Solder foil, tape or wire

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CPC
H05K2203/0405

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0405Solder foil, tape or wire

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Sleeve soldering device and method of producing electronic device
- Patent number 11,696,411
- Issue date Jul 4, 2023
- Denso Corporation
- Hayato Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable mounting board
- Patent number 11,653,445
- Issue date May 16, 2023
- Murata Manufacturing Co., Ltd.
- Hayato Katsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB structure and electronic device including the same
- Patent number 11,483,935
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Hwajoong Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable mounting board
- Patent number 11,212,915
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Hayato Katsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding member, method for manufacturing bonding member, and bondin...
- Patent number 10,625,376
- Issue date Apr 21, 2020
- MURATA MANUFACTURING CO., LTD.
- Seitaro Washizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder columns and methods for making same
- Patent number 10,477,698
- Issue date Nov 12, 2019
- TOPLINE CORPORATION
- Martin B. Hart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for resin flux cored solder, flux for flux coated solder, resi...
- Patent number 10,265,808
- Issue date Apr 23, 2019
- Senju Metal Industry Co., Ltd.
- Motohiro Onitsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with internal wire fence shielding
- Patent number 10,021,790
- Issue date Jul 10, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering system
- Patent number 9,837,559
- Issue date Dec 5, 2017
- China Sunergy (Nanjing) Co. Ltd.
- Jun Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component to circuit board
- Patent number 9,807,889
- Issue date Oct 31, 2017
- Osaka University
- Kozo Fujimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Layered solder material for bonding different species of electrodes...
- Patent number 9,669,493
- Issue date Jun 6, 2017
- Senju Metal Industry Co., Ltd.
- Koji Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,572,256
- Issue date Feb 14, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar contact with solder
- Patent number 9,155,200
- Issue date Oct 6, 2015
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding of electronic components
- Patent number 8,882,301
- Issue date Nov 11, 2014
- Nanofoil Corporation
- David Van Heerden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 8,800,137
- Issue date Aug 12, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump formation on a circuit board using a transfer sheet
- Patent number 8,701,973
- Issue date Apr 22, 2014
- Senju Metal Industry Co., Ltd.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preventing void formation in a solder joint
- Patent number 8,678,271
- Issue date Mar 25, 2014
- GLOBALFOUNDRIES Inc.
- Phanit Tameerug
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar contact with solder
- Patent number 8,497,429
- Issue date Jul 30, 2013
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for laser soldering
- Patent number 8,269,140
- Issue date Sep 18, 2012
- Japan Unix Co., Ltd.
- Kotaro Matsushita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat radiator and power module
- Patent number 8,198,539
- Issue date Jun 12, 2012
- Kabushiki Kaisha Toyota Jidoshokki
- Kota Otoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module substrate, method for manufacturing power module subst...
- Patent number 8,044,500
- Issue date Oct 25, 2011
- Mitsubishi Materials Corporation
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 7,888,173
- Issue date Feb 15, 2011
- Fuji Electric Device Technology Co., Ltd.
- Harutaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder foil, semiconductor device and electronic device
- Patent number 7,722,962
- Issue date May 25, 2010
- Renesas Technology Corp.
- Tasao Soga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,511,228
- Issue date Mar 31, 2009
- Schmartboard, Inc.
- Andrew Yaung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing means of connecting and/or soldering a component
- Patent number 7,509,733
- Issue date Mar 31, 2009
- Commissariat a l'Energie Atomique
- Francçis Marion
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanostructured soldered or brazed joints made with reactive multila...
- Patent number 7,361,412
- Issue date Apr 22, 2008
- Johns Hopkins University
- Jiaping Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of retaining a solder mass on an article
- Patent number 7,189,083
- Issue date Mar 13, 2007
- Interplex Nas, Inc,
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reactive multilayer foil with conductive and nonconductive final pr...
- Patent number 6,991,855
- Issue date Jan 31, 2006
- Johns Hopkins University
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making and using freestanding reactive multilayer foils
- Patent number 6,991,856
- Issue date Jan 31, 2006
- Johns Hopkins University
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME
- Publication number 20240090137
- Publication date Mar 14, 2024
- SKC CO., LTD.
- Il Hwan YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE MOUNTING BOARD
- Publication number 20220078904
- Publication date Mar 10, 2022
- Murata Manufacturing Co., Ltd.
- Hayato Katsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20210251083
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Hwajoong JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE MOUNTING BOARD
- Publication number 20210045236
- Publication date Feb 11, 2021
- Murata Manufacturing Co., Ltd.
- Hayato Katsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE WITH INTERNAL WIRE FENCE SHIELDING
- Publication number 20170251576
- Publication date Aug 31, 2017
- Avago Technologies General IP (Singapore) PTE. LTD.
- Jin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METH...
- Publication number 20150314396
- Publication date Nov 5, 2015
- SENJU METAL INDUSTRY CO., LTD
- Koji WATANABE
- B32 - LAYERED PRODUCTS
Information Patent Application
RADIO FREQUENCY TRANSISTOR AND MATCHING CIRCUIT GROUNDING AND THERM...
- Publication number 20140378072
- Publication date Dec 25, 2014
- John M. Waldvogel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
- Publication number 20140328039
- Publication date Nov 6, 2014
- Paul J. Koep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140317919
- Publication date Oct 30, 2014
- Samsung Electro-mechanics Co., Ltd.
- Jin Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284090
- Publication date Sep 25, 2014
- ECOCERA OPTRONICS CO., LTD.
- Cheng-Feng Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPR...
- Publication number 20140234649
- Publication date Aug 21, 2014
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOIN...
- Publication number 20140029224
- Publication date Jan 30, 2014
- SENJU METAL INDUSTRY CO., LTD.
- Kozo FUJIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Planar Contact with Solder
- Publication number 20130283608
- Publication date Oct 31, 2013
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...
- Publication number 20120261174
- Publication date Oct 18, 2012
- Toshiaki Chuma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...
- Publication number 20120214010
- Publication date Aug 23, 2012
- Tomohiro Kagimoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND...
- Publication number 20120183781
- Publication date Jul 19, 2012
- SUMITOMO BAKELITE CO., LTD.
- Toshiaki Chuma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR FORMING CIRCUIT PATTERNS ON SURFACE OF SUBSTRATE
- Publication number 20110318886
- Publication date Dec 29, 2011
- NATIONAL PINGTUNG UNIVERSITY OF SCIENCE & TECHNOLOGY
- LUNG-CHUAN TSAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USI...
- Publication number 20110311790
- Publication date Dec 22, 2011
- SUMITOMO BAKELITE CO., LTD.
- Wataru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET
- Publication number 20110297433
- Publication date Dec 8, 2011
- SENJU METAL INDUSTRY CO., LTD.
- Takeo Kuramoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20110126409
- Publication date Jun 2, 2011
- Jin Su KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
- Publication number 20110089462
- Publication date Apr 21, 2011
- David Van Heerden
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PLANAR CONTACT WITH SOLDER
- Publication number 20100236815
- Publication date Sep 23, 2010
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR LASER SOLDERING
- Publication number 20090321394
- Publication date Dec 31, 2009
- Japan Unix Co., Ltd.
- Kotaro MATSUSHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light emission device
- Publication number 20090315064
- Publication date Dec 24, 2009
- Chih-Yang Wang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING POWER MODULE SUBST...
- Publication number 20090267215
- Publication date Oct 29, 2009
- MITSUBISHI MATERIALS CORPORATION
- Takeshi Kitahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20090246910
- Publication date Oct 1, 2009
- Fuji Electric Device Technology Co., LTD.
- Harutaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE AND POWER MODULE
- Publication number 20090200065
- Publication date Aug 13, 2009
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Kota Otoshi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Reactive Multilayer Joining With Improved Metallization Techniques
- Publication number 20090186195
- Publication date Jul 23, 2009
- Reactive NanoTechnologies, Inc
- Ronald L. Spraker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW TEMPERATURE REACTIVE COMPOSITE JOINING
- Publication number 20090035542
- Publication date Feb 5, 2009
- Timothy P. Weihs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preventing void formation in a solder joint
- Publication number 20090001138
- Publication date Jan 1, 2009
- Advanced Micro Devices, Inc.
- Phanit Tameerug
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Solder foil, tape or wire

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sleeve soldering device and method of producing electronic device

Stretchable mounting board

PCB structure and electronic device including the same

Stretchable mounting board

Lead free solder columns and methods for making same

Bonding member, method for manufacturing bonding member, and bondin...

Solder columns and methods for making same

Flux for resin flux cored solder, flux for flux coated solder, resi...

Module with internal wire fence shielding

Soldering system

Method of mounting electronic component to circuit board

Layered solder material for bonding different species of electrodes...

Printed wiring board, method for manufacturing printed wiring board...

Planar contact with solder

Method for low temperature bonding of electronic components

Method of manufacturing printed circuit board

Solder bump formation on a circuit board using a transfer sheet

Method for preventing void formation in a solder joint

Planar contact with solder

Method and apparatus for laser soldering

Heat radiator and power module

Power module substrate, method for manufacturing power module subst...

Semiconductor device manufacturing method

Solder foil, semiconductor device and electronic device

Printed circuit board

Method for producing means of connecting and/or soldering a component

Nanostructured soldered or brazed joints made with reactive multila...

Method of retaining a solder mass on an article

Reactive multilayer foil with conductive and nonconductive final pr...

Methods of making and using freestanding reactive multilayer foils

Patents Applicationslast 30 patents

SURFACE-TREATED COPPER FOIL AND CIRCUIT BOARD COMPRISING SAME

STRETCHABLE MOUNTING BOARD

PCB STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

STRETCHABLE MOUNTING BOARD

MODULE WITH INTERNAL WIRE FENCE SHIELDING

LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METH...

RADIO FREQUENCY TRANSISTOR AND MATCHING CIRCUIT GROUNDING AND THERM...

SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

THIN FILM SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

LAYERED COMPOSITE OF A SUBSTRATE FILM AND OF A LAYER ASSEMBLY COMPR...

METHOD OF MOUNTING ELECTRONIC COMPONENT, CIRCUIT BOARD, SOLDER JOIN...

Planar Contact with Solder

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS...

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND...

METHOD FOR FORMING CIRCUIT PATTERNS ON SURFACE OF SUBSTRATE

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USI...

SOLDER BUMP FORMATION ON A CIRCUIT BOARD USING A TRANSFER SHEET

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS

PLANAR CONTACT WITH SOLDER

METHOD AND APPARATUS FOR LASER SOLDERING

Light emission device

POWER MODULE SUBSTRATE, METHOD FOR MANUFACTURING POWER MODULE SUBST...

Semiconductor device manufacturing method

HEAT DISSIPATION DEVICE AND POWER MODULE

Reactive Multilayer Joining With Improved Metallization Techniques

LOW TEMPERATURE REACTIVE COMPOSITE JOINING

Method for preventing void formation in a solder joint