Separation of the wafer into individual elements

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HELECTRICITY H01Electric elements H01SDEVICES USING STIMULATED EMISSION H01S5/00Semiconductor lasers

Current Industry

H01S5/0201Separation of the wafer into individual elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 12,132,155
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array device manufacturing method, manufacturing apparatus, and sto...
- Patent number 12,107,382
- Issue date Oct 1, 2024
- Sumitomo Electric Industries, Ltd.
- Ryosuke Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor body having a layer stack, arrangement...
- Patent number 12,100,783
- Issue date Sep 24, 2024
- OSRAM OLED GmbH
- Tansen Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor lasers and semiconductor lasers
- Patent number 12,057,676
- Issue date Aug 6, 2024
- Osram Opto Semiconductors GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical element array, optical system and method of manufacturing o...
- Patent number 12,032,232
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Dongsik Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating a solid body
- Patent number 11,996,331
- Issue date May 28, 2024
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Puncture forming method, sample separating method, semiconductor el...
- Patent number 11,967,797
- Issue date Apr 23, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Daisuke Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing optical device and optical device
- Patent number 11,909,172
- Issue date Feb 20, 2024
- Asahi Kasei Kabushiki Kaisha
- Ziyi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die layout calculation method, apparatus, medium, and device
- Patent number 11,784,455
- Issue date Oct 10, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Li-ming Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods for producing the same
- Patent number 11,728,620
- Issue date Aug 15, 2023
- Princeton Optronics, Inc.
- Chuni Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light-emitting module, light-emitting modul...
- Patent number 11,710,942
- Issue date Jul 25, 2023
- Sony Corporation
- Hidekazu Kawanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical element array, optical system and method of manufacturing o...
- Patent number 11,675,220
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Dongsik Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical-cavity surface-emitting laser fabrication on large wafer
- Patent number 11,588,299
- Issue date Feb 21, 2023
- Mellanox Technologies, Ltd.
- Vladimir Iakovlev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level optic and zoned wafer
- Patent number 11,575,246
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Karol Constantine Hatzilias
- G02 - OPTICS
Information Patent Grant
Method for producing a detachment area in a solid body
- Patent number 11,527,441
- Issue date Dec 13, 2022
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a plurality of transferable components and com...
- Patent number 11,509,113
- Issue date Nov 22, 2022
- OSRAM OLED GmbH
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Height detecting apparatus and laser processing apparatus
- Patent number 11,361,996
- Issue date Jun 14, 2022
- Disco Corporation
- Keiji Nomaru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic modules having transparent substrates and method for...
- Patent number 11,296,270
- Issue date Apr 5, 2022
- ams Sensors Singapore Pte. Ltd.
- Bojan Tesanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser element
- Patent number 11,271,365
- Issue date Mar 8, 2022
- iReach Corporation
- Shou-Lung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and system using same
- Patent number 11,264,527
- Issue date Mar 1, 2022
- Medtronic, Inc.
- Mark R. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separating a wafer of light emitting devices
- Patent number 11,189,750
- Issue date Nov 30, 2021
- Lumileds LLC
- Rao S. Peddada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-emitting laser device and light emitting device including t...
- Patent number 11,183,813
- Issue date Nov 23, 2021
- SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
- Ho Jae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser diodes separated from a plurality of laser bars
- Patent number 10,985,528
- Issue date Apr 20, 2021
- OSRAM OLED GmbH
- Sven Gerhard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based separation method
- Patent number 10,930,560
- Issue date Feb 23, 2021
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Etched trenches in bond materials for die singulation, and associat...
- Patent number 10,892,384
- Issue date Jan 12, 2021
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser and method for producing a semiconductor laser
- Patent number 10,886,704
- Issue date Jan 5, 2021
- OSRAM OLED GmbH
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trenches for increasing a quantity of reliable chips produced from...
- Patent number 10,784,354
- Issue date Sep 22, 2020
- Lumentum Operations LLC
- Arnaud Fily
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor element
- Patent number 10,749,313
- Issue date Aug 18, 2020
- Nichia Corporation
- Eiji Muramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser and semiconductor laser arrangement
- Patent number 10,741,996
- Issue date Aug 11, 2020
- OSRAM OLED GmbH
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastomeric layer fabrication for light emitting diodes
- Patent number 10,685,946
- Issue date Jun 16, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A MULTIPLICITY OF SEMICONDUCTOR LASER CHIPS, A...
- Publication number 20240364073
- Publication date Oct 31, 2024
- ams-OSRAM International GmbH
- Norwin VON MALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBCARRIER WAFER, SUBCARRIER, METHOD FOR MANUFACTURING SUBCARRIER W...
- Publication number 20240283216
- Publication date Aug 22, 2024
- TDK Corporation
- Takashi HONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING OPTOELECTRONIC COMPONENTS, AND OPTOELECTRO...
- Publication number 20240258764
- Publication date Aug 1, 2024
- ams-OSRAM International GmbH
- Markus Keidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE
- Publication number 20240186767
- Publication date Jun 6, 2024
- Sumitomo Electric Industries, Ltd.
- Takehiko KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240146030
- Publication date May 2, 2024
- EPISTAR CORPORATION
- Shih-Chun LING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
- Publication number 20240072198
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Takeshi KAMIKAWA
- C30 - CRYSTAL GROWTH
Information Patent Application
QUANTUM CASCADE LASER DEVICES WITH IMPROVED HEAT EXTRACTION
- Publication number 20240030679
- Publication date Jan 25, 2024
- TRANSWAVE PHOTONICS, LLC.
- Seungyong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20230420910
- Publication date Dec 28, 2023
- Sumitomo Electric Industries, Ltd.
- Munetaka KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENT ARRAY, OPTICAL SYSTEM AND METHOD OF MANUFACTURING O...
- Publication number 20230258966
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Dongsik SHIM
- G02 - OPTICS
Information Patent Application
TRANSFER PROCESS TO REALIZE SEMICONDUCTOR DEVICES
- Publication number 20230238477
- Publication date Jul 27, 2023
- The Regents of the University of California
- Srinivas Gandrothula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENTS WITH WAFER LEVEL OPTICS
- Publication number 20230135756
- Publication date May 4, 2023
- Meta Platforms Technologies, LLC
- Karol Constantine Hatzilias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING A SOLID BODY
- Publication number 20230106978
- Publication date Apr 6, 2023
- SILTECTRA GMBH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for Manufacturing Optoelectronic Components and Optoelectro...
- Publication number 20230064885
- Publication date Mar 2, 2023
- ams-OSRAM International GmbH
- Sebastian Stoll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR CHIP COMPRISING A CONTACT ELEMENT AND...
- Publication number 20220344899
- Publication date Oct 27, 2022
- Osram Opto Semiconductors GmbH
- Roberto DOSSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LASER DRIVING APPARATUS, ELECTRONIC EQUIPMENT, AND MA...
- Publication number 20220302674
- Publication date Sep 22, 2022
- Sony Semiconductor Solutions Corporation
- Kiyohisa SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM CASCADE LASER DEVICES WITH IMPROVED HEAT EXTRACTION
- Publication number 20220209498
- Publication date Jun 30, 2022
- TRANSWAVE PHOTONICS, LLC.
- Seungyong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND SYSTEM USING SAME
- Publication number 20220158021
- Publication date May 19, 2022
- Medtronic, Inc.
- Mark R. Boone
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ARRAY DEVICE MANUFACTURING METHOD, MANUFACTURING APPARATUS, AND STO...
- Publication number 20220115833
- Publication date Apr 14, 2022
- Sumitomo Electric Industries, Ltd.
- Ryosuke KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OBTAINING ELECTRONIC DEVICES AND ELECTRONIC DEVICES
- Publication number 20220109282
- Publication date Apr 7, 2022
- Osram Opto Semiconductors GmbH
- Markus BOSS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated vertical emitter structure having controlled wavelength
- Publication number 20210336422
- Publication date Oct 28, 2021
- Apple Inc.
- Fei Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Detachment Area in a Solid Body
- Publication number 20210265215
- Publication date Aug 26, 2021
- SILTECTRA GMBH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR BODY, ARRANGEMENT OF A PLURALITY OF OP...
- Publication number 20210226090
- Publication date Jul 22, 2021
- OSRAM OLED GmbH
- Tansen Varghese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING OPTICAL DEVICE AND OPTICAL DEVICE
- Publication number 20210210924
- Publication date Jul 8, 2021
- Asahi Kasei Kabushiki Kaisha
- Ziyi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...
- Publication number 20210135067
- Publication date May 6, 2021
- Micron Technology, Inc.
- Vladimir Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING THE SAME
- Publication number 20210119414
- Publication date Apr 22, 2021
- Princeton Optronics, Inc.
- Chuni Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PLURALITY OF TRANSFERABLE COMPONENTS AND COM...
- Publication number 20210050705
- Publication date Feb 18, 2021
- OSRAM OLED GmbH
- Hubert Halbritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR EL...
- Publication number 20210016395
- Publication date Jan 21, 2021
- Panasonic Semiconductor Solutions Co., Ltd.
- Daisuke IKEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTOELECTRONIC MODULES HAVING TRANSPARENT SUBSTRATES AND METHOD FOR...
- Publication number 20200395523
- Publication date Dec 17, 2020
- ams Sensors Singapore Pte. Ltd.
- Bojan Tesanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT-EMITTING MODULE, LIGHT-EMITTING MODUL...
- Publication number 20200313400
- Publication date Oct 1, 2020
- SONY CORPORATION
- HIDEKAZU KAWANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIODES SEPARATED FROM A PLURALITY OF LASER BARS
- Publication number 20200244034
- Publication date Jul 30, 2020
- OSRAM OLED GmbH
- Sven Gerhard
- H01 - BASIC ELECTRIC ELEMENTS

Separation of the wafer into individual elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Etched trenches in bond materials for die singulation, and associat...

Array device manufacturing method, manufacturing apparatus, and sto...

Optoelectronic semiconductor body having a layer stack, arrangement...

Method for producing semiconductor lasers and semiconductor lasers

Optical element array, optical system and method of manufacturing o...

Method for separating a solid body

Puncture forming method, sample separating method, semiconductor el...

Method for manufacturing optical device and optical device

Die layout calculation method, apparatus, medium, and device

Semiconductor devices and methods for producing the same

Method of manufacturing light-emitting module, light-emitting modul...

Optical element array, optical system and method of manufacturing o...

Vertical-cavity surface-emitting laser fabrication on large wafer

Wafer level optic and zoned wafer

Method for producing a detachment area in a solid body

Method for producing a plurality of transferable components and com...

Height detecting apparatus and laser processing apparatus

Optoelectronic modules having transparent substrates and method for...

Laser element

Integrated circuit package and system using same

Separating a wafer of light emitting devices

Surface-emitting laser device and light emitting device including t...

Laser diodes separated from a plurality of laser bars

Laser-based separation method

Etched trenches in bond materials for die singulation, and associat...

Semiconductor laser and method for producing a semiconductor laser

Trenches for increasing a quantity of reliable chips produced from...

Method for manufacturing a semiconductor element

Semiconductor laser and semiconductor laser arrangement

Elastomeric layer fabrication for light emitting diodes

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A MULTIPLICITY OF SEMICONDUCTOR LASER CHIPS, A...

SUBCARRIER WAFER, SUBCARRIER, METHOD FOR MANUFACTURING SUBCARRIER W...

METHOD FOR MANUFACTURING OPTOELECTRONIC COMPONENTS, AND OPTOELECTRO...

METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

QUANTUM CASCADE LASER DEVICES WITH IMPROVED HEAT EXTRACTION

BONDING DEVICE AND BONDING METHOD

OPTICAL ELEMENT ARRAY, OPTICAL SYSTEM AND METHOD OF MANUFACTURING O...

TRANSFER PROCESS TO REALIZE SEMICONDUCTOR DEVICES

COMPONENTS WITH WAFER LEVEL OPTICS

METHOD FOR SEPARATING A SOLID BODY

Process for Manufacturing Optoelectronic Components and Optoelectro...

OPTOELECTRONIC SEMICONDUCTOR CHIP COMPRISING A CONTACT ELEMENT AND...

SEMICONDUCTOR LASER DRIVING APPARATUS, ELECTRONIC EQUIPMENT, AND MA...

QUANTUM CASCADE LASER DEVICES WITH IMPROVED HEAT EXTRACTION

INTEGRATED CIRCUIT PACKAGE AND SYSTEM USING SAME

ARRAY DEVICE MANUFACTURING METHOD, MANUFACTURING APPARATUS, AND STO...

METHOD FOR OBTAINING ELECTRONIC DEVICES AND ELECTRONIC DEVICES

Integrated vertical emitter structure having controlled wavelength

Method for Producing a Detachment Area in a Solid Body

OPTOELECTRONIC SEMICONDUCTOR BODY, ARRANGEMENT OF A PLURALITY OF OP...

METHOD FOR MANUFACTURING OPTICAL DEVICE AND OPTICAL DEVICE

ETCHED TRENCHES IN BOND MATERIALS FOR DIE SINGULATION, AND ASSOCIAT...

SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING THE SAME

METHOD FOR PRODUCING A PLURALITY OF TRANSFERABLE COMPONENTS AND COM...

PUNCTURE FORMING METHOD, SAMPLE SEPARATING METHOD, SEMICONDUCTOR EL...

OPTOELECTRONIC MODULES HAVING TRANSPARENT SUBSTRATES AND METHOD FOR...

METHOD OF MANUFACTURING LIGHT-EMITTING MODULE, LIGHT-EMITTING MODUL...

LASER DIODES SEPARATED FROM A PLURALITY OF LASER BARS