Shape of non-curved single flat metallic pad, land or exposed part thereof Shape of electrode of leadless component

Industry

CPC
H05K2201/09381

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09381Shape of non-curved single flat metallic pad, land or exposed part thereof Shape of electrode of leadless component

Industries

Patents Grantslast 30 patents

Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board for galvanic effect reduction
- Patent number 11,924,964
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor component and inductor component mounting substrate
- Patent number 11,869,688
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Rikiya Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection device
- Patent number 11,818,848
- Issue date Nov 14, 2023
- Japan Display Inc.
- Koji Ishizaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector attached multi-conductor cable
- Patent number 11,784,438
- Issue date Oct 10, 2023
- Sumitomo Electric Industries, Ltd.
- Naoshige Yokota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,690,174
- Issue date Jun 27, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component and board having the same mounted thereon
- Patent number 11,665,825
- Issue date May 30, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 11,612,057
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light device, headlight and method
- Patent number 11,499,688
- Issue date Nov 15, 2022
- Osram GmbH
- Markus Stange
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 11,470,720
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land for surface mounted component
- Patent number 11,399,431
- Issue date Jul 26, 2022
- Sony Corporation
- Norikimi Moriuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Detection device
- Patent number 11,330,720
- Issue date May 10, 2022
- Japan Display Inc.
- Koji Ishizaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin substrate and method for producing resin substrate
- Patent number 11,277,919
- Issue date Mar 15, 2022
- Murata Manufacturing Co., Ltd.
- Shinichi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,259,411
- Issue date Feb 22, 2022
- Ibiden Co., Ltd.
- Katsuyoshi Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flex on board anisotropic conductive adhesive interconnection
- Patent number 11,259,414
- Issue date Feb 22, 2022
- Huawei Technologies Co., Ltd.
- David Powney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and method for manufacturing the same
- Patent number 11,234,331
- Issue date Jan 25, 2022
- HongQiSheng Precision Electronics (QingHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,178,760
- Issue date Nov 16, 2021
- Kabushiki Kaisha Toshiba
- Kiyokazu Ishizaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with SA/BW ratio and board having the same mou...
- Patent number 11,166,376
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,083,086
- Issue date Aug 3, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,081,503
- Issue date Aug 3, 2021
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate and electric element
- Patent number 11,064,606
- Issue date Jul 13, 2021
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 10,993,321
- Issue date Apr 27, 2021
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spoked solder pad to improve solderability and self-alignment of in...
- Patent number 10,957,663
- Issue date Mar 23, 2021
- Myron Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
- Patent number 10,939,551
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a pressure sensor with an opening in the e...
- Patent number 10,883,889
- Issue date Jan 5, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hee-kwon Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coupled via structure, circuit board having the coupled via structu...
- Patent number 10,887,980
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Dong-Yoon Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Medical circuit board and medical device
- Patent number 10,856,723
- Issue date Dec 8, 2020
- Sony Olympus Medical Solutions Inc.
- Masahiro Hagihara
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flexible printed circuit to mitigate cracking at through-holes
- Patent number 10,798,819
- Issue date Oct 6, 2020
- CommScope, Inc. of North Carolina
- Brian J. Fitzpatrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, electronic device, and design support method of substrate
- Patent number 10,777,497
- Issue date Sep 15, 2020
- Fujitsu Limited
- Takahito Takemoto
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
- Publication number 20240136740
- Publication date Apr 25, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240130042
- Publication date Apr 18, 2024
- Murata Manufacturing Co., Ltd.
- Kumiko ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME
- Publication number 20240074058
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- JAEKWANG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240040695
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Tomoya OOSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230413425
- Publication date Dec 21, 2023
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION
- Publication number 20230328873
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230309223
- Publication date Sep 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- YOUNGJIN PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...
- Publication number 20230284382
- Publication date Sep 7, 2023
- KIOXIA Corporation
- Kodai Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE AND POWER DEVICE
- Publication number 20230036995
- Publication date Feb 2, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Xiaojing LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...
- Publication number 20220408560
- Publication date Dec 22, 2022
- SONY GROUP CORPORATION
- Koji AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE
- Publication number 20220311189
- Publication date Sep 29, 2022
- Sumitomo Electric Industries, Ltd.
- Naoshige YOKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20220248575
- Publication date Aug 4, 2022
- Hitachi Astemo, Ltd.
- Masahiro TOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE
- Publication number 20220130600
- Publication date Apr 28, 2022
- Murata Manufacturing Co., Ltd.
- Rikiya SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20220095451
- Publication date Mar 24, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20220030719
- Publication date Jan 27, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND FOR SURFACE MOUNTED COMPONENT
- Publication number 20210307166
- Publication date Sep 30, 2021
- SONY CORPORATION
- NORIKIMI MORIUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20210153350
- Publication date May 20, 2021
- IBIDEN CO., LTD.
- Katsuyoshi YAMASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SUBSTRATE AND METHOD FOR PRODUCING RESIN SUBSTRATE
- Publication number 20210120678
- Publication date Apr 22, 2021
- Murata Manufacturing Co., Ltd.
- Shinichi ARAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20210084760
- Publication date Mar 18, 2021
- Kabushiki Kaisha Toshiba
- Kiyokazu Ishizaki
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
- Publication number 20210076499
- Publication date Mar 11, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEX ON BOARD ANISOTROPIC CONDUCTIVE ADHESIVE INTERCONNECTION
- Publication number 20200389982
- Publication date Dec 10, 2020
- Huawei Technologies Co., Ltd
- David POWNEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COUPLED VIA STRUCTURE, CIRCUIT BOARD HAVING THE COUPLED VIA STRUCTU...
- Publication number 20200178386
- Publication date Jun 4, 2020
- Samsung Electronics Co., Ltd.
- Dong-Yoon SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20200029431
- Publication date Jan 23, 2020
- NGK SPARK PLUG CO., LTD.
- Takahiro HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20190333939
- Publication date Oct 31, 2019
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...
- Publication number 20190306976
- Publication date Oct 3, 2019
- OSRAM SYLVANIA INC.
- Sridharan Venk
- F21 - LIGHTING
Information Patent Application
SURFACE MOUNT TECHNOLOGY (SMT) PAD DESIGN FOR NEXT GENERATION SPEEDS
- Publication number 20190289714
- Publication date Sep 19, 2019
- DELL PRODUCTS, L.P.
- VIJENDERA KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD PAD MOUNTING ORIENTATION SYSTEM
- Publication number 20190274213
- Publication date Sep 5, 2019
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE INCLUDING A PRESSURE SENSOR WITH AN OPENING IN THE E...
- Publication number 20190265113
- Publication date Aug 29, 2019
- SAMSUNG DISPLAY CO., LTD.
- Hee-kwon LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT AND DISPLAY APPARATUS
- Publication number 20190208635
- Publication date Jul 4, 2019
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Lingguo WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shape of non-curved single flat metallic pad, land or exposed part thereof Shape of electrode of leadless component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Array substrate and method of mounting integrated circuit using the...

Printed circuit board for galvanic effect reduction

Inductor component and inductor component mounting substrate

Detection device

Connector attached multi-conductor cable

Display device and manufacturing method thereof

Electronic component and board having the same mounted thereon

Opening in the pad for bonding integrated passive device in InFO pa...

Light device, headlight and method

Opening in the pad for bonding integrated passive device in InFO pa...

Land for surface mounted component

Detection device

Resin substrate and method for producing resin substrate

Wiring substrate and method for manufacturing wiring substrate

Flex on board anisotropic conductive adhesive interconnection

Multilayer printed circuit board and method for manufacturing the same

Printed circuit board

Configurable substrate and systems

Electronic component with SA/BW ratio and board having the same mou...

Printed wiring board and method for manufacturing printed wiring board

Array substrate and method of mounting integrated circuit using the...

Multilayer substrate and electric element

Wiring substrate

Spoked solder pad to improve solderability and self-alignment of in...

Opening in the pad for bonding integrated passive device in InFO pa...

Display device including a pressure sensor with an opening in the e...

Coupled via structure, circuit board having the coupled via structu...

Medical circuit board and medical device

Flexible printed circuit to mitigate cracking at through-holes

Substrate, electronic device, and design support method of substrate

Patents Applicationslast 30 patents

CONNECTING ARRANGEMENT

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE

CIRCUIT BOARD

MODULE BOARD AND SEMICONDUCTOR MODULE HAVING THE SAME

ELECTRONIC COMPONENT

CIRCUIT BOARD

PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION

CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURI...

POWER SUPPLY MODULE AND POWER DEVICE

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...

CONNECTOR ATTACHED MULTI-CONDUCTOR CABLE

ELECTRONIC CONTROL DEVICE

INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE

METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

LAND FOR SURFACE MOUNTED COMPONENT

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

RESIN SUBSTRATE AND METHOD FOR PRODUCING RESIN SUBSTRATE

PRINTED CIRCUIT BOARD

ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON

FLEX ON BOARD ANISOTROPIC CONDUCTIVE ADHESIVE INTERCONNECTION

COUPLED VIA STRUCTURE, CIRCUIT BOARD HAVING THE COUPLED VIA STRUCTU...

WIRING SUBSTRATE

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

CONDUCTOR PAD FOR FLEXIBLE CIRCUITS AND FLEXIBLE CIRCUIT INCORPORAT...

SURFACE MOUNT TECHNOLOGY (SMT) PAD DESIGN FOR NEXT GENERATION SPEEDS

CIRCUIT BOARD PAD MOUNTING ORIENTATION SYSTEM

DISPLAY DEVICE INCLUDING A PRESSURE SENSOR WITH AN OPENING IN THE E...

CIRCUIT BOARD, ELECTRONIC COMPONENT AND DISPLAY APPARATUS