mar 28, 2024
- Dell Products L.P.
- Tejinder Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...
- Publication number 20230352240
- Publication date Nov 2, 2023
- Taiyo Yuden Co., Ltd.
- Katsuya TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE ELECTRONIC COM...
- Publication number 20230215656
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Yasuhiro NISHISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20230162918
- Publication date May 25, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Taek Jung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BOOSTER FOR THRUST GENERATION
- Publication number 20230083683
- Publication date Mar 16, 2023
- University of Miami
- Tomas Antony Pribanic SOLARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS
- Publication number 20220392835
- Publication date Dec 8, 2022
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20220277898
- Publication date Sep 1, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Berm Ha CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING CAPACITIVE STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20220238638
- Publication date Jul 28, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220139795
- Publication date May 5, 2022
- Murata Manufacturing Co., Ltd.
- Yohei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERSONALIZED INVESTMENT PORTFOLIO
- Publication number 20220076887
- Publication date Mar 10, 2022
- Francesca Maria Gaini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Com...
- Publication number 20210343477
- Publication date Nov 4, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Min Young Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS
- Publication number 20210193567
- Publication date Jun 24, 2021
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20210074478
- Publication date Mar 11, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Berm Ha CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Com...
- Publication number 20200395172
- Publication date Dec 17, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Min Young Choi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
HIGH SPEED SEMICONDUCTOR CHIP STACK
- Publication number 20200335442
- Publication date Oct 22, 2020
- L. Pierre de Rochemont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20200152384
- Publication date May 14, 2020
- Murata Manufacturing Co., Ltd.
- Tomohiro SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20200027660
- Publication date Jan 23, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jin Sung CHUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCTION OF MULTILAYER ELECTRONIC COMPONENT
- Publication number 20190221367
- Publication date Jul 18, 2019
- TDK Corporation
- Jun SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20190180936
- Publication date Jun 13, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Berm Ha CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SINTERED BODY AND PASSIVE COMPONENT INCLUDING THE SAME
- Publication number 20190131071
- Publication date May 2, 2019
- Yageo Corporation
- MASAYUKI FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Ceramic Composition, Method for the Production and Use T...
- Publication number 20190013149
- Publication date Jan 10, 2019
- EPCOS AG
- Pavol Dudesek
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
FAILURE TOLERANT CAPACITOR DEVICE
- Publication number 20180348285
- Publication date Dec 6, 2018
- ABB Schweiz AG
- Uwe Drofenik
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH ENERGY DENSITY STORAGE DEVICE
- Publication number 20180323012
- Publication date Nov 8, 2018
- Martin A. Stuart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT ELECTRONIC COMPONENT
- Publication number 20180247765
- Publication date Aug 30, 2018
- Murata Manufacturing Co., Ltd.
- Takashi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT ELECTRONIC COMPONENT
- Publication number 20180247766
- Publication date Aug 30, 2018
- Murata Manufacturing Co., Ltd.
- Masaki FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component Package and Method of Housing an Electronic Co...
- Publication number 20180218958
- Publication date Aug 2, 2018
- Taiyo Yuden Co., Ltd.
- Yasutomo Suga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT
- Publication number 20180040424
- Publication date Feb 8, 2018
- TDK Corporation
- Tetsuhiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA COMPACT MICRO CAPACITOR AND METHOD FOR PRODUCING SAME
- Publication number 20170358394
- Publication date Dec 14, 2017
- LEIBNIZ-INSTITUT FUER FESTKOERPER-UND WERKSTOFFFOR SCHUNG DRESDEN E.V.
- Daniel GRIMM
- H01 - BASIC ELECTRIC ELEMENTS

Semiconductive ceramic capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Integrated bridge for die-to-die interconnects

Multilayer ceramic capacitor

Dielectric ceramic composition and multilayer ceramic capacitor com...

Multilayer ceramic capacitor

Multilayer ceramic capacitor

Integrated bridge for die-to-die interconnects

Thin-layer capacitor and method of fabricating the same

High speed semiconductor chip stack

Dielectric ceramic composition and multilayer ceramic capacitor com...

Process for production of multilayer electronic component

Multilayer ceramic capacitor

Dielectric ceramic composition, method for the production and use t...

Multilayer capacitor

Capacitor and method of manufacturing the same

Ceramic sintered body and passive component including the same

High energy density storage device

Capacitor and method of fabricating the same

High speed semiconductor chip stack

Capacitor structure with an extended dielectric layer and method of...

Failure tolerant capacitor device

Memory cell materials and semiconductor device structures

Surface mount electronic component

Surface mount electronic component

Electronic component package and method of housing an electronic co...

Dielectric composition and electronic component

Electronic component

Magnetically enhanced energy storage systems

Ultra compact micro capacitor and method for producing same

High energy density storage device

Patents Applicationslast 30 patents

MULTILAYER CERAMIC CAPACITOR

MULTI-LAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING THE SAME

CAPACITOR WITH ARRAY OF INTERCONNECTS FOR IMPROVED SELF-RESONANT FR...

MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE ELECTRONIC COM...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

ION BOOSTER FOR THRUST GENERATION

INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS

MULTILAYER CERAMIC CAPACITOR

METHOD FOR PROCESSING CAPACITIVE STRUCTURE AND SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

PERSONALIZED INVESTMENT PORTFOLIO

Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Com...

INTEGRATED BRIDGE FOR DIE-TO-DIE INTERCONNECTS

MULTILAYER CERAMIC CAPACITOR

Dielectric Ceramic Composition and Multilayer Ceramic Capacitor Com...

HIGH SPEED SEMICONDUCTOR CHIP STACK

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CAPACITOR

PROCESS FOR PRODUCTION OF MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

CERAMIC SINTERED BODY AND PASSIVE COMPONENT INCLUDING THE SAME

Dielectric Ceramic Composition, Method for the Production and Use T...

FAILURE TOLERANT CAPACITOR DEVICE

HIGH ENERGY DENSITY STORAGE DEVICE

SURFACE MOUNT ELECTRONIC COMPONENT

SURFACE MOUNT ELECTRONIC COMPONENT

Electronic Component Package and Method of Housing an Electronic Co...

DIELECTRIC COMPOSITION AND ELECTRONIC COMPONENT

ULTRA COMPACT MICRO CAPACITOR AND METHOD FOR PRODUCING SAME