Solder preforms in the shape of solder balls

Industry

CPC
H05K2203/041

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/041Solder preforms in the shape of solder balls

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,120,818
- Issue date Oct 15, 2024
- LG Innotek Co., Ltd
- Myung Gu Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,990,386
- Issue date May 21, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal composition, intermetallic compound member and joined body
- Patent number 11,746,398
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Masumi Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball feeding device
- Patent number 11,618,094
- Issue date Apr 4, 2023
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and heat distribution devices for thermal management of chi...
- Patent number 11,600,548
- Issue date Mar 7, 2023
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 11,528,809
- Issue date Dec 13, 2022
- Tahoe Research, LTD.
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processor and chipset continuity testing of package interconnect fo...
- Patent number 11,486,942
- Issue date Nov 1, 2022
- Intel Corporation
- Matthew Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch sensor module and image display device comprising same
- Patent number 11,445,615
- Issue date Sep 13, 2022
- Dongwoo Fine-Chem Co., Ltd.
- Jun-Ha Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reversible electronic card and method of implementation thereof
- Patent number 11,350,526
- Issue date May 31, 2022
- GE Aviation Systems, LLC
- Jeffrey A. VanDorp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board-to-board connecting structure and method for manufacturing th...
- Patent number 11,310,922
- Issue date Apr 19, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency module, board equipped with antenna, and high freque...
- Patent number 11,284,506
- Issue date Mar 22, 2022
- Murata Manufacturing Co., Ltd.
- Hideki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor package with cantilever pads
- Patent number 11,270,894
- Issue date Mar 8, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus with embedded fine line space in a cavity, and a method f...
- Patent number 11,272,619
- Issue date Mar 8, 2022
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preparation of solder bump for compatibility with printed electroni...
- Patent number 11,122,692
- Issue date Sep 14, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 11,088,064
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,089,679
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Shunsuke Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processor and chipset continuity testing of package interconnect fo...
- Patent number 11,022,657
- Issue date Jun 1, 2021
- Intel Corporation
- Matthew Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,980,134
- Issue date Apr 13, 2021
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency module, board equipped with antenna, and high freque...
- Patent number 10,925,149
- Issue date Feb 16, 2021
- Murata Manufacturing Co., Ltd.
- Hideki Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an electronic component mounted on a s...
- Patent number 10,897,822
- Issue date Jan 19, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structures and methods of fabricating the same
- Patent number 10,798,828
- Issue date Oct 6, 2020
- NAN YA PRINTED CIRCUIT BORED CORPORATION
- Hsien-Chieh Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball, solder joint, and joining method
- Patent number 10,780,530
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Hiroki Oshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic device, and wiring board manufacturing method
- Patent number 10,770,386
- Issue date Sep 8, 2020
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Toshiki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a chip component
- Patent number 10,763,016
- Issue date Sep 1, 2020
- Rohm Co., Ltd.
- Hiroshi Tamagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electronic component mounting substrate, and...
- Patent number 10,753,551
- Issue date Aug 25, 2020
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Toshiaki Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20240347414
- Publication date Oct 17, 2024
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM ASSEMBLY
- Publication number 20240341041
- Publication date Oct 10, 2024
- EPIRUS, INC.
- Meletios Mastrodemos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237202
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240179829
- Publication date May 30, 2024
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY
- Publication number 20240147619
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Jongwan SHIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138059
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF
- Publication number 20240057256
- Publication date Feb 15, 2024
- JCET GROUP CO., LTD.
- Yaojian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D GLASS MODULES
- Publication number 20230413422
- Publication date Dec 21, 2023
- ELECTRONIC DESIGN & DEVELOPMENT, CORP.
- Sergio E. Cardona
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...
- Publication number 20230371180
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Yohan MOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230156915
- Publication date May 18, 2023
- LG Innotek Co., Ltd.
- Myung Gu KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...
- Publication number 20230147650
- Publication date May 11, 2023
- TSE CO., LTD.
- Byeong Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20230112097
- Publication date Apr 13, 2023
- Tahoe Research, Ltd.
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH A CONTACT POINT
- Publication number 20230105384
- Publication date Apr 6, 2023
- Knorr-Bremse Systeme fuer Nutzfahrzeuge GmbH
- Markus Deeg
- B60 - VEHICLES IN GENERAL
Information Patent Application
CONNECTOR
- Publication number 20230059627
- Publication date Feb 23, 2023
- STMicroelectronics (Grenoble 2) SAS
- Justin CATANIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220338348
- Publication date Oct 20, 2022
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHOD F...
- Publication number 20220183157
- Publication date Jun 9, 2022
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STEPPED PACKAGE AND RECESSED CIRCUIT BOARD
- Publication number 20220110214
- Publication date Apr 7, 2022
- Intel Corporation
- Martin M. Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...
- Publication number 20220061167
- Publication date Feb 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- RUI-WU LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...
- Publication number 20210400820
- Publication date Dec 23, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods And Heat Distribution Devices For Thermal Management Of Chi...
- Publication number 20210378106
- Publication date Dec 2, 2021
- Google LLC
- Madhusudan K. Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...
- Publication number 20210337674
- Publication date Oct 28, 2021
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
AN APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHO...
- Publication number 20210307172
- Publication date Sep 30, 2021
- Intel Corporation
- Kristof Darmawikarta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Touch Sensor Module and Image Display Device Comprising Same
- Publication number 20210289635
- Publication date Sep 16, 2021
- DONGWOO FINE-CHEM CO., LTD.
- Jun-Ha Kim
- G06 - COMPUTING CALCULATING COUNTING

Solder preforms in the shape of solder balls

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Method for soldering an electronic component to a circuit board by...

Methods and heat distribution devices for thermal management of chi...

Vacuum-assisted BGA joint formation

Metal composition, intermetallic compound member and joined body

Solder ball feeding device

Circuit board and method for manufacturing the same

Methods and heat distribution devices for thermal management of chi...

Method for orienting solder balls on a BGA device

Processor and chipset continuity testing of package interconnect fo...

Touch sensor module and image display device comprising same

Reversible electronic card and method of implementation thereof

Board-to-board connecting structure and method for manufacturing th...

High frequency module, board equipped with antenna, and high freque...

Manufacturing method for semiconductor package with cantilever pads

Apparatus with embedded fine line space in a cavity, and a method f...

Preparation of solder bump for compatibility with printed electroni...

Fine pitch copper pillar package and method

Printed wiring board and method for manufacturing printed wiring board

Method for producing an electric circuit comprising a circuit carri...

Processor and chipset continuity testing of package interconnect fo...

Method for orienting solder balls on a BGA device

High frequency module, board equipped with antenna, and high freque...

Electronic device comprising an electronic component mounted on a s...

Tall and fine pitch interconnects

Circuit board structures and methods of fabricating the same

Solder ball, solder joint, and joining method

Wiring board, electronic device, and wiring board manufacturing method

Method of manufacturing a chip component

Electronic component, electronic component mounting substrate, and...

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

Lead-Free Solder Ball

Methods And Heat Distribution Devices For Thermal Management Of Chi...

ELECTRONIC SYSTEM ASSEMBLY

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE CONNECTED ON BASIS OF SOLDER BALL AND ELASTIC BODY

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH INDUCTOR, AND MANUFACTURING METHOD THEREOF

3D GLASS MODULES

DOUBLE-SIDED ARRANGEMENT TYPE ELECTRONIC COMPONENT MODULE AND ELECT...

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

PRINTED CIRCUIT BOARD WITH A CONTACT POINT

CONNECTOR

Method for Soldering an Electronic Component to a Circuit Board by...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHOD F...

STEPPED PACKAGE AND RECESSED CIRCUIT BOARD

BOARD-TO-BOARD CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING TH...

PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...

Methods And Heat Distribution Devices For Thermal Management Of Chi...

ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...

AN APPARATUS WITH EMBEDDED FINE LINE SPACE IN A CAVITY, AND A METHO...

Touch Sensor Module and Image Display Device Comprising Same