Shape and layout details of conductors

Industry

CPC
H05K2201/09209

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09209Shape and layout details of conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,737,209
- Issue date Aug 22, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,528,810
- Issue date Dec 13, 2022
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,528,801
- Issue date Dec 13, 2022
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil substrate
- Patent number 11,521,778
- Issue date Dec 6, 2022
- LG Electronics Inc.
- Hyungjun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 11,452,215
- Issue date Sep 20, 2022
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing an electrical connection and printed circuit b...
- Patent number 11,219,119
- Issue date Jan 4, 2022
- Advantest Corporation
- Sylvia Ehrler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device, system and method to promote the integrity of signal commun...
- Patent number 11,153,968
- Issue date Oct 19, 2021
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,083,086
- Issue date Aug 3, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor enhancing variation percentages under high pressures
- Patent number 10,989,613
- Issue date Apr 27, 2021
- Taiwan Alpha Electronic Co., Ltd.
- Tzu-Hsuan Huang
- G01 - MEASURING TESTING
Information Patent Grant
Radio frequency connection arrangement
- Patent number 10,854,942
- Issue date Dec 1, 2020
- CAMBIUM NETWORKS LTD
- Paul Clark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connectors for coaxial cables
- Patent number 10,833,461
- Issue date Nov 10, 2020
- CommScope Technologies LLC
- Rui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding with integrated electrode pattern and method for manufactur...
- Patent number 10,383,234
- Issue date Aug 13, 2019
- Nissha Co., Ltd.
- Seiichi Yamazaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,104,782
- Issue date Oct 16, 2018
- Dow Global Technologies LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 10,100,421
- Issue date Oct 16, 2018
- Dow Global Technologies LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 10,034,388
- Issue date Jul 24, 2018
- Nitto Denko Corporation
- Takatoshi Sakakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of electroplating photoresist defined features from copper e...
- Patent number 9,932,684
- Issue date Apr 3, 2018
- Rohm and Haas Electronic Materials LLC
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Connecting member for electronic device and electronic device inclu...
- Patent number 9,853,377
- Issue date Dec 26, 2017
- Samsung Electronics Co., Ltd.
- Yeon Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate substrates having radial cut metallic planes
- Patent number 9,818,682
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Edmund Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a transparent conductive film for a touch panel
- Patent number 9,820,377
- Issue date Nov 14, 2017
- FUJIFILM Corporation
- Kensuke Katagiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages having interconnection members
- Patent number 9,668,344
- Issue date May 30, 2017
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, manufacturing method for electronic component...
- Patent number 9,414,489
- Issue date Aug 9, 2016
- Seiko Epson Corporation
- Manabu Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jumper module mounting circuit board and circuit board assembly
- Patent number 9,414,491
- Issue date Aug 9, 2016
- Yazaki Corporation
- Takanori Kitajo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imprinted bi-layer micro-structure method
- Patent number 9,277,642
- Issue date Mar 1, 2016
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent metal mesh and method of manufacture
- Patent number 9,244,356
- Issue date Jan 26, 2016
- Rolith, Inc.
- Boris Kobrin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imprinted multi-layer micro-structure method with multi-level stamp
- Patent number 9,215,798
- Issue date Dec 15, 2015
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imprinted bi-layer micro-structure method with bi-level stamp
- Patent number 9,101,056
- Issue date Aug 4, 2015
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imprinted multi-layer micro-structure
- Patent number 9,078,360
- Issue date Jul 7, 2015
- Eastman Kodak Company
- Ronald Steven Cok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
A POWER CONVERTER DEVICE AND A SYSTEM COMPRISING THE SAME
- Publication number 20240235412
- Publication date Jul 11, 2024
- Epinovatech AB
- Martin Andreas OLSSON
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20230156910
- Publication date May 18, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20230137656
- Publication date May 4, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20220377883
- Publication date Nov 24, 2022
- IBIDEN CO., LTD.
- Shigeto IYODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220240369
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220061147
- Publication date Feb 24, 2022
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20210243902
- Publication date Aug 5, 2021
- Shinko Electric Industries Co., Ltd.
- Yoko Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...
- Publication number 20210185832
- Publication date Jun 17, 2021
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTORS FOR COAXIAL CABLES
- Publication number 20200203902
- Publication date Jun 25, 2020
- CommScope Technologies LLC
- Rui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SENSOR
- Publication number 20190376853
- Publication date Dec 12, 2019
- TAIWAN ALPHA ELECTRONIC CO., LTD.
- TZU-HSUAN HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373742
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL SUBSTRATE
- Publication number 20190333671
- Publication date Oct 31, 2019
- LG ELECTRONICS INC.
- Hyungjun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY CONNECTION ARRANGEMENT
- Publication number 20190190110
- Publication date Jun 20, 2019
- Cambium Networks Limited
- Paul Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD TO PROMOTE THE INTEGRITY OF SIGNAL COMMUN...
- Publication number 20190045625
- Publication date Feb 7, 2019
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
- Publication number 20180070457
- Publication date Mar 8, 2018
- Nitto Denko Corporation
- Takatoshi SAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attach...
- Publication number 20170303405
- Publication date Oct 19, 2017
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC DEVICE AND METHODS TO CUSTOMIZE ELECTRONIC DEVICE ELECTR...
- Publication number 20170245361
- Publication date Aug 24, 2017
- NOKOMIS, INC.
- Walter John KELLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20170215286
- Publication date Jul 27, 2017
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20170181287
- Publication date Jun 22, 2017
- Siliconware Precision Industries Co., Ltd.
- Jyun-Yuan Jhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037526
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170042037
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...
- Publication number 20170037527
- Publication date Feb 9, 2017
- Rohm and Haas Electronic Materials L.L.C.
- Matthew Thorseth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160381793
- Publication date Dec 29, 2016
- Kyocera Corporation
- Masaharu YASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BREADBOARD SYTLE PRINTED CIRCUIT BOARD
- Publication number 20160360613
- Publication date Dec 8, 2016
- Samuel P. Kho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE-PLACED SUBSTRATE
- Publication number 20160313503
- Publication date Oct 27, 2016
- Sumitomo Osaka Cement Co., Ltd.
- Motohiro Takemura
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING INTERCONNECTION MEMBERS
- Publication number 20160316559
- Publication date Oct 27, 2016
- SK HYNIX INC.
- Won Duck JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING MEMBER FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE INCLU...
- Publication number 20160294086
- Publication date Oct 6, 2016
- SAMSUNG ELECTRONICS., LTD.
- Yeon Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...
- Publication number 20160143134
- Publication date May 19, 2016
- IBIDEN CO., LTD.
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING
- Publication number 20160128193
- Publication date May 5, 2016
- Elwha LLC
- William David Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING
- Publication number 20160128192
- Publication date May 5, 2016
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS

Shape and layout details of conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board and manufacturing method thereof and electronic device

Wiring board

Printed circuit board

Coil substrate

Wiring circuit board, producing method thereof, and wiring circuit...

Printed wiring board and method for manufacturing the same

Method for providing an electrical connection and printed circuit b...

Device, system and method to promote the integrity of signal commun...

Printed wiring board and method for manufacturing printed wiring board

Pressure sensor enhancing variation percentages under high pressures

Radio frequency connection arrangement

Connectors for coaxial cables

Molding with integrated electrode pattern and method for manufactur...

Method of electroplating photoresist defined features from copper e...

Method of electroplating photoresist defined features from copper e...

Suspension board with circuit and producing method thereof

Method of electroplating photoresist defined features from copper e...

Connecting member for electronic device and electronic device inclu...

Laminate substrates having radial cut metallic planes

Methods for producing a transparent conductive film for a touch panel

Semiconductor packages having interconnection members

Electronic component, manufacturing method for electronic component...

Jumper module mounting circuit board and circuit board assembly

Imprinted bi-layer micro-structure method

Transparent metal mesh and method of manufacture

Imprinted multi-layer micro-structure method with multi-level stamp

Imprinted bi-layer micro-structure method with bi-level stamp

Imprinted multi-layer micro-structure

Patents Applicationslast 30 patents

A POWER CONVERTER DEVICE AND A SYSTEM COMPRISING THE SAME

CIRCUIT BOARD AND ELECTRONIC DEVICE

WIRING CIRCUIT BOARD

PRINTED WIRING BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

WIRING BOARD

WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...

CONNECTORS FOR COAXIAL CABLES

PRESSURE SENSOR

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COIL SUBSTRATE

RADIO FREQUENCY CONNECTION ARRANGEMENT

DEVICE, SYSTEM AND METHOD TO PROMOTE THE INTEGRITY OF SIGNAL COMMUN...

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attach...

ELECTRONIC DEVICE AND METHODS TO CUSTOMIZE ELECTRONIC DEVICE ELECTR...

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

ELECTRONIC PACKAGE

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER E...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR BREADBOARD SYTLE PRINTED CIRCUIT BOARD

ELECTRODE-PLACED SUBSTRATE

SEMICONDUCTOR PACKAGES HAVING INTERCONNECTION MEMBERS

CONNECTING MEMBER FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE INCLU...

WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING...

SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING

SYSTEMS, METHODS AND DEVICES FOR INTER-SUBSTRATE COUPLING