Semiconductor bonding wires

Industry

  • CPC
  • B65H2701/361
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wound body of sheet for sintering bonding with base material

    • Patent number 11,697,567
    • Issue date Jul 11, 2023
    • Nitto Denko Corporation
    • Ryota Mita
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Spool case for bonding wire, and method of handling spool using same

    • Patent number 6,866,148
    • Issue date Mar 15, 2005
    • W. C. Heraeus GmbH & Co. KG
    • Chang Man You
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Spool holder structure for a wire bonder

    • Patent number 6,439,496
    • Issue date Aug 27, 2002
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Spool case of bonding wire

    • Patent number 6,241,094
    • Issue date Jun 5, 2001
    • Tanaka Denshi Kogyo Kabushiki Kaisha
    • Tadao Anjo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    3747870

    • Patent number 3,747,870
    • Issue date Jul 24, 1973
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    3635333

    • Patent number 3,635,333
    • Issue date Jan 18, 1972
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    3572605

    • Patent number 3,572,605
    • Issue date Mar 30, 1971
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    3054568

    • Patent number 3,054,568
    • Issue date Sep 18, 1962
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents