Semiconductor devices

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CPC
B23K2201/40

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BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K2201/00Articles made by soldering, welding or cutting by applying heat locally

Current Industry

B23K2201/40Semiconductor devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High speed low temperature method for manufacturing and repairing s...
- Patent number 10,153,183
- Issue date Dec 11, 2018
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selecting a substrate to be soldered to a carrier
- Patent number 10,141,199
- Issue date Nov 27, 2018
- Infineon Technologies AG
- Charles Rimbert-Riviere
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser nanomachining device and method
- Patent number 10,131,017
- Issue date Nov 20, 2018
- Centre National de la Recherche Scientifique CNRS
- François Courvoisier
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a virtual germanium substrate using a laser
- Patent number 10,115,854
- Issue date Oct 30, 2018
- Newsouth Innovations Pty Limited
- Xiaojing Hao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crystallization apparatus, crystallizing method, and method of manu...
- Patent number 10,103,180
- Issue date Oct 16, 2018
- Samsung Display Co., Ltd.
- Tae-Yong Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,094,047
- Issue date Oct 9, 2018
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Protective film applying apparatus and protective film applying method
- Patent number 10,086,474
- Issue date Oct 2, 2018
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,081,076
- Issue date Sep 25, 2018
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Combined method for producing solids, involving laser treatment and...
- Patent number 10,079,171
- Issue date Sep 18, 2018
- Siltectra, GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside stealth dicing through tape followed by front side laser a...
- Patent number 10,079,169
- Issue date Sep 18, 2018
- Micron Technology, Inc.
- Andy E. Hooper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,076,804
- Issue date Sep 18, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy
- Patent number 10,076,808
- Issue date Sep 18, 2018
- Senju Metal Industry Co., Ltd.
- Tsukasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of etching glass substrates and glass substrates
- Patent number 10,077,206
- Issue date Sep 18, 2018
- Corning Incorporated
- Thomas Michael Castle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless multi-layered ceramic capacitor stacks
- Patent number 10,068,707
- Issue date Sep 4, 2018
- Kemet Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for automatic bond arm alignment
- Patent number 10,050,008
- Issue date Aug 14, 2018
- ASM Technology Singapore Pte. Ltd.
- Shui Cheung Woo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material, bonding method and semiconductor device for elect...
- Patent number 10,043,775
- Issue date Aug 7, 2018
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Water soluble flux with modified viscosity
- Patent number 10,037,898
- Issue date Jul 31, 2018
- Intel Corporation
- Kabir J. Mirpuri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,029,383
- Issue date Jul 24, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for reducing pulsed laser beam profile non-unif...
- Patent number 10,016,843
- Issue date Jul 10, 2018
- Ultratech, Inc.
- Yun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for forming apertures in microfeature workpieces
- Patent number 10,010,977
- Issue date Jul 3, 2018
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture to constrain laminate and method of assembly
- Patent number 10,014,273
- Issue date Jul 3, 2018
- International Business Machines Corporation
- Thomas E. Lombardi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet for laser dicing and method for manufacturing semico...
- Patent number 10,008,406
- Issue date Jun 26, 2018
- Denka Company Limited
- Gosuke Nakajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser cutting device
- Patent number 10,005,155
- Issue date Jun 26, 2018
- Samsung Display Co., Ltd.
- Byeongnam Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 10,002,808
- Issue date Jun 19, 2018
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of separating chips from a wafer
- Patent number 9,978,643
- Issue date May 22, 2018
- Frank Kriebel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method for forming a solder bump joint in a...
- Patent number 9,978,709
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,960,136
- Issue date May 1, 2018
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsiang Hsiao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20200343217
- Publication date Oct 29, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20190363018
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE SINGULATION SYSTEMS AND METHODS
- Publication number 20190363020
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20190287940
- Publication date Sep 19, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD
- Publication number 20190275600
- Publication date Sep 12, 2019
- Powertech Technology Inc.
- Kun-Chi Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUSES FOR REFLOWING CONDUCTIVE ELEMENTS OF SEMICO...
- Publication number 20190252337
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- James M. Derderian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Backside Stealth Dicing Through Tape Followed by Front Side Laser A...
- Publication number 20190131160
- Publication date May 2, 2019
- Micron Technology, Inc.
- Andy E. Hooper
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...
- Publication number 20190103376
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20190096848
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190084080
- Publication date Mar 21, 2019
- Toshiba Memory Corporation
- Tsutomu FUJITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20190080940
- Publication date Mar 14, 2019
- Toshiba Memory Corporation
- Makoto MINAMINAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20190061034
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180366398
- Publication date Dec 20, 2018
- Fujitsu Limited
- Yuki Hoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...
- Publication number 20180323167
- Publication date Nov 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20180304409
- Publication date Oct 25, 2018
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
- Publication number 20180304411
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD
- Publication number 20180308821
- Publication date Oct 25, 2018
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD OF WAFER
- Publication number 20180294190
- Publication date Oct 11, 2018
- Disco Corporation
- Yuri Ban
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE SUBSTRATE, LIGHT-EMITTING MODULE, SUBSTRATE F...
- Publication number 20180277729
- Publication date Sep 27, 2018
- MITSUBISHI MATERIALS CORPORATION
- Toshiyuki Nagase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW SOLDERING APPARATUS, SYSTEM AND METHOD
- Publication number 20180279485
- Publication date Sep 27, 2018
- Service Support Specialties, Inc.
- Gary Hillman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20180277456
- Publication date Sep 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20180264599
- Publication date Sep 20, 2018
- Disco Corporation
- Yutaka Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20180257171
- Publication date Sep 13, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Separating Chips from a Wafer
- Publication number 20180261506
- Publication date Sep 13, 2018
- SMARTRAC TECHNOLOGY GmbH
- Frank Kriebel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY AND JOINT STRUCTURE
- Publication number 20180257179
- Publication date Sep 13, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- HIDETOSHI KITAURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATIC INSPECTION DEVICE AND METHOD OF LASER PROCESSING EQUIPMENT
- Publication number 20180247818
- Publication date Aug 30, 2018
- EO TECHNICS CO., LTD.
- Hak Yong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT...
- Publication number 20180240774
- Publication date Aug 23, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20180237947
- Publication date Aug 23, 2018
- Disco Corporation
- Kazuya Hirata
- B24 - GRINDING POLISHING
Information Patent Application
BONDING APPARATUS
- Publication number 20180229329
- Publication date Aug 16, 2018
- Samsung Electronics Co., Ltd.
- MYUNG IL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Semiconductor devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High speed low temperature method for manufacturing and repairing s...

Selecting a substrate to be soldered to a carrier

Laser nanomachining device and method

Method for forming a virtual germanium substrate using a laser

Crystallization apparatus, crystallizing method, and method of manu...

Wafer producing method

Protective film applying apparatus and protective film applying method

Conductive connections, structures with such connections, and metho...

Wafer producing method

Combined method for producing solids, involving laser treatment and...

Backside stealth dicing through tape followed by front side laser a...

Wafer producing method

Lead-free solder alloy

Methods of etching glass substrates and glass substrates

Leadless multi-layered ceramic capacitor stacks

Method and system for automatic bond arm alignment

Conductive connections, structures with such connections, and metho...

Bonding material, bonding method and semiconductor device for elect...

Water soluble flux with modified viscosity

Wafer producing method

Systems and methods for reducing pulsed laser beam profile non-unif...

Systems and methods for forming apertures in microfeature workpieces

Solder paste, joining method using the same and joined structure

Fixture to constrain laminate and method of assembly

Adhesive sheet for laser dicing and method for manufacturing semico...

Laser cutting device

Semiconductor device manufacturing method and semiconductor device

Method of separating chips from a wafer

Solder bump stretching method for forming a solder bump joint in a...

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

DIE CLEANING SYSTEMS AND RELATED METHODS

DIE SINGULATION SYSTEMS AND METHODS

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

FLUX TRANSFER TOOL AND FLUX TRANSFER METHOD

METHODS AND APPARATUSES FOR REFLOWING CONDUCTIVE ELEMENTS OF SEMICO...

Backside Stealth Dicing Through Tape Followed by Front Side Laser A...

Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING APPARATUS

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

BGA PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...

LASER PROCESSING METHOD

SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES

SEMICONDUCTOR WIRE BONDING MACHINE CLEANING DEVICE AND METHOD

LASER PROCESSING METHOD OF WAFER

LIGHT-EMITTING MODULE SUBSTRATE, LIGHT-EMITTING MODULE, SUBSTRATE F...

REFLOW SOLDERING APPARATUS, SYSTEM AND METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

LASER PROCESSING APPARATUS

LASER PROCESSING APPARATUS

Method for Separating Chips from a Wafer

SOLDER ALLOY AND JOINT STRUCTURE

AUTOMATIC INSPECTION DEVICE AND METHOD OF LASER PROCESSING EQUIPMENT

ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT...

WAFER PRODUCING METHOD

BONDING APPARATUS