Solder compositions in relation to features of the printed circuit board or the mounting process

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CPC
H05K3/3463

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3463Solder compositions in relation to features of the printed circuit board or the mounting process

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode for low temperature applications
- Patent number 12,159,961
- Issue date Dec 3, 2024
- Azenta Life Sciences, Inc.
- Aarash Navabi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,070,800
- Issue date Aug 27, 2024
- Resonac Corporation
- Yoshinori Ejiri
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indium-based interface structures, apparatus, and methods for formi...
- Patent number 11,985,758
- Issue date May 14, 2024
- L3 Technologies, Inc.
- Matthew J. Spitzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, inverter, motor vehicle and method for produ...
- Patent number 11,956,895
- Issue date Apr 9, 2024
- ZF Friedrichshafen AG
- Michael Sperber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SMT process prediction tool for intelligent decision making on PCB...
- Patent number 11,825,606
- Issue date Nov 21, 2023
- Chengdu Aeronautic Polytechnic
- Xin Su
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Creating a standoff for a low-profile component without adding a pr...
- Patent number 11,812,562
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Phillip Isaacs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing solder product, solder, soldered component...
- Patent number 11,802,322
- Issue date Oct 31, 2023
- ISHIKAWA TECHNOLOGY LABORATORY CO., LTD.
- Hisao Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal composition, intermetallic compound member and joined body
- Patent number 11,746,398
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Masumi Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite wiring substrate and semiconductor device
- Patent number 11,706,877
- Issue date Jul 18, 2023
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint
- Patent number 11,628,519
- Issue date Apr 18, 2023
- Lenovo (Singapore) Pte. Ltd.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered transient liquid phase bonding
- Patent number 11,546,998
- Issue date Jan 3, 2023
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method relating to electrochemical migration
- Patent number 11,470,727
- Issue date Oct 11, 2022
- Jaguar Land Rover Limited
- Thomas Liedtke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device fabric integration
- Patent number 11,360,512
- Issue date Jun 14, 2022
- Intel Corporation
- Nadine L. Dabby
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder alloy for power devices and solder joint having a high curre...
- Patent number 11,331,759
- Issue date May 17, 2022
- Senju Metal Industry Co., Ltd.
- Hans-Jurgen Albrecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of installing electronic component, display device and displ...
- Patent number 11,112,658
- Issue date Sep 7, 2021
- LG Display Co., Ltd.
- Kaoru Furuta
- G02 - OPTICS
Information Patent Grant
Solder bonding method and solder joint
- Patent number 11,097,379
- Issue date Aug 24, 2021
- Lenovo (Singapore) Pte. Ltd.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free and antimony-free tin solder reliable at high temperatures
- Patent number 11,090,768
- Issue date Aug 17, 2021
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indium-based interface structures, apparatus, and methods for formi...
- Patent number 10,973,114
- Issue date Apr 6, 2021
- L3 Technologies, Inc.
- Matthew J. Spitzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder composition, electronic board, and bonding method
- Patent number 10,913,132
- Issue date Feb 9, 2021
- Tamura Corporation
- Nobuhiro Yamashita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device, display system, and method of installing electronic...
- Patent number 10,901,277
- Issue date Jan 26, 2021
- LG Display Co., Ltd.
- Kaoru Furuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding electronic component and method for manufacturin...
- Patent number 10,875,127
- Issue date Dec 29, 2020
- Nichia Corporation
- Teppei Kunimune
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transient liquid phase material bonding and sealing structures and...
- Patent number 10,840,108
- Issue date Nov 17, 2020
- Skyworks Solutions, Inc.
- Bradley Paul Barber
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device
- Patent number 10,818,432
- Issue date Oct 27, 2020
- TDK Corporation
- Norihisa Ando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, chip solder, solder paste, and solder joint
- Patent number 10,773,345
- Issue date Sep 15, 2020
- Senju Metal Industry Co., Ltd.
- Ken Tachibana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240172371
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- JIHYUN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTING METHOD FOR PREVENTING SOLDER CRACK FAILURE IN ELECTRONIC...
- Publication number 20240114631
- Publication date Apr 4, 2024
- SOLID STATE STORAGE TECHNOLOGY CORPORATION
- Tsung-Lung LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL AND METHOD FOR MANUFACTURING...
- Publication number 20240090127
- Publication date Mar 14, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yonglin CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL
- Publication number 20240075559
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT
- Publication number 20240002979
- Publication date Jan 4, 2024
- ISHIKAWA TECHNOLOGY LABORATORY CO., LTD.
- Hisao ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
- Publication number 20230330788
- Publication date Oct 19, 2023
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...
- Publication number 20230328895
- Publication date Oct 12, 2023
- MURATA MANUFACTURING CO., LTD.
- Takashi KITAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY SOLDER PAD TRIMMING
- Publication number 20230292447
- Publication date Sep 14, 2023
- International Business Machines Corporation
- Stanley Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20230262905
- Publication date Aug 17, 2023
- TDK Corporation
- Ryohei KASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20230180396
- Publication date Jun 8, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20230100601
- Publication date Mar 30, 2023
- TAMURA CORPORATION
- Sumire Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CREATING A STANDOFF FOR A LOW-PROFILE COMPONENT WITHOUT ADDING A PR...
- Publication number 20230067845
- Publication date Mar 2, 2023
- International Business Machines Corporation
- Phillip Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER MEMBER-EQUIPPED SUBSTRATE AND METHOD FOR MANUFACTURIN...
- Publication number 20220408545
- Publication date Dec 22, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Akira Haraguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20220361342
- Publication date Nov 10, 2022
- Shinko Electric Industries Co., Ltd.
- Shota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Control Device
- Publication number 20220295642
- Publication date Sep 15, 2022
- Hitachi Astemo, Ltd.
- Osamu IKEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMT PROCESS PREDICTION TOOL FOR INTELLIGENT DECISION MAKING ON PCB...
- Publication number 20220104410
- Publication date Mar 31, 2022
- Southwest Electronic Technology Research Institute (The Tenth Research Instit...
- Xin SU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220053647
- Publication date Feb 17, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinori EJIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT...
- Publication number 20220025484
- Publication date Jan 27, 2022
- ISHIKAWA TECHNOLOGY LABORATORY CO., LTD.
- Hisao ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, INVERTER, MOTOR VEHICLE AND METHOD FOR PRODU...
- Publication number 20220007505
- Publication date Jan 6, 2022
- ZF Friedrichshafen AG
- Michael SPERBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT
- Publication number 20210316406
- Publication date Oct 14, 2021
- LENOVO (SINGAPORE) PTE. LTD.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION
- Publication number 20210289636
- Publication date Sep 16, 2021
- Jaguar Land Rover Limited
- Thomas LIEDTKE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Indium-Based Interface Structures, Apparatus, And Methods For Formi...
- Publication number 20210219417
- Publication date Jul 15, 2021
- L3 Technologies, Inc.
- Matthew J. Spitzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING DIODE FOR LOW TEMPERATURE APPLICATIONS
- Publication number 20210135061
- Publication date May 6, 2021
- Abeyatech, LLC
- Aarash NAVABI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Solder compositions in relation to features of the printed circuit board or the mounting process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode for low temperature applications

Maintaining the shape of a circuit board

Connection structure and manufacturing method therefor

Electronic component and method for manufacturing electronic component

Electrical devices with electrodes on softening polymers and method...

Indium-based interface structures, apparatus, and methods for formi...

Printed circuit board, inverter, motor vehicle and method for produ...

Solder material

SMT process prediction tool for intelligent decision making on PCB...

Creating a standoff for a low-profile component without adding a pr...

Method for manufacturing solder product, solder, soldered component...

Metal composition, intermetallic compound member and joined body

Composite wiring substrate and semiconductor device

Solder joint

Electrical devices with electrodes on softening polymers and method...

Multilayered transient liquid phase bonding

Apparatus and method relating to electrochemical migration

Alternative compositions for high temperature soldering applications

Electronic device fabric integration

Solder alloy for power devices and solder joint having a high curre...

Method of installing electronic component, display device and displ...

Solder bonding method and solder joint

Lead-free and antimony-free tin solder reliable at high temperatures

Indium-based interface structures, apparatus, and methods for formi...

Solder composition, electronic board, and bonding method

Display device, display system, and method of installing electronic...

Method for bonding electronic component and method for manufacturin...

Transient liquid phase material bonding and sealing structures and...

Electronic device

Solder alloy, solder ball, chip solder, solder paste, and solder joint

Patents Applicationslast 30 patents

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

CIRCUIT BOARD AND MANUFACTURING METHOD

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD

PROTECTING METHOD FOR PREVENTING SOLDER CRACK FAILURE IN ELECTRONIC...

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

FLEXIBLE CIRCUIT BOARD, DISPLAY PANEL AND METHOD FOR MANUFACTURING...

SOLDER MATERIAL

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...

BALL GRID ARRAY SOLDER PAD TRIMMING

JOINT STRUCTURE

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

SOLDER COMPOSITION AND METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

CREATING A STANDOFF FOR A LOW-PROFILE COMPONENT WITHOUT ADDING A PR...

HEAT TRANSFER MEMBER-EQUIPPED SUBSTRATE AND METHOD FOR MANUFACTURIN...

COMPOSITE WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Electronic Control Device

SMT PROCESS PREDICTION TOOL FOR INTELLIGENT DECISION MAKING ON PCB...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT...

PRINTED CIRCUIT BOARD, INVERTER, MOTOR VEHICLE AND METHOD FOR PRODU...

SOLDER JOINT

APPARATUS AND METHOD RELATING TO ELECTROCHEMICAL MIGRATION

Indium-Based Interface Structures, Apparatus, And Methods For Formi...

LIGHT EMITTING DIODE FOR LOW TEMPERATURE APPLICATIONS