Shaping of the substrate

Industry

CPC
H05K3/0014

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0014Shaping of the substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multilayer laminate
- Patent number 12,185,474
- Issue date Dec 31, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart connector and method of manufacturing same using an applicati...
- Patent number 12,176,659
- Issue date Dec 24, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for shaping flexible circuits to improve routin...
- Patent number 12,156,342
- Issue date Nov 26, 2024
- Aptiv Technologies AG
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 12,155,367
- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,137,523
- Issue date Nov 5, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded article, electrical product and method for producing molded...
- Patent number 12,122,078
- Issue date Oct 22, 2024
- Nissha Co., Ltd.
- Seiichi Yamazaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,096,562
- Issue date Sep 17, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrically functional polymer microneedle array
- Patent number 12,070,307
- Issue date Aug 27, 2024
- International Business Machines Corporation
- Neil Ebejer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmoulded printed electronic parts and methods for the manufactur...
- Patent number 12,017,392
- Issue date Jun 25, 2024
- National Research Council of Canada
- Paul Arthur Trudeau
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Interface assembly and method for manufacturing interface assembly
- Patent number 12,004,299
- Issue date Jun 4, 2024
- TACTOTEK OY
- Mikko Heikkinen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing wiring board with a meandering shape section
- Patent number 11,968,777
- Issue date Apr 23, 2024
- Dai Nippon Printing Co., Ltd.
- Kenichi Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board assembly
- Patent number 11,956,894
- Issue date Apr 9, 2024
- SIGNIFY HOLDING, B.V.
- Pieter Joseph Clara Van Der Wel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 11,950,360
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making metal patterns on flexible substrate
- Patent number 11,950,372
- Issue date Apr 2, 2024
- 3M INNOVATION PROPERTIES
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical chips mounted on a deformed carrier
- Patent number 11,942,572
- Issue date Mar 26, 2024
- OSRAM OLED GmbH
- Siegfried Herrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device manufacturing apparatus with rotator and display dev...
- Patent number 11,937,490
- Issue date Mar 19, 2024
- Samsung Display Co., Ltd.
- Myung Gil Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded article and method for producing same
- Patent number 11,877,386
- Issue date Jan 16, 2024
- Nissha Co., Ltd.
- Yasuisa Takinishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electrical element, method of preparing an electrical element for a...
- Patent number 11,864,321
- Issue date Jan 2, 2024
- TE Connectivity Germany GmbH
- Rudi Blumenschein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 11,856,693
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Embossed smart functional premium natural leather
- Patent number 11,827,143
- Issue date Nov 28, 2023
- Honda Motor Co., Ltd.
- Patricia A. Scott
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of manufacturing package unit, package unit, electronic modu...
- Patent number 11,830,722
- Issue date Nov 28, 2023
- Canon Kabushiki Kaisha
- Koichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module having circuit board, molded base, and optical lens,...
- Patent number 11,785,325
- Issue date Oct 10, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 11,778,737
- Issue date Oct 3, 2023
- Dai Nippon Printing Co., Ltd.
- Naoko Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive particles and signal-transmitting connector havin...
- Patent number 11,763,959
- Issue date Sep 19, 2023
- TSE CO., LTD.
- Chang Su Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240381533
- Publication date Nov 14, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240373559
- Publication date Nov 7, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY
- Publication number 20240284598
- Publication date Aug 22, 2024
- TactoTek Oy
- Mikko HEIKKINEN
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240284604
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myungju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240237224
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- SHINYA ONOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240237233
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...
- Publication number 20240227258
- Publication date Jul 11, 2024
- Nissha Co., Ltd.
- Yasuisa TAKINISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE
- Publication number 20240206076
- Publication date Jun 20, 2024
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR PRODUCING CIRCUIT BOARDS WITH PERFORATED SHAP...
- Publication number 20240164023
- Publication date May 16, 2024
- JUMATECH GMBH
- Markus WÖLFEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240164027
- Publication date May 16, 2024
- Innolux Corporation
- Ying-Jen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20240155772
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- DONGWOO KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...
- Publication number 20240155929
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Myung Gil CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240138077
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...
- Publication number 20240131758
- Publication date Apr 25, 2024
- Nissha Co., Ltd.
- Yasuisa TAKINISHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240138072
- Publication date Apr 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- SHINYA ONOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
- Publication number 20240098902
- Publication date Mar 21, 2024
- ZTE Corporation
- Da CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING TRANSIENT ELECTRONICS
- Publication number 20240080991
- Publication date Mar 7, 2024
- Accenture Global Solutions Limited
- Tingyu Cheng
- A23 - FOODS OR FOODSTUFFS THEIR TREATMENT, NOT COVERED BY OTHER CLASSES
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...
- Publication number 20240074047
- Publication date Feb 29, 2024
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...
- Publication number 20240064908
- Publication date Feb 22, 2024
- Aptiv Technologies Limited
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Application
MOLDED ARTICLE, ELECTRICAL PRODUCT AND METHOD FOR PRODUCING MOLDED...
- Publication number 20240051202
- Publication date Feb 15, 2024
- Nissha Co., Ltd.
- Seiichi YAMAZAKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD OF MANUFACTURING IMAGE PIC...
- Publication number 20240040224
- Publication date Feb 1, 2024
- OLYMPUS MEDICAL SYSTEMS CORP.
- Junya YAMADA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT FORMING METHOD
- Publication number 20240023249
- Publication date Jan 18, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE MOLDING SYSTEM, METHOD FOR CONTROLLING LAMINATE MOLDING SY...
- Publication number 20230330898
- Publication date Oct 19, 2023
- The Japan Steel Works, Ltd.
- Takayuki YAMAMOTO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONICS PACKAGING FOR MOVING PLATFORMS
- Publication number 20230328888
- Publication date Oct 12, 2023
- Simmonds Precision Products, Inc.
- Gary Willenbring
- F42 - AMMUNITION BLASTING
Information Patent Application
A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...
- Publication number 20230269884
- Publication date Aug 24, 2023
- Fraser Murray SHAW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...
- Publication number 20230223324
- Publication date Jul 13, 2023
- Regents of the University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ELECTRICAL CIRCUITRY ON FILLED ORGANIC POLYMERS
- Publication number 20230225058
- Publication date Jul 13, 2023
- DUPONT SAFETY & CONSTRUCTION, INC.
- Timothy Scott Wyant
- H01 - BASIC ELECTRIC ELEMENTS

Shaping of the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with multilayer laminate

Smart connector and method of manufacturing same using an applicati...

Systems and methods for shaping flexible circuits to improve routin...

Method for manufacturing ceramic substrate and ceramic substrate

Wiring structure and method of manufacturing the same, semiconducto...

Interface assembly and method for manufacturing interface assembly

Patterned article including electrically conductive elements

Molded article, electrical product and method for producing molded...

Panel molded electronic assemblies with multi-surface conductive co...

Interface assembly and method for manufacturing interface assembly

Electrically functional polymer microneedle array

Laminated component carrier with a thermoplastic structure

Patterned conductive article

Overmoulded printed electronic parts and methods for the manufactur...

Interface assembly and method for manufacturing interface assembly

Method for manufacturing wiring board with a meandering shape section

Flexible printed circuit board assembly

Method for manufacturing ceramic substrate and ceramic substrate

Methods of making metal patterns on flexible substrate

Optical chips mounted on a deformed carrier

Display device manufacturing apparatus with rotator and display dev...

Injection molded article and method for producing same

Electrical element, method of preparing an electrical element for a...

Resin multilayer substrate and method for manufacturing resin multi...

Three-dimensional molded circuit component

Embossed smart functional premium natural leather

Method of manufacturing package unit, package unit, electronic modu...

Camera module having circuit board, molded base, and optical lens,...

Wiring board and method for manufacturing wiring board

Electroconductive particles and signal-transmitting connector havin...

Patents Applicationslast 30 patents

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

PATTERNED CONDUCTIVE ARTICLE

INTERFACE ASSEMBLY AND METHOD FOR MANUFACTURING INTERFACE ASSEMBLY

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING ELECTRONIC DEVICE

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...

METHODS OF MAKING METAL PATTERNS ON FLEXIBLE SUBSTRATE

METHOD AND SYSTEM FOR PRODUCING CIRCUIT BOARDS WITH PERFORATED SHAP...

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

APPARATUS FOR MANUFACTURING DISPLAY DEVICE

DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTU...

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

ELECTRONIC-COMPONENT-ATTACHED RESIN HOUSING AND METHOD FOR MANUFACT...

METHOD OF MANUFACTURING ELECTRONIC DEVICE

THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD

METHOD OF MANUFACTURING TRANSIENT ELECTRONICS

SUBSTRATES WITH CONTINUOUS SLOT VIAS

CONDUCTIVE BUMP STRUCTURE OF CIRCUIT BOARD AND MANUFACTURING METHOD...

SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTIN...

MOLDED ARTICLE, ELECTRICAL PRODUCT AND METHOD FOR PRODUCING MOLDED...

IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD OF MANUFACTURING IMAGE PIC...

CIRCUIT FORMING METHOD

LAMINATE MOLDING SYSTEM, METHOD FOR CONTROLLING LAMINATE MOLDING SY...

ELECTRONICS PACKAGING FOR MOVING PLATFORMS

A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...

METHOD FOR PRODUCING ELECTRICAL CIRCUITRY ON FILLED ORGANIC POLYMERS