Signal conductors in same plane as power plane

Industry

CPC
H05K2201/09336

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09336Signal conductors in same plane as power plane

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 11,982,704
- Issue date May 14, 2024
- E Ink Holdings Inc.
- Ruei-Huan Rao
- G01 - MEASURING TESTING
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,626,673
- Issue date Apr 11, 2023
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device
- Patent number 11,509,236
- Issue date Nov 22, 2022
- Mitsubishi Electric Corporation
- Ryoma Hayashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board structure for increasing isolation
- Patent number 11,419,206
- Issue date Aug 16, 2022
- Wistron NeWeb Corporation
- Yuan-Chia Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic (EM) field rotation for interconnection between chi...
- Patent number 11,406,006
- Issue date Aug 2, 2022
- QUALCOMM Incorporated
- Xiaoming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 10,998,653
- Issue date May 4, 2021
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication module packaging
- Patent number 10,952,312
- Issue date Mar 16, 2021
- II-VI DELAWARE, INC.
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency electronic device and manufacturing method thereof
- Patent number 10,709,012
- Issue date Jul 7, 2020
- Innolux Corporation
- Yan-Syun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit assembly with increased mounting area
- Patent number 10,652,994
- Issue date May 12, 2020
- AutoNetworks Technologies, Ltd.
- Arinobu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed wiring board, and connection structure of multil...
- Patent number 10,548,220
- Issue date Jan 28, 2020
- Hosiden Corporation
- Hayato Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier having a conducting path and an electric shield
- Patent number 9,999,120
- Issue date Jun 12, 2018
- Siemens Aktiengesellschaft
- Florian Poprawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, display apparatus having a printed circuit b...
- Patent number 9,930,770
- Issue date Mar 27, 2018
- Samsung Display Co., Ltd.
- Kwan-Ho Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed circuit boards having profiled conductive layer and methods...
- Patent number 9,844,136
- Issue date Dec 12, 2017
- General Electric Company
- Robert Joseph Roessler
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Signal transmission cable
- Patent number 9,748,707
- Issue date Aug 29, 2017
- Sony Corporation
- Akira Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite module
- Patent number 9,686,858
- Issue date Jun 20, 2017
- Murata Manufacturing Co., Ltd.
- Hiromichi Kitajima
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Stack structure of high frequency printed circuit board
- Patent number 9,686,863
- Issue date Jun 20, 2017
- Kuang Ying Computer Equipment Co., Ltd.
- Hsuan-Ho Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,681,554
- Issue date Jun 13, 2017
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB based semiconductor package having integrated electrical functi...
- Patent number 9,629,246
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Qianli Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,620,447
- Issue date Apr 11, 2017
- RENESAS ELECTRONICS CORPORATION
- Shuuichi Kariyazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing design for high speed input/output links
- Patent number 9,622,339
- Issue date Apr 11, 2017
- Intel Corporation
- Zhiguo Qian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency signal line
- Patent number 9,583,809
- Issue date Feb 28, 2017
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency signal line
- Patent number 9,583,810
- Issue date Feb 28, 2017
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,572,246
- Issue date Feb 14, 2017
- Japan Aviation Electronics Industry, Limited
- Yukitaka Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method therefor
- Patent number 9,565,757
- Issue date Feb 7, 2017
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit member with reference circuit
- Patent number 9,462,676
- Issue date Oct 4, 2016
- Molex, LLC
- Kent E. Regnier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 9,444,160
- Issue date Sep 13, 2016
- Hirose Electric Co., Ltd.
- Nobuhiro Tamai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 9,445,492
- Issue date Sep 13, 2016
- Mediatek Inc.
- Nan-Jang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Print circuit board and electronic device using the same
- Patent number 9,426,881
- Issue date Aug 23, 2016
- Canon Kabushiki Kaisha
- Koji Ishikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component housing package and electronic apparatus
- Patent number 9,386,687
- Issue date Jul 5, 2016
- KYOCERA Corporation
- Mahiro Tsujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD
- Publication number 20230380075
- Publication date Nov 23, 2023
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC (EM) FIELD ROTATION FOR INTERCONNECTION BETWEEN CHI...
- Publication number 20220192006
- Publication date Jun 16, 2022
- QUALCOMM Incorporated
- Xiaoming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE FOR INCREASING ISOLATION
- Publication number 20220159823
- Publication date May 19, 2022
- WISTRON NEWEB CORPORATION
- YUAN-CHIA HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20210318374
- Publication date Oct 14, 2021
- E Ink Holdings Inc.
- Ruei-Huan RAO
- G01 - MEASURING TESTING
Information Patent Application
HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200281068
- Publication date Sep 3, 2020
- InnoLux Corporation
- Yan-Syun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200084879
- Publication date Mar 12, 2020
- Toshiba Memory Corporation
- Satoru FUKUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20180310410
- Publication date Oct 25, 2018
- AUTONETWORKS TECHNOLOGIES, LTD.
- Arinobu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY APPARATUS HAVING A PRINTED CIRCUIT B...
- Publication number 20170042020
- Publication date Feb 9, 2017
- SAMSUNG DISPLAY CO., LTD.
- Kwan-Ho KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CABLE ASSEMBLY WITH MULTI-LAYER CIRCUIT MEMBER
- Publication number 20160233616
- Publication date Aug 11, 2016
- Molex, LLC
- Kent E. REGNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES AND METHODS OF FABRICATING THE SAME
- Publication number 20140361437
- Publication date Dec 11, 2014
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED PLUG CONNECTOR HAVING IMPROVED HIGH FREQUENCY PERFORMANCE
- Publication number 20140349496
- Publication date Nov 27, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- JIAN-JUN ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS
- Publication number 20140345929
- Publication date Nov 27, 2014
- Mahiro Tsujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRIC MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20140345912
- Publication date Nov 27, 2014
- ERNI Production GmbH & Co. KG
- Bernd Eifer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITIVE BLIND-MATE MODULE INTERCONNECTION
- Publication number 20140292451
- Publication date Oct 2, 2014
- Martin Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION CABLE
- Publication number 20140235102
- Publication date Aug 21, 2014
- SONY CORPORATION
- Akira Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT SUBSTRATE
- Publication number 20140133114
- Publication date May 15, 2014
- Taiyo Yuden Co., Ltd.
- Tetsuo Saji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING DESIGN FOR HIGH SPEED INPUT/OUTPUT LINKS
- Publication number 20140071646
- Publication date Mar 13, 2014
- Zhiguo Qian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT LAYOUT METHOD AND ASSOCIATED PRINTED CIRCUIT BOARD
- Publication number 20140054066
- Publication date Feb 27, 2014
- Mstar Semiconductor, Inc.
- Tien Hua Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT SUBSTRATE HAVING NOISE SUPPRESSION STRUCTURE
- Publication number 20140049343
- Publication date Feb 20, 2014
- NEC Corporation
- Jun Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
- Publication number 20130175077
- Publication date Jul 11, 2013
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOISE FILTER AND TRANSMISSION APPARATUS
- Publication number 20130161084
- Publication date Jun 27, 2013
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASYMMETRICAL MULTILAYER SUBSTRATE, RF MODULE, AND METHOD FOR MANUFA...
- Publication number 20130106528
- Publication date May 2, 2013
- Samsung Electro-mechanics Co., Ltd.
- Romero Christian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20130062778
- Publication date Mar 14, 2013
- Shinko Electric Industries Co., Ltd.
- Tomoharu Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY APPARATUS HAVING A PRINTED CIRCUIT B...
- Publication number 20120285009
- Publication date Nov 15, 2012
- Samsung Electronics Co., Ltd.
- Kwan-Ho KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CIRCUIT MEMBER AND ASSEMBLY THEREFOR
- Publication number 20120282807
- Publication date Nov 8, 2012
- Molex Incorporated
- Kent E. Regnier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTI-LAYER CIRCUIT MEMBER WITH REFERENCE CIRCUIT
- Publication number 20120280766
- Publication date Nov 8, 2012
- Molex Incorporated
- Kent E. Regnier
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
FILTER CIRCUIT AND METHOD OF TUNING FILTER CIRCUIT
- Publication number 20120212305
- Publication date Aug 23, 2012
- John Mezzalingua Associates, Inc.
- Steven K. Shafer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Continuously Referencing Signals Over Multiple Layers in Laminate P...
- Publication number 20120174047
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Francesco Preda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120147580
- Publication date Jun 14, 2012
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20120111623
- Publication date May 10, 2012
- MEDIATEK INC.
- Nan-Jang Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Signal conductors in same plane as power plane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device

Edge connector, circuit board, and connector component

Edge connector, circuit board, and connector component

Power conversion device

Circuit board structure for increasing isolation

Electromagnetic (EM) field rotation for interconnection between chi...

Edge connector, circuit board, and connector component

Communication module packaging

High-frequency electronic device and manufacturing method thereof

Circuit assembly with increased mounting area

Multilayer printed wiring board, and connection structure of multil...

Circuit carrier having a conducting path and an electric shield

Printed circuit board, display apparatus having a printed circuit b...

Printed circuit boards having profiled conductive layer and methods...

Signal transmission cable

Composite module

Stack structure of high frequency printed circuit board

Printed circuit board

PCB based semiconductor package having integrated electrical functi...

Semiconductor device

Routing design for high speed input/output links

High-frequency signal line

High-frequency signal line

Printed wiring board

Electronic component and manufacturing method therefor

Multi-layer circuit member with reference circuit

Electrical connector

Printed circuit board

Print circuit board and electronic device using the same

Electronic component housing package and electronic apparatus

Patents Applicationslast 30 patents

CIRCUIT BOARD AND ELECTRONIC-COMPONENT-EQUIPPED CIRCUIT BOARD

ELECTROMAGNETIC (EM) FIELD ROTATION FOR INTERCONNECTION BETWEEN CHI...

CIRCUIT BOARD STRUCTURE FOR INCREASING ISOLATION

ELECTRONIC DEVICE

HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

CIRCUIT ASSEMBLY

PRINTED CIRCUIT BOARD, DISPLAY APPARATUS HAVING A PRINTED CIRCUIT B...

CABLE ASSEMBLY WITH MULTI-LAYER CIRCUIT MEMBER

PACKAGE SUBSTRATES AND METHODS OF FABRICATING THE SAME

HIGH SPEED PLUG CONNECTOR HAVING IMPROVED HIGH FREQUENCY PERFORMANCE

ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC APPARATUS

ELECTRIC MULTILAYER PRINTED CIRCUIT BOARD

CAPACITIVE BLIND-MATE MODULE INTERCONNECTION

SIGNAL TRANSMISSION CABLE

MULTILAYER CIRCUIT SUBSTRATE

ROUTING DESIGN FOR HIGH SPEED INPUT/OUTPUT LINKS

CIRCUIT LAYOUT METHOD AND ASSOCIATED PRINTED CIRCUIT BOARD

CIRCUIT SUBSTRATE HAVING NOISE SUPPRESSION STRUCTURE

PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK

NOISE FILTER AND TRANSMISSION APPARATUS

ASYMMETRICAL MULTILAYER SUBSTRATE, RF MODULE, AND METHOD FOR MANUFA...

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD, DISPLAY APPARATUS HAVING A PRINTED CIRCUIT B...

MULTI-LAYER CIRCUIT MEMBER AND ASSEMBLY THEREFOR

MULTI-LAYER CIRCUIT MEMBER WITH REFERENCE CIRCUIT

FILTER CIRCUIT AND METHOD OF TUNING FILTER CIRCUIT

Continuously Referencing Signals Over Multiple Layers in Laminate P...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD