Shape of an individual particle

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CPC
H05K2201/0242

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0242Shape of an individual particle

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electroconductive particles and signal-transmitting connector havin...
- Patent number 11,763,959
- Issue date Sep 19, 2023
- TSE CO., LTD.
- Chang Su Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Halogen-free epoxy resin composition, prepreg, laminate and printed...
- Patent number 10,400,099
- Issue date Sep 3, 2019
- SHENGYI TECHNOLOGY CO., LTD.
- Hui Li
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board with catalytic adhesive
- Patent number 10,306,756
- Issue date May 28, 2019
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board apparatus and method
- Patent number 9,942,981
- Issue date Apr 10, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate apparatus and method
- Patent number 9,706,650
- Issue date Jul 11, 2017
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package
- Patent number 9,392,701
- Issue date Jul 12, 2016
- Sae Magnetics (H.K.) Ltd.
- Akio Nakao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240324103
- Publication date Sep 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268021
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240237204
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Keisuke SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND RESIN COATED COPPER...
- Publication number 20240043654
- Publication date Feb 8, 2024
- LG Innotek Co., Ltd.
- Byeong Kyun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Coreless Component Carrier With Embedded Components
- Publication number 20230128938
- Publication date Apr 27, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Allen ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE PARTICLES AND SIGNAL-TRANSMITTING CONNECTOR HAVIN...
- Publication number 20220005626
- Publication date Jan 6, 2022
- TSE CO., LTD.
- Chang Su Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE
- Publication number 20210267054
- Publication date Aug 26, 2021
- FUJI CORPORATION
- Tasuku TAKEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARD INCLUDING...
- Publication number 20200325304
- Publication date Oct 15, 2020
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Catalytic Laminate Apparatus and Method
- Publication number 20190239349
- Publication date Aug 1, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20190023960
- Publication date Jan 24, 2019
- POLYTRONICS TECHNOLOGY CORP.
- KUO HSUN CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit board with Catalytic Adhesive
- Publication number 20180168036
- Publication date Jun 14, 2018
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Apparatus and Method
- Publication number 20180054889
- Publication date Feb 22, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed...
- Publication number 20170298218
- Publication date Oct 19, 2017
- Shengyi Technology Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR PACKAGING AND PRINTED CIRCUIT BOARD USING THE...
- Publication number 20160353570
- Publication date Dec 1, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Sung Chul LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shape of an individual particle

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electroconductive particles and signal-transmitting connector havin...

Circuit board using non-catalytic laminate with catalytic adhesive...

Catalytic circuit board with traces and vias

Halogen-free epoxy resin composition, prepreg, laminate and printed...

Circuit board with catalytic adhesive

Circuit board apparatus and method

Catalytic laminate apparatus and method

Electronic component package

Patents Applicationslast 30 patents

WIRING SUBSTRATE

WIRING SUBSTRATE

PRINTED WIRING BOARD

WIRING SUBSTRATE

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND RESIN COATED COPPER...

Coreless Component Carrier With Embedded Components

ELECTROCONDUCTIVE PARTICLES AND SIGNAL-TRANSMITTING CONNECTOR HAVIN...

CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE

Circuit Board using non-catalytic laminate with catalytic adhesive...

THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARD INCLUDING...

Catalytic Laminate Apparatus and Method

THERMALLY CONDUCTIVE BOARD

Circuit board with Catalytic Adhesive

Circuit Board Apparatus and Method

Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed...

RESIN COMPOSITION FOR PACKAGING AND PRINTED CIRCUIT BOARD USING THE...