Shape memory alloy [SMA]

Industry

CPC
H05K2201/0308

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0308Shape memory alloy [SMA]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermally activated retractable EMC protection
- Patent number 11,968,809
- Issue date Apr 23, 2024
- International Business Machines Corporation
- John S. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally activated retractable EMC protection
- Patent number 11,751,362
- Issue date Sep 5, 2023
- International Business Machines Corporation
- John S. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adaptive composite structure using shape memory alloys
- Patent number 11,110,647
- Issue date Sep 7, 2021
- The Boeing Company
- Jeffery L. Marcoe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Self-transforming flexible film and method for preparing same
- Patent number 10,939,549
- Issue date Mar 2, 2021
- Gwangju Institute of Science and Technology
- Jongho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shape-memory alloy connector for plated through-hole
- Patent number 10,729,016
- Issue date Jul 28, 2020
- International Business Machines Corporation
- Prabjit Singh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic shielding of heat sinks with shape-memory alloy gro...
- Patent number 10,575,448
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Theron L. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array rework
- Patent number 10,546,828
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,342,122
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,206,278
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Bruce J. Chamberlain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,080,283
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adaptive composite structure using shape memory alloys
- Patent number 9,981,421
- Issue date May 29, 2018
- The Boeing Company
- Jeffery L. Marcoe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ball grid array rework
- Patent number 9,978,706
- Issue date May 22, 2018
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stitched components of an active implantable medical device
- Patent number 9,089,714
- Issue date Jul 28, 2015
- Saluda Medical Pty Limited
- David Robinson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit protection element and a circuit board with the circuit pro...
- Patent number 8,031,488
- Issue date Oct 4, 2011
- Powertech Industrial Co., Ltd.
- Jung-Hui Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting board, height adjusting apparatus and mounting method
- Patent number 7,872,875
- Issue date Jan 18, 2011
- Fujitsu Limited
- Tsuyoshi So
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flat substrate having an electrically conductive structure
- Patent number 7,795,693
- Issue date Sep 14, 2010
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Heinz Kaufmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder foams, nano-porous solders, foamed-solder bumps in chip pack...
- Patent number 7,745,013
- Issue date Jun 29, 2010
- Intel Corporation
- Heeman Choe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for attaching an IC package to a PCB assembly
- Patent number 7,371,673
- Issue date May 13, 2008
- Texas Instruments Incorporated
- Akira Matsunami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of fabricating and using shaped springs
- Patent number 7,127,811
- Issue date Oct 31, 2006
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Flexible print circuit, wire harness, and wiring structure using sh...
- Patent number 6,906,262
- Issue date Jun 14, 2005
- Fuji Photo Film Co., Ltd.
- Yuichi Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Retainer for circuit board assembly and method for using the same
- Patent number 6,875,931
- Issue date Apr 5, 2005
- Intel Corporation
- Christopher D. Combs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero insertion force heat-activated retention pin
- Patent number 6,764,325
- Issue date Jul 20, 2004
- Intel Corporation
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of surface mounting a connector and connector
- Patent number 6,655,990
- Issue date Dec 2, 2003
- Fujitsu Limited
- Hideaki Terauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating shaped springs
- Patent number 6,640,432
- Issue date Nov 4, 2003
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Grant
Method for the making soldering flux and resulting weld joint
- Patent number 6,383,305
- Issue date May 7, 2002
- Thomson-CSF
- Jean Chazelas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of surface mounting a connector
- Patent number 6,081,998
- Issue date Jul 4, 2000
- Fujitsu Limited
- Hideaki Terauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reworking a multi-layer circuit board using a shape memo...
- Patent number 5,925,298
- Issue date Jul 20, 1999
- Ford Motor Company
- Bethany Joy Walles
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Contact device for an electrical component and method for manufacture
- Patent number 5,334,031
- Issue date Aug 2, 1994
- Minnesota Mining and Manufacturing Company
- Juergen K. Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having leads for mounting to a surface of a pr...
- Patent number 5,067,007
- Issue date Nov 19, 1991
- Hitachi, Ltd.
- Kanji Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Service temperature connector and packaging structure of semiconduc...
- Patent number 4,950,173
- Issue date Aug 21, 1990
- Hitachi, Ltd.
- Tetsuro Minemura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED PLANAR SMA DEVICE AND METHOD
- Publication number 20240117795
- Publication date Apr 11, 2024
- Stardust Holdings, LLC d/b/a/ XTERRA Space
- Alex Weston Kuehn
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Application
THERMALLY ACTIVATED RETRACTABLE EMC PROTECTION
- Publication number 20230371214
- Publication date Nov 16, 2023
- International Business Machines Corporation
- John S. Werner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interface for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180332701
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interface for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180324945
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adaptive Composite Structure Using Shape Memory Alloys
- Publication number 20180243972
- Publication date Aug 30, 2018
- The Boeing Company
- Jeffery L. Marcoe
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Ball Grid Array Rework
- Publication number 20180190609
- Publication date Jul 5, 2018
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONVENIENT PORTABLE INPUT DEVICE
- Publication number 20140340826
- Publication date Nov 20, 2014
- Ching-Hang Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STITCHED COMPONENTS OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE
- Publication number 20100262214
- Publication date Oct 14, 2010
- National ICT Australia Limited
- David Robinson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Circuit protection element and a circuit board with the circuit pro...
- Publication number 20090002962
- Publication date Jan 1, 2009
- Jung-Hui Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flat Substrate Having an Electrically Conductive Structure
- Publication number 20080315941
- Publication date Dec 25, 2008
- Fraunhofer-Gesellschaft zur Forderung derangewandten Forschung e.V.
- Heinz Kaufmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOUNTING BOARD, HEIGHT ADJUSTING APPARATUS AND MOUNTING METHOD
- Publication number 20080158843
- Publication date Jul 3, 2008
- Fujitsu Limited
- Tsuyoshi SO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder foams, nano-porous solders, foamed-solder bumps in chip pack...
- Publication number 20070152016
- Publication date Jul 5, 2007
- Intel Corporation
- Heeman Choe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FABRICATING AND USING SHAPED SPRINGS
- Publication number 20070054513
- Publication date Mar 8, 2007
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
Over-temperature protection devices, applications and circuits
- Publication number 20060273876
- Publication date Dec 7, 2006
- Timothy E. Pachla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for attaching an IC package to a PCB assembly
- Publication number 20060263929
- Publication date Nov 23, 2006
- Texas Instruments Inc.
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fastener for assembly and disassembly
- Publication number 20060019510
- Publication date Jan 26, 2006
- Telezygology, Inc.
- Dickory Rudduck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bolt assembly, method and device for release, and computer system
- Publication number 20060002783
- Publication date Jan 5, 2006
- Dickory Rudduck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible print circuit, wire harness, and wiring structure using sh...
- Publication number 20040248434
- Publication date Dec 9, 2004
- Fuji Photo Film Co., Ltd.
- Yuichi Fujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of fabricating and using shaped springs
- Publication number 20040038560
- Publication date Feb 26, 2004
- FormFactor, Inc.
- Gaetan L. Mathieu
- G01 - MEASURING TESTING
Information Patent Application
Retainer for circuit board assembly and method for using the same
- Publication number 20040011557
- Publication date Jan 22, 2004
- Christopher D. Combs
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Zero insertion force heat-activated retention pin
- Publication number 20030216066
- Publication date Nov 20, 2003
- George Arrigotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of surface mounting a connector and connector
- Publication number 20020076979
- Publication date Jun 20, 2002
- Hideaki Terauchi
- H01 - BASIC ELECTRIC ELEMENTS

Shape memory alloy [SMA]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermally activated retractable EMC protection

Thermally activated retractable EMC protection

Adaptive composite structure using shape memory alloys

Self-transforming flexible film and method for preparing same

Shape-memory alloy connector for plated through-hole

Electromagnetic shielding of heat sinks with shape-memory alloy gro...

Ball grid array rework

Interface for limiting substrate damage due to discrete failure

Interface for limiting substrate damage due to discrete failure

Interface for limiting substrate damage due to discrete failure

Adaptive composite structure using shape memory alloys

Ball grid array rework

Stitched components of an active implantable medical device

Circuit protection element and a circuit board with the circuit pro...

Mounting board, height adjusting apparatus and mounting method

Flat substrate having an electrically conductive structure

Solder foams, nano-porous solders, foamed-solder bumps in chip pack...

Method and apparatus for attaching an IC package to a PCB assembly

Methods of fabricating and using shaped springs

Flexible print circuit, wire harness, and wiring structure using sh...

Retainer for circuit board assembly and method for using the same

Zero insertion force heat-activated retention pin

Method of surface mounting a connector and connector

Method of fabricating shaped springs

Method for the making soldering flux and resulting weld joint

Method of surface mounting a connector

Method for reworking a multi-layer circuit board using a shape memo...

Contact device for an electrical component and method for manufacture

Semiconductor device having leads for mounting to a surface of a pr...

Service temperature connector and packaging structure of semiconduc...

Patents Applicationslast 30 patents

INTEGRATED PLANAR SMA DEVICE AND METHOD

THERMALLY ACTIVATED RETRACTABLE EMC PROTECTION

Interface for Limiting Substrate Damage Due to Discrete Failure

Interface for Limiting Substrate Damage Due to Discrete Failure

Adaptive Composite Structure Using Shape Memory Alloys

Ball Grid Array Rework

CONVENIENT PORTABLE INPUT DEVICE

STITCHED COMPONENTS OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE

Circuit protection element and a circuit board with the circuit pro...

Flat Substrate Having an Electrically Conductive Structure

MOUNTING BOARD, HEIGHT ADJUSTING APPARATUS AND MOUNTING METHOD

Solder foams, nano-porous solders, foamed-solder bumps in chip pack...

METHODS OF FABRICATING AND USING SHAPED SPRINGS

Over-temperature protection devices, applications and circuits

Method and apparatus for attaching an IC package to a PCB assembly

Fastener for assembly and disassembly

Bolt assembly, method and device for release, and computer system

Flexible print circuit, wire harness, and wiring structure using sh...

Methods of fabricating and using shaped springs

Retainer for circuit board assembly and method for using the same

Zero insertion force heat-activated retention pin

Method of surface mounting a connector and connector